Nexperia USA Inc. PMN27UP,115

Overview

PMN27UP from Nexperia is a P-channel enhancement-mode Trench MOSFET in SOT457 (TSOP6) package, rated for −20 V drain-source voltage, −5.7 A continuous drain current at 25 °C, and 27 mΩ typical R_DS(on) at V_GS = −4.5 V and I_D = −2.4 A. It serves as a high-side load switch or high-speed line driver in compact power management circuits.

For engineers reviewing the PMN27UP datasheet, PMN27UP pinout, PMN27UP application, or PMN27UP equivalent, this page delivers verified electrical parameters, thermal performance data, gate charge characteristics, junction temperature derating curves, and real-world switching timing values - all confirmed from Nexperia's official Rev. 1 product data sheet dated 13 July 2011.

Technical Context

This device uses Trench MOSFET technology to achieve low on-resistance and fast switching with gate threshold voltage of −0.7 V (typical), enabling reliable turn-on from 1.8 V logic-level drive. Its −20 V V_DS rating and −8 V maximum gate-source voltage support robust operation in 3.3 V and 5 V rail systems.

The six-pin SOT457 package integrates four parallel drain terminals (pins 1, 2, 5, 6), one gate (pin 3), and one source (pin 4), optimizing thermal conduction and current handling. Dynamic parameters include 21 nC total gate charge, 2.8 nC gate-drain charge, and 27 ns fall time - confirming suitability for high-frequency switching up to several hundred kHz.

Key Specifications

Pinout & Package

SOT457 (TSOP6) plastic surface-mounted package with 6 leads; dimensions per IEC/JEDEC SC-74 outline: 3.1 mm × 2.7 mm × 1.1 mm, featuring exposed drain paddle for enhanced thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Compared with DMN2053UFB-7 and SI2301BDS-T1-BE3, PMN27UP offers superior thermal performance via quad-drain SOT457 packaging, 2× lower R_DS(on) than SI2301BDS, and 30% higher current rating than DMN2053UFB - making it optimal for 5 A-class high-side switching where reliability and PCB heat spreading matter.

Availability

PMN27UP is available at Aetrix Electronics and suitable for high-side load switching, relay driving, high-speed line driving, and compact DC-DC power circuits requiring stable component supply across production lifecycles.

Supply support for PMN27UP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, serving automotive, industrial, and consumer markets with ISO/TS 16949-certified manufacturing.

The PMN27UP belongs to Nexperia's TrenchMOS P-channel portfolio designed specifically for logic-level–driven high-side power switches in space-constrained, thermally demanding applications such as portable instrumentation and smart sensors.

FAQ

What is the maximum allowable junction temperature for PMN27UP?

The absolute maximum junction temperature is 150 °C per Nexperia's datasheet Rev. 1. Operation above this limit causes permanent degradation of R_DS(on) and gate oxide integrity. Derating begins at 25 °C ambient: total power dissipation drops from 1385 mW (with 6 cm² drain pad) to 540 mW at 100 °C ambient, requiring thermal design validation using Fig 1 and Fig 2.

Can PMN27UP be driven directly by a 1.8 V GPIO output?

Yes - its gate threshold voltage is −0.7 V (typical), and R_DS(on) remains 57–66 mΩ at V_GS = −1.8 V, enabling functional on-state operation. However, full enhancement (27 mΩ) requires ≥−4.5 V; for minimal conduction loss, use a charge pump or dual-rail driver when 1.8 V logic must deliver <100 mΩ performance.

How does the quad-drain pinning affect PCB layout and thermal performance?

Pins 1, 2, 5, and 6 are internally shorted to the drain, allowing connection to a large copper pour for heat sinking. This configuration reduces effective thermal resistance from junction-to-ambient to 78 K/W (with 6 cm² pad), versus >200 K/W for standard SOT-23. Layout must route all four pins to the same net and avoid thermal isolation gaps in the drain copper.

Is PMN27UP suitable for automotive applications?

No - the datasheet explicitly states this is a non-automotive qualified product. It lacks AEC-Q101 stress testing, automotive-grade process controls, and extended temperature validation beyond −55 °C to +150 °C. For automotive high-side switching, consider Nexperia's AS-series equivalents like PMN27EN, which undergo full AEC-Q101 qualification.