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Nexperia USA Inc. PMPB08R6ENX

Part No.:
PMPB08R6ENX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixPMPB08R6ENX.pdf
Description:
MOSFET N-CH 30V 11A DFN2020M-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:17,978

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Product details

Overview

PMPB08R6ENX from Nexperia is a 30 V, N-channel Trench MOSFET in DFN2020M-6 (SOT1220-2) package, designed as a logic-level-compatible low-side load switch with RDS(on) = 8.6 mΩ at VGS = 10 V and ID = 11 A (Tj = 25 °C), optimized for high-speed switching in space-constrained PCBs.

For engineers reviewing the PMPB08R6ENX datasheet, PMPB08R6ENX pinout, PMPB08R6ENX application, or PMPB08R6ENX equivalent, this device serves as a thermally enhanced, ultra-thin SMD power switch for relay drivers, line drivers, and compact DC-DC load control where drain-source on-resistance, fast switching (tr = 10 ns), and FR4-mountable thermal performance are critical selection criteria.

Technical Context

This MOSFET employs Trench Superjunction Technology to achieve low RDS(on) and high transconductance (gfs = 34 S), enabling efficient conduction and rapid gate-driven transitions. Its exposed drain pad and 6 cm² mounting pad reduce Rth(j-sp) to 6–10 K/W, supporting continuous ID = 11 A at Tamb = 25 °C.

The device features a gate threshold voltage of 1.0–2.0 V (VGS(th)), ensuring reliable turn-on with 3.3 V or 5 V logic, and integrates a source-drain diode with VSD = 0.75–1.2 V at IS = 1.9 A, suitable for freewheeling in inductive loads without external diodes.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V - Maximum blocking voltage for 24 V rail switching and transient-tolerant low-voltage power paths
RDS(on) 8.6 mΩ @ VGS = 10 V, ID = 11 A, Tj = 25 °C - Enables <100 mW conduction loss at 11 A, minimizing thermal rise on FR4
QG(tot) 13.7–20.6 nC - Low total gate charge supports efficient 1 MHz+ PWM drive with minimal gate driver power
tr/tf 10 ns / 9 ns @ VDS = 15 V, ID = 5 A, RG(ext) = 6 Ω - Supports clean edge transitions in high-frequency load switching
ID (continuous) 11 A @ Tamb = 25 °C, FR4 PCB, 6 cm² drain pad - Delivers robust current handling in thermally constrained layouts
Ciss 840 pF - Predictable input capacitance simplifies gate drive loop stability analysis

Pinout & Package

DFN2020M-6 (SOT1220-2) is a leadless, ultra-thin (0.65 mm height), thermally enhanced plastic package with an exposed drain pad occupying pins 1, 2, 5, 6, and 7; body dimensions 2.0 × 2.0 × 0.65 mm.

Pin/Terminal Circuit Role Design Meaning
1, 2, 5, 6, 7 Drain (D) Common high-current output node; electrically and thermally tied to exposed copper pad for low-inductance, high-power routing
3 Gate (G) Control input requiring ≤20 V swing; low Ciss enables fast, low-power switching with standard logic drivers
4, 8 Source (S) Reference return path for load current; dual terminals reduce bond-wire inductance and improve current sharing

Key Features

Feature Design Value
Logic-level gate drive VGS(th) = 1.0–2.0 V ensures full enhancement with 3.3 V microcontroller outputs, eliminating level-shifting circuitry
Exposed drain thermal pad Rth(j-sp) = 6–10 K/W enables 12.5 W dissipation at solder point, supporting high-duty-cycle operation on standard FR4
Trench Superjunction architecture Combines low RDS(on) and high gfs to minimize both conduction and switching losses in DC-DC and motor drive stages
Ultra-compact footprint 2 × 2 mm body with no leads reduces PCB area by >50% vs. SO-8, ideal for wearables and dense power modules

Applications

Relay Driver High-Speed Line Driver

Use Scenario: Driving electromagnetic relays in industrial PLC I/O modules with 24 V supply and fast cycle times.

IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current; handles repetitive 100 ms on/off cycles with minimal self-heating.

Use Value: 8.6 mΩ RDS(on) limits coil power loss to <250 mW at 11 A, eliminating heatsinks while maintaining >100 k-cycle relay life.

Use Scenario: Transmitting TTL/CMOS signals across 50 Ω transmission lines in test equipment and FPGA interconnects.

IC Role / Device Role / Timing Role: Active pull-down element in push-pull line driver stage; switches at >10 MHz with sub-10 ns edges.

Use Value: 10 ns rise time and 840 pF Ciss ensure signal integrity up to 100 Mbps without overshoot or ringing on controlled-impedance traces.

Low-Side Load Switch Switching Power Supply

Use Scenario: Enabling/disabling 5 V or 12 V subsystems (e.g., sensors, displays) in battery-powered IoT nodes.

IC Role / Device Role / Timing Role: Controlled power path switch with integrated reverse polarity protection via source-drain diode.

Use Value: 1.9 A source current rating and 0.75 V VSD allow safe inrush limiting and fault current clamping without external diodes.

Use Scenario: Synchronous rectification in buck converters for portable medical devices operating from single-cell Li-ion.

IC Role / Device Role / Timing Role: Secondary-side power FET replacing Schottky diode; commutated at 500 kHz–1 MHz.

Use Value: 13.7 nC QG(tot) and 10.5 mΩ RDS(on) @ 4.5 V enable >92% efficiency at 3 A output with minimal gate drive loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-side switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004LK-7 RDS(on) = 12.5 mΩ @ 4.5 V; larger 2.1 × 2.0 mm TSOP-6 package; higher QG = 22 nC Lower gate drive efficiency at 3.3 V; less suitable for high-frequency (>500 kHz) switching due to slower tr Select when board layout allows slightly larger footprint and gate drive voltage is ≥4.5 V
PSMN017-30YL RDS(on) = 1.7 mΩ @ 10 V but in larger LFPAK56 (Power-SO8); 3× higher thermal mass Superior power handling (40 A continuous) but incompatible with 2 × 2 mm space constraints Select only when >25 A current or >2 W dissipation is required and PCB real estate permits

Compared with DMN2004LK-7 and PSMN017-30YL, PMPB08R6ENX delivers optimal balance of ultra-small size, 3.3 V logic compatibility, and 11 A capability-making it uniquely suited for miniaturized, high-efficiency load switching where thermal pad integration and fast edge rates are prioritized over raw current headroom.

Availability

PMPB08R6ENX is available at Aetrix Electronics and suitable for relay drivers, high-speed line drivers, low-side load switches, and synchronous buck converter applications requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for PMPB08R6ENX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

This MOSFET belongs to Nexperia's TrenchMOS® logic-level portfolio, engineered specifically for space-constrained, thermally demanding power management in consumer, industrial, and communications equipment.

FAQ

What is the maximum continuous drain current for PMPB08R6ENX under standard PCB conditions?

The maximum continuous drain current is 11 A at Tamb = 25 °C when mounted on an FR4 PCB with a 6 cm² tin-plated copper drain pad. At 100 °C ambient, derated current drops to 7 A per datasheet Table 5; thermal design must account for Rth(j-a) = 57–66 K/W in that configuration.

Can PMPB08R6ENX be driven directly from a 3.3 V microcontroller GPIO?

Yes. With VGS(th) = 1.0–2.0 V and guaranteed RDS(on) ≤ 14 mΩ at VGS = 4.5 V, the device fully enhances at 3.3 V, delivering ≤200 mΩ on-resistance at low current and supporting reliable switching up to ~5 A in typical applications without gate boosting.

Is the exposed drain pad electrically isolated from the package substrate?

No. Pins 1, 2, 5, 6, and 7-and the entire exposed bottom copper pad-are internally connected to the drain terminal. This requires careful PCB layout: the drain pad must be routed to the high-side power net and thermally coupled to a dedicated copper pour, not grounded or floating.

What is the peak pulsed drain current rating, and under what conditions is it valid?

The peak pulsed drain current is 44 A, specified for a single pulse with duration ≤10 µs at Tamb = 25 °C. This rating assumes junction temperature remains within safe limits during the pulse; actual usable peak current depends on prior thermal history and PCB thermal mass, as shown in Figure 3's SOA curves.

PMPB08R6ENX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
TrenchMOS™
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
11A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
10.5mOhm @ 11A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
20.6 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
840 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
1.9W (Ta), 12.5W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2020MD-6

PMPB08R6ENX FAQ

1.How can I place an order for PMPB08R6ENX through Aetrix?

Please submit a Request for Quotation (RFQ) for PMPB08R6ENX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMPB08R6ENX reliable?

The price and inventory of PMPB08R6ENX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMPB08R6ENX is usually 5 days.

3.What payment methods are accepted for PMPB08R6ENX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMPB08R6ENX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMPB08R6ENX?

PMPB08R6ENX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMPB08R6ENX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMPB08R6ENX?

For technical support, including PMPB08R6ENX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMPB08R6ENX requirements.

6.How does Aetrix verify that PMPB08R6ENX is sourced from the original manufacturer or authorized distributors?

All PMPB08R6ENX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMPB08R6ENX meets industry standards.

7.What is the process for return or replacement of PMPB08R6ENX?

All PMPB08R6ENX units undergo pre-shipment inspection (PSI). If there is an issue with PMPB08R6ENX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMPB08R6ENX part is unused and in its original packaging.

Return procedure for PMPB08R6ENX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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