My Inquiry
My Account
Nexperia USA Inc. PMPB30XPEX
- Part No.:
- PMPB30XPEX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
PMPB30XPEX.pdf
- Description:
- PMPB30XPE/SOT1220/SOT1220
- Quantity:
- Payment:
- Shipping:
Inventory:2,938
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMPB30XPE from Nexperia is a P-channel enhancement-mode Trench MOSFET in a DFN2020MD-6 (SOT1220) package, rated for -20 V drain-source voltage, 29 mΩ RDS(on) at VGS = -4.5 V and Tj = 25 °C, and -8.5 A continuous drain current. It serves as a high-side load switch or relay driver in compact power management circuits operating up to 175 °C junction temperature.
For engineers reviewing the PMPB30XPE datasheet, PMPB30XPE pinout, PMPB30XPE application, or PMPB30XPE equivalent, key selection criteria include its ultra-thin 2 × 2 × 0.65 mm leadless thermal-enhanced package, -1.0 V typical gate threshold voltage, ESD protection >2 kV HBM, and validated performance under high-temperature ambient conditions (Tamb ≤ 175 °C).
Technical Context
This device uses Trench MOSFET technology to achieve low on-resistance and fast switching with 12.5 nC total gate charge and 48 ns rise time. Its symmetrical drain-terminal layout (pins 1,2,5,6,7) supports high-current PCB routing and thermal spreading across a 6 cm² copper pad.
The integrated source-drain diode exhibits -0.8 V forward voltage at -2.1 A, enabling bidirectional current handling in certain switching topologies. Thermal resistance from junction to solder point is as low as 5 K/W, confirming suitability for thermally constrained space-limited applications without heatsinks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -20 V - Maximum blocking voltage for high-side switch configurations in 12 V automotive or industrial rails. |
| RDS(on) | 29 mΩ @ VGS = -4.5 V, ID = -6.2 A, Tj = 25 °C - Enables <180 mW conduction loss at 6.2 A, critical for efficiency in battery-powered systems. |
| ID (cont) | -8.5 A @ VGS = -4.5 V, Tamb = 25 °C, t ≤ 5 s - Supports pulsed loads such as solenoid or motor startup without derating. |
| VGS(th) | -1.0 V typ @ ID = -250 µA - Ensures reliable turn-on with standard 3.3 V or 5 V logic-level gate drive. |
| QG(tot) | 12.5 nC - Low gate charge enables fast switching with minimal driver power consumption and reduced switching losses. |
| Tj(max) | 175 °C - Rated for under-hood or enclosed industrial environments where ambient exceeds 100 °C. |
| Rth(j-sp) | 5 K/W - Confirms effective heat transfer to PCB via solder points, enabling high-power density layout. |
Pinout & Package
DFN2020MD-6 (SOT1220) is a 2 mm × 2 mm × 0.65 mm leadless, thermally enhanced surface-mount package with exposed drain terminals on five sides for optimal PCB thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6, 7 | Drain (D) | Five parallel drain terminals provide low-inductance, high-current path and direct thermal coupling to PCB copper pour. |
| 3 | Gate (G) | Single gate input with 11 Ω internal gate resistance; compatible with standard logic-level drivers without external gate resistor. |
| 4, 8 | Source (S) | Two source terminals enable balanced current return and reduce loop inductance in high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Thermal robustness | Junction temperature rating of 175 °C ensures stable operation in sealed enclosures or near heat sources. |
| Optical solder inspection support | Tin-plated 100 % solderable side pads allow automated optical inspection (AOI) without X-ray. |
| Low-profile packaging | 0.65 mm height enables use in ultra-thin consumer or portable electronics where Z-height is constrained. |
| ESD resilience | Human Body Model (HBM) rating >2 kV reduces risk of gate oxide damage during board assembly and handling. |
| High-current capability | Peak drain current of -25 A (10 µs pulse) supports short-duration surge loads like inrush limiting. |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
Use Scenario: Driving electromagnetic relays in programmable logic controllers (PLCs) with 12–24 V DC coils. IC Role / Device Role / Timing Role: High-side switch controlling coil energization/de-energization with fast turn-off to suppress back-EMF. Use Value: Low RDS(on) minimizes self-heating during sustained coil hold; 175 °C rating allows operation in hot control cabinets. |
Use Scenario: Transmitting digital signals over 50 Ω coaxial or twisted-pair lines in test equipment or data acquisition modules. IC Role / Device Role / Timing Role: Active termination switch enabling dynamic impedance matching and signal integrity control. Use Value: 43 ns turn-off delay and 22 ns fall time ensure clean edge transitions up to 10 MHz signaling rates. |
| High-Side Load Switch | Switching Power Supply Sync Rectifier |
Use Scenario: Enabling/disabling power to subsystems (e.g., sensors, displays) in battery-powered IoT nodes. IC Role / Device Role / Timing Role: Controlled high-side FET providing load isolation, inrush limiting, and reverse polarity protection. Use Value: -1.0 V VGS(th) guarantees full enhancement with 3.3 V microcontroller GPIO; low leakage (<1 µA) preserves battery life. |
Use Scenario: Replacing Schottky diodes in synchronous buck converters for 5–12 V output stages. IC Role / Device Role / Timing Role: Low-loss synchronous rectifier operating in phase with PWM controller to reduce conduction loss. Use Value: 29 mΩ RDS(on) cuts conduction loss by >60 % vs. typical 0.4 V Schottky, improving efficiency at 5–10 A loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel high-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG2305UVT-7 | RDS(on) = 45 mΩ @ VGS = -4.5 V; smaller 1.6 × 1.6 mm package; no side-pad AOI support. | Limited thermal dissipation (Rth(j-a) = 150 K/W); unsuitable for >3 A continuous loads without forced cooling. | Select when board area is tighter than thermal demand; verify PCB copper area meets 3 A steady-state requirement. |
| SI2301DDS-T1-BE3 | RDS(on) = 115 mΩ @ VGS = -2.5 V; SOT-23 package; higher gate charge (16 nC). | Lower peak current (2.6 A) and lower Tj(max) (150 °C); not rated for 175 °C ambient environments. | Choose only for cost-sensitive, low-power (<1 W) applications where thermal margin is ample and size is secondary. |
Compared with DMG2305UVT-7 and SI2301DDS-T1-BE3, PMPB30XPE delivers superior thermal performance and lower conduction loss in high-current, high-temperature scenarios-making it the preferred choice for industrial PLC outputs and battery-powered high-side switches requiring long-term reliability.
Availability
PMPB30XPE is available at Aetrix Electronics and suitable for relay driver circuits, high-side load switching, high-speed line driving, and synchronous rectification requiring stable component supply across production lifecycles.
Supply support for PMPB30XPE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.
The PMPB30XPE belongs to Nexperia's TrenchMOS portfolio, engineered specifically for space-constrained, thermally demanding power switching applications in industrial automation and portable electronics.
FAQ
What is the maximum continuous drain current for PMPB30XPE at 100 °C ambient temperature?
The maximum continuous drain current is -3.9 A at Tamb = 100 °C with VGS = -4.5 V, as specified in Table 5 (Limiting values). This reflects thermal derating due to reduced heat dissipation at elevated ambient temperatures on a standard FR4 PCB with 6 cm² drain pad.
Can PMPB30XPE be used with 3.3 V logic-level gate drive?
Yes. With a typical gate threshold voltage of -1.0 V and guaranteed turn-on down to -0.75 V, PMPB30XPE fully enhances using 3.3 V logic (VGS ≈ -3.3 V), delivering 29 mΩ RDS(on) at -6.2 A and 25 °C junction temperature per Table 7.
Does PMPB30XPE require a gate resistor for safe operation?
No external gate resistor is required for basic switching. The device has an internal gate resistance of 11 Ω, and its 12.5 nC total gate charge allows direct drive from most microcontroller GPIOs. A small series resistor (≤10 Ω) may be added to damp ringing in high-dI/dt layouts.
How is thermal performance validated for PMPB30XPE on standard PCBs?
Thermal characteristics are measured per JEDEC JESD51 standards: Rth(j-sp) = 5 K/W is verified with a 6 cm² tin-plated copper pad for the drain terminals on single-sided FR4. Transient thermal impedance curves (Fig. 4–5) confirm performance under pulsed loads up to 100 ms.
PMPB30XPEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 34mOhm @ 6.2A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.25V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 4.5 V
- Vgs (Max):
- +8V, -12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1517 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2020MD-6
PMPB30XPEX FAQ
1.How can I place an order for PMPB30XPEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PMPB30XPEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMPB30XPEX reliable?
The price and inventory of PMPB30XPEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMPB30XPEX is usually 5 days.
3.What payment methods are accepted for PMPB30XPEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMPB30XPEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMPB30XPEX?
PMPB30XPEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMPB30XPEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMPB30XPEX?
For technical support, including PMPB30XPEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMPB30XPEX requirements.
6.How does Aetrix verify that PMPB30XPEX is sourced from the original manufacturer or authorized distributors?
All PMPB30XPEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMPB30XPEX meets industry standards.
7.What is the process for return or replacement of PMPB30XPEX?
All PMPB30XPEX units undergo pre-shipment inspection (PSI). If there is an issue with PMPB30XPEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMPB30XPEX part is unused and in its original packaging.
Return procedure for PMPB30XPEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMPB30XPEX Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
