Nexperia USA Inc. PMV65XP/MIR
- Part No.:
- PMV65XP/MIR
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
PMV65XP/MIR.pdf
- Description:
- MOSFET P-CH 20V 2.8A TO236AB
- Quantity:
- Payment:

- Shipping:

Inventory:8,286
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMV65XP from Nexperia is a single P-channel enhancement-mode Trench MOSFET in SOT23 (TO-236AB) package, designed for low-voltage load switching and battery management. It features −20 V drain-source voltage rating, 58 mΩ typical RDS(on) at VGS = −4.5 V and ID = −2.8 A, −0.65 V typical gate threshold voltage, and −4.3 A continuous drain current capability - enabling compact, efficient power control in portable DC/DC converters.
For engineers reviewing the PMV65XP datasheet, PMV65XP pinout, PMV65XP application, or PMV65XP equivalent, this device is selected for low-threshold, low-RDS(on) P-channel switching where space-constrained PCB layouts demand high performance per mm² in battery-powered systems.
Technical Context
This P-channel MOSFET employs Trench technology to achieve low on-resistance and fast switching with minimal gate charge (7.7 nC total). Its −0.47 V to −0.9 V VGS(th) range ensures reliable turn-on from standard 3.3 V or 5 V logic rails without level-shifting circuitry.
The device operates within −55 °C to 150 °C junction temperature range and delivers 4165 mW maximum power dissipation at solder-point (Tsp = 25 °C), supported by 25–30 K/W junction-to-solder-point thermal resistance - optimized for FR4 PCBs with standard or enhanced drain pad layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −20 V - Maximum blocking voltage for battery-side high-side switch configurations |
| RDS(on) | 58 mΩ (typ) at VGS = −4.5 V, ID = −2.8 A - Enables <100 mW conduction loss at 2.8 A load current |
| VGS(th) | −0.65 V (typ) - Ensures full enhancement with 3.3 V logic drive; no external gate pull-up required |
| ID | −4.3 A (max) at VGS = −4.5 V, Tsp = 25 °C - Supports moderate-power load switching in handheld devices |
| QG(tot) | 7.7 nC - Low gate charge enables fast switching with minimal driver strength requirement |
| Ciss | 744 pF - Input capacitance compatible with standard microcontroller GPIO drive capability |
| Tj Range | −55 °C to 150 °C - Qualified for industrial ambient and extended battery-operated equipment environments |
Pinout & Package
SOT23 (TO-236AB) surface-mount plastic package with 3 leads; 2.8 mm × 1.4 mm footprint; 1.1 mm height; drain-connected tab for thermal relief on PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control terminal; accepts −12 V to +12 V bias; low threshold enables direct MCU GPIO interface |
| 2 | S (Source) | Reference node for gate drive; tied to system VBAT in high-side load switch configuration |
| 3 | D (Drain) | Switched output node; internally connected to exposed drain pad for thermal conduction to PCB copper |
Key Features
| Feature | Design Value |
|---|---|
| Low threshold voltage | VGS(th) = −0.65 V (typ) - Eliminates need for gate driver IC in 3.3 V systems |
| Low RDS(on) | 58 mΩ @ −4.5 V - Reduces conduction loss and self-heating in portable battery paths |
| Trench MOSFET process | Optimized cell density and channel geometry - Delivers higher current density than planar P-channel alternatives |
| Thermal performance | Rth(j-sp) = 25 K/W - Enables >4 W power handling with standard FR4 layout and 6 cm² drain pad |
| Fast switching | td(off) = 135 ns, tf = 68 ns - Supports >1 MHz PWM operation in synchronous buck topologies |
Applications
| USB Power Delivery Switching | Smartphone Battery Protection |
|---|---|
|
Use Scenario: Bidirectional USB-C port power path control with overvoltage and reverse-current protection. IC Role / Device Role / Timing Role: High-side P-channel switch isolating VBUS from system rail during fault conditions. Use Value: −0.65 V VGS(th) allows direct control from USB PD controller GPIO; 58 mΩ RDS(on) limits voltage drop to <165 mV at 3 A. |
Use Scenario: Secondary-side battery disconnect during charging termination or thermal shutdown. IC Role / Device Role / Timing Role: Load switch between Li-ion cell and system PMIC input. Use Value: −4.3 A rating supports peak discharge currents; 150 °C Tj max ensures reliability under sustained load in sealed enclosures. |
| Wireless Earbud Charging Case | IoT Sensor Node Power Gating |
|
Use Scenario: Controlled power delivery from case battery to earbuds during magnetic charging alignment. IC Role / Device Role / Timing Role: Low-quiescent-load P-channel switch enabling <1 µA off-state leakage. Use Value: −1 µA IDSS at −20 V ensures multi-week shelf life; SOT23 footprint fits tight mechanical constraints. |
Use Scenario: Duty-cycled power gating of BLE radio and environmental sensors to extend coin-cell battery life. IC Role / Device Role / Timing Role: Ultra-low-threshold switch activated by microcontroller wake signal. Use Value: −0.47 V min VGS(th) guarantees turn-on even at 2.5 V brown-out; 7.7 nC QG minimizes switching energy overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2011UFD-7 | Higher RDS(on) (100 mΩ typ), larger TSOP-6 package, 20 V rating | Requires more board area; better suited for higher-current, lower-frequency switching | Select when higher surge current (IDM = 20 A) or dual-channel integration is needed |
| SI2301DS-T1-BE3 | Lower VDS (−20 V same), higher RDS(on) (110 mΩ typ), similar SOT23 footprint | Higher conduction loss limits use to sub-1 A loads; less thermally robust | Prefer only if legacy qualification or second-source compliance mandates Vishay part |
Compared with DMN2011UFD-7 and SI2301DS-T1-BE3, the PMV65XP delivers the lowest RDS(on) in SOT23, enabling higher efficiency at 2–3 A loads while maintaining identical PCB footprint and gate-drive compatibility.
Availability
PMV65XP is available at Aetrix Electronics and suitable for low-power DC-to-DC converters, battery management systems, and battery-powered portable equipment requiring stable component supply across production lifecycles.
Supply support for PMV65XP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions with focus on efficiency, miniaturization, and automotive-grade robustness.
The PMV65XP belongs to Nexperia's TrenchMOS P-channel portfolio, engineered specifically for space- and power-constrained battery-switching applications in consumer and industrial portable electronics.
FAQ
What is the maximum continuous drain current for PMV65XP at 100 °C ambient?
The PMV65XP supports −1.8 A continuous drain current at Tamb = 100 °C with standard FR4 mounting. This derating reflects thermal limitations of the SOT23 package and ensures safe junction temperature below 150 °C under steady-state conditions.
Can PMV65XP be driven directly by a 3.3 V microcontroller GPIO?
Yes - its −0.65 V typical gate threshold voltage and −0.47 V minimum ensure full enhancement with 3.3 V logic high. No level shifter or external pull-up is required, simplifying design and reducing BOM count.
Is the drain pad electrically isolated in the SOT23 package?
No - the drain (Pin 3) is internally connected to the exposed metal pad beneath the package. This pad must be soldered to a PCB copper pour for both electrical connection and thermal conduction; it is not insulated.
What is the safe operating area (SOA) limitation at DC operation?
At DC, the SOA is bounded by RDS(on) = VDS/ID line and 4165 mW maximum power dissipation at Tsp = 25 °C. For example, at VDS = −5 V, maximum sustainable ID is −0.83 A to avoid exceeding thermal limits.
PMV65XP/MIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 74mOhm @ 2.8A, 4.5V
- Vgs(th) (Max) @ Id:
- 900mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 7.7 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 744 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 480mW (Ta), 4.17W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-236AB
PMV65XP/MIR FAQ
1.How can I place an order for PMV65XP/MIR through Aetrix?
Please submit a Request for Quotation (RFQ) for PMV65XP/MIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMV65XP/MIR reliable?
The price and inventory of PMV65XP/MIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMV65XP/MIR is usually 5 days.
3.What payment methods are accepted for PMV65XP/MIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMV65XP/MIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMV65XP/MIR?
PMV65XP/MIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMV65XP/MIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMV65XP/MIR?
For technical support, including PMV65XP/MIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMV65XP/MIR requirements.
6.How does Aetrix verify that PMV65XP/MIR is sourced from the original manufacturer or authorized distributors?
All PMV65XP/MIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMV65XP/MIR meets industry standards.
7.What is the process for return or replacement of PMV65XP/MIR?
All PMV65XP/MIR units undergo pre-shipment inspection (PSI). If there is an issue with PMV65XP/MIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMV65XP/MIR part is unused and in its original packaging.
Return procedure for PMV65XP/MIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMV65XP/MIR Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

