Nexperia USA Inc. PMX400UPEZ
- Part No.:
- PMX400UPEZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PMX400UPEZ.pdf
- Description:
- PMX400UPE/SOT8013/DFN0603-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,405
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMX400UPEZ from Nexperia is a P-channel enhancement-mode Trench MOSFET in a DFN0603-3 (SOT8013) package, designed for high-side load switching and battery protection circuits. It delivers −20 V drain-source voltage rating, 425 mΩ typical RDS(on) at VGS = −4.5 V, and −900 mA continuous drain current at 25 °C ambient - enabling compact, low-loss power control in space-constrained portable electronics.
For engineers reviewing the PMX400UPEZ datasheet, PMX400UPEZ pinout, PMX400UPEZ application, or PMX400UPEZ equivalent, key selection criteria include its ultra-small 0.63 × 0.33 mm footprint, low 0.25 mm profile, ESD robustness (>2 kV HBM), and verified performance in battery-switch and high-speed line-driver roles per Nexperia's 2023 product data sheet.
Technical Context
This device operates as a single P-channel switch with gate-controlled conduction between drain and source. Its trench MOSFET architecture enables low threshold voltage (−0.7 V typ.) and stable RDS(on) across temperature - critical for reliable turn-on in low-voltage battery systems (e.g., 3.3 V or 5 V rails).
The DFN0603-3 package features an exposed drain pad optimized for thermal dissipation on FR4 PCBs with 1 cm² copper area, achieving 23–26.5 K/W junction-to-solder-point thermal resistance. Gate charge parameters (QG(tot) = 1.6–2.3 nC, QGD = 0.5 nC) support fast switching in high-frequency load-switching applications up to several MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −20 V - Maximum allowable drain-to-source voltage; defines safe operating range in battery-input circuits. |
| RDS(on) | 425 mΩ (typ.) at VGS = −4.5 V, ID = −1 A, Tj = 25 °C - Directly determines conduction loss and heat generation in load-switch designs. |
| VGS(th) | −0.7 V (typ.) - Enables full enhancement with logic-level gate drive from 1.8 V or 3.3 V microcontrollers. |
| ID (cont.) | −900 mA at Tamb = 25 °C - Specifies maximum steady-state current under standard PCB mounting conditions. |
| QG(tot) | 1.6–2.3 nC - Governs gate driver strength requirement and switching speed in PWM or enable-controlled circuits. |
| ESD Rating | >2 kV HBM - Ensures robustness against handling-induced electrostatic discharge during assembly and field operation. |
| Tj max | 150 °C - Sets upper thermal limit for reliability in sealed or thermally restricted enclosures. |
Pinout & Package
Package: DFN0603-3 (SOT8013), ultra-small leadless plastic package measuring 0.63 mm × 0.33 mm × 0.25 mm with 0.225 mm pitch and exposed drain pad for thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control terminal; accepts negative VGS to turn on P-channel conduction; requires no level-shifting for 3.3 V logic drive. |
| 2 | S (Source) | Reference node for gate drive; connected to higher potential rail (e.g., battery +) in high-side switch configuration. |
| 3 | D (Drain) | Current output terminal; electrically tied to exposed bottom pad for enhanced thermal conduction to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-compact footprint | 0.63 mm × 0.33 mm - Reduces PCB area by >50% vs. SOT-23, enabling dense battery-management layouts. |
| Low-profile height | 0.25 mm - Supports thin-profile wearable and IoT devices where Z-axis clearance is constrained. |
| Trench MOSFET process | 425 mΩ RDS(on) at −4.5 V - Delivers lower conduction loss than planar P-MOSFETs of comparable size. |
| Integrated ESD protection | >2 kV HBM - Eliminates need for external TVS diodes in handheld device battery-switch paths. |
| Thermally optimized drain pad | Rth(j-sp) = 23–26.5 K/W - Enables 4.7 W peak power dissipation with proper PCB copper layout. |
Applications
| Battery Protection Switch | High-Speed Line Driver |
|---|---|
|
Use Scenario: Reverse-current blocking and over-discharge cutoff in single-cell Li-ion battery packs for Bluetooth earbuds. IC Role / Device Role / Timing Role: High-side load switch controlling power delivery from battery to PMIC; activated/deactivated via MCU GPIO. Use Value: 425 mΩ RDS(on) limits voltage drop to <0.4 V at 900 mA, preserving runtime; 0.25 mm profile fits sub-5 mm-thick form factors. |
Use Scenario: Enabling/disabling USB-C CC line signaling paths in portable docking stations. IC Role / Device Role / Timing Role: Bidirectional analog switch for CC line pull-up/pull-down control; toggled at <100 kHz during plug detection. Use Value: Low QGD (0.5 nC) and fast tf (35 ns) ensure clean signal transitions without overshoot or timing skew. |
| High-Side Load Switch | Power-Rail Sequencing Circuit |
|
Use Scenario: Controlled power-up of RF front-end modules in LPWA sensors powered by coin-cell batteries. IC Role / Device Role / Timing Role: P-channel high-side switch isolating VCC rail; driven by 1.8 V GPIO with −0.7 V VGS(th). Use Value: −0.7 V threshold ensures reliable turn-on with minimal gate drive overhead, extending battery life by eliminating quiescent leakage. |
Use Scenario: Independent enable control of auxiliary LDO outputs in multi-rail wearables (e.g., sensor + BLE + display rails). IC Role / Device Role / Timing Role: Discrete sequencing element providing independent ON/OFF control per rail, synchronized to system reset signals. Use Value: 2 kV HBM ESD rating prevents latch-up during hot-plug events; small footprint allows placement adjacent to each LDO without routing congestion. |
Availability
PMX400UPEZ is available at Aetrix Electronics and suitable for battery protection switches, high-speed line drivers, and high-side load switches requiring stable component supply and consistent DFN0603-3 packaging across production batches.
Supply support for PMX400UPEZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a leading semiconductor manufacturer specializing in high-performance, energy-efficient discrete and logic devices, with global R&D and manufacturing facilities focused on automotive, industrial, and consumer applications.
The PMX400UPEZ belongs to Nexperia's TrenchMOS portfolio - engineered specifically for space- and power-constrained portable electronics, emphasizing ultra-small packages, low RDS(on), and robust ESD tolerance in battery-switch and load-control roles.
FAQ
What is the maximum continuous drain current for PMX400UPEZ at 100 °C ambient?
The PMX400UPEZ supports −500 mA continuous drain current at Tamb = 100 °C when mounted on an FR4 PCB with single-sided copper and tin-plated pads, per Table 5 of the 2023 datasheet. This derating reflects thermal limitations of the DFN0603-3 package under elevated ambient conditions.
Does PMX400UPEZ require a gate resistor for stable switching?
A gate resistor is recommended to dampen ringing and control slew rate, especially in high-frequency enable applications. With QG(tot) = 1.6–2.3 nC and fast tr/tf (17 ns/35 ns), a 10–47 Ω series resistor balances switching speed and EMI mitigation without compromising turn-on delay.
Can PMX400UPEZ be used in automotive applications?
No - the PMX400UPEZ is not automotive-qualified. Nexperia explicitly states in Section 15 of the datasheet that non-automotive qualified products are unsuitable for automotive use and lack AEC-Q101 testing, temperature grading, or failure-rate validation required for vehicle systems.
How is the drain terminal thermally connected in the DFN0603-3 package?
The drain (Pin 3) is internally connected to the exposed bottom copper pad of the DFN0603-3 package. Per Figure 18 and Table 6, this pad must be soldered to a ≥1 cm² FR4 PCB copper area to achieve the specified Rth(j-sp) of 23–26.5 K/W and enable 4.7 W peak power dissipation.
PMX400UPEZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 900mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 500mOhm @ 1A, 4.5V
- Vgs(th) (Max) @ Id:
- 950mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 2.3 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 127 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300mW (Ta), 4.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN0603-3 (SOT8013)
PMX400UPEZ FAQ
1.How can I place an order for PMX400UPEZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PMX400UPEZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMX400UPEZ reliable?
The price and inventory of PMX400UPEZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMX400UPEZ is usually 5 days.
3.What payment methods are accepted for PMX400UPEZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMX400UPEZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMX400UPEZ?
PMX400UPEZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMX400UPEZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMX400UPEZ?
For technical support, including PMX400UPEZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMX400UPEZ requirements.
6.How does Aetrix verify that PMX400UPEZ is sourced from the original manufacturer or authorized distributors?
All PMX400UPEZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMX400UPEZ meets industry standards.
7.What is the process for return or replacement of PMX400UPEZ?
All PMX400UPEZ units undergo pre-shipment inspection (PSI). If there is an issue with PMX400UPEZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMX400UPEZ part is unused and in its original packaging.
Return procedure for PMX400UPEZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMX400UPEZ Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

