Nexperia USA Inc. PMX700ENZ
- Part No.:
- PMX700ENZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PMX700ENZ.pdf
- Description:
- PMX700ENZ
- Quantity:
- Payment:

- Shipping:

Inventory:25,883
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMX700ENZ from Nexperia is a 60 V, N-channel enhancement-mode Trench MOSFET in a leadless DFN0603-3 (SOT8013) package, designed for ultra-compact low-side load switching. It delivers 0.3 A continuous drain current at 25 °C, exhibits 680 mΩ typical RDS(on) at VGS = 10 V and ID = 0.4 A, and supports logic-level gate drive down to 2.2 V - enabling direct interface with 3.3 V microcontrollers in battery-powered portable electronics.
For engineers reviewing the PMX700ENZ datasheet, PMX700ENZ pinout, PMX700ENZ application, or PMX700ENZ equivalent, this device is selected for space-constrained, low-power switching roles where thermal performance under FR4 mounting (Rth(j-a) = 360 K/W), sub-1 mm² footprint, and fast switching (td(off) = 7 ns) are critical design criteria.
Technical Context
This MOSFET uses Trench technology to achieve low RDS(on) and high transconductance (gfs = 1.1 S) while maintaining tight VGS(th) control (1.0–2.5 V). Its gate charge profile (QG(tot) = 0.7–1.1 nC) and low Ciss (39 pF) support efficient high-frequency switching up to several MHz in DC-DC and signal routing applications.
The device operates across –55 °C to 150 °C junction temperature, with normalized RDS(on) rising to ~2.2× at 150 °C. Its source-drain diode has VSD = 0.8–1.2 V at IS = 0.33 A, supporting bidirectional current handling in certain load-switch configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - maximum blocking voltage for battery switch and line driver applications up to 48 V systems |
| RDS(on) | 680 mΩ typ @ VGS = 10 V, ID = 0.4 A - enables <100 mW conduction loss at 0.3 A, critical for thermal management on FR4 PCBs |
| VGS(th) | 1.8 V typ - ensures reliable turn-on with 2.5–3.3 V logic outputs without external level shifting |
| QG(tot) | 0.9 nC typ - minimizes gate drive power and supports >1 MHz PWM in compact power stages |
| Ciss | 39 pF - reduces capacitive loading on driving ICs and improves signal integrity in high-speed line drivers |
| td(off) | 7 ns - enables fast turn-off for precise timing control in synchronous rectification and pulse-width modulation |
| Ptot | 300 mW @ Tamb = 25 °C - defines safe continuous power dissipation on standard FR4 with single-sided copper |
Pinout & Package
DFN0603-3 (SOT8013) is a leadless, ultra-small surface-mount package measuring 0.63 mm × 0.33 mm × 0.25 mm with 0.225 mm pitch and exposed drain pad for thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control terminal; accepts logic-level input (2.2–10 V); requires <100 nA leakage current at VGS = ±20 V |
| 2 | S (Source) | Reference node for gate drive and current return path; tied to system ground in low-side switch configuration |
| 3 | D (Drain) | High-side connection point; electrically and thermally connected to exposed bottom pad for enhanced heat dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 2.2 V - eliminates need for gate driver ICs in 3.3 V MCU-based designs |
| Ultra-small footprint | 0.63 mm × 0.33 mm area - saves >70% board space vs. SOT23-3, enabling dense wearable and IoT PCB layouts |
| Trench MOSFET architecture | Delivers 1.1 S forward transconductance and low 39 pF Ciss - improves gain stability and switching efficiency |
| Low-profile construction | 0.25 mm height - allows stacking under shields or integration into thin-profile modules (e.g., smart sensors, hearing aids) |
| Thermally optimized drain pad | Exposed D-pad with Rth(j-sp) = 23–26.5 K/W - enables 4.7 W pulsed power handling when mounted on 1 cm² copper pad |
Applications
| Battery Protection Switch | High-Speed Line Driver |
|---|---|
|
Use Scenario: Isolating Li-ion battery packs during overvoltage/overtemperature events in portable medical devices. IC Role / Device Role / Timing Role: Low-side load switch controlling battery discharge path; activated within <10 µs of fault detection. Use Value: 680 mΩ RDS(on) limits voltage drop to <200 mV at 0.3 A, preserving battery runtime and enabling accurate voltage monitoring upstream. |
Use Scenario: Driving differential clock signals between FPGA and memory in space-constrained edge AI accelerators. IC Role / Device Role / Timing Role: Active termination switch toggling signal path impedance between 50 Ω and high-Z states. Use Value: 7 ns td(off) and 4 ns tf ensure sub-10 ns edge transitions, minimizing jitter accumulation across multi-GHz serial links. |
| Low-Side Load Switch | USB-C Power Path Control |
|
Use Scenario: Enabling/disabling 5 V rail to USB peripherals in docking stations with strict size constraints. IC Role / Device Role / Timing Role: Single N-channel switch replacing mechanical relays or larger MOSFETs in hot-swap circuits. Use Value: 0.25 mm profile and 0.63 mm × 0.33 mm footprint allow placement directly beneath USB-C connectors, reducing trace inductance and EMI. |
Use Scenario: Controlling VBUS power delivery path in USB-C sink devices supporting programmable power supply (PPS). IC Role / Device Role / Timing Role: Bidirectional current-handling switch managing reverse current flow during dynamic voltage negotiation. Use Value: Source-drain diode VSD = 0.8–1.2 V at 0.33 A enables controlled reverse conduction without external Schottky, simplifying PPS compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H7TFA | RDS(on) = 450 mΩ @ VGS = 4.5 V; larger X2-DFN0603-3 (0.6 x 0.3 mm but 0.35 mm height) | Lower on-resistance suits higher-current (0.5 A) loads but increases thermal mass and height | Select when <500 mΩ RDS(on) is mandatory and 0.1 mm extra height is acceptable |
| AO3414 | RDS(on) = 55 mΩ @ VGS = 10 V; SOT-23 package (3.0 x 1.4 mm), 5× larger footprint | Higher current rating (4.2 A) and lower RDS(on), but incompatible with ultra-dense layouts | Choose for prototyping or non-space-constrained designs requiring higher current headroom |
Compared with DMN10H7TFA and AO3414, PMX700ENZ offers the smallest footprint and lowest profile among these three, trading off absolute RDS(on) for board-area savings and thermal compatibility with thin FR4 stacks - ideal when layout density and z-height dominate over milliohm-level conduction loss.
Availability
PMX700ENZ is available at Aetrix Electronics and suitable for battery protection switches, high-speed line drivers, and low-side load switches requiring stable component supply in high-mix, low-volume production for wearables, medical sensors, and portable instrumentation.
Supply support for PMX700ENZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient components for automotive, industrial, and consumer electronics, with leadership in discrete devices and logic ICs.
PMX700ENZ belongs to Nexperia's TrenchMOS® low-voltage logic-level MOSFET product line, engineered specifically for space- and power-sensitive applications in portable and battery-operated systems.
FAQ
What is the maximum continuous drain current for PMX700ENZ at 100 °C ambient temperature?
The maximum continuous drain current is 0.2 A at Tamb = 100 °C, as specified in Table 5 (Limiting values) under "ID drain current" with VGS = 10 V. This derating reflects thermal limitations on standard FR4 PCBs with single-sided copper and no heatsink.
Does PMX700ENZ require a gate resistor for stable switching in 3.3 V MCU applications?
A gate resistor is recommended: 10–47 Ω limits peak gate current and suppresses ringing caused by trace inductance and QG/Ciss interaction. The device's 40 Ω typical gate resistance and 0.9 nC total gate charge make it compatible with standard GPIO drivers without external level shifters.
Can PMX700ENZ be used in avalanche-rated circuits?
No - the datasheet does not specify avalanche energy rating (EAS) or ruggedness testing. It is rated only for repetitive and single-pulse operation within SOA limits (Figure 3), and must be operated within VDS ≤ 60 V and ID ≤ 1.3 A peak to avoid permanent damage.
How is the drain terminal thermally connected in the DFN0603-3 package?
The drain is connected to an exposed metal pad on the underside of the package, which must be soldered to a ≥1 cm² copper pour on the PCB for optimal thermal performance. Thermal resistance drops from 360 K/W (junction-to-ambient, standard footprint) to 23 K/W (junction-to-solder-point) when using this pad.
PMX700ENZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 300mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 800mOhm @ 400mA, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 1.1 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 39 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300mW (Ta), 4.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN0603-3 (SOT8013)
PMX700ENZ FAQ
1.How can I place an order for PMX700ENZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PMX700ENZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMX700ENZ reliable?
The price and inventory of PMX700ENZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMX700ENZ is usually 5 days.
3.What payment methods are accepted for PMX700ENZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMX700ENZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMX700ENZ?
PMX700ENZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMX700ENZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMX700ENZ?
For technical support, including PMX700ENZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMX700ENZ requirements.
6.How does Aetrix verify that PMX700ENZ is sourced from the original manufacturer or authorized distributors?
All PMX700ENZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMX700ENZ meets industry standards.
7.What is the process for return or replacement of PMX700ENZ?
All PMX700ENZ units undergo pre-shipment inspection (PSI). If there is an issue with PMX700ENZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMX700ENZ part is unused and in its original packaging.
Return procedure for PMX700ENZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMX700ENZ Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

