Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. PMZ350XN,315

Name: PMZ350XN,315
Brand: Nexperia USA Inc.
SKU: PMZ350XN,315
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PMZ350XN,315

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SC-101, SOT-883

Datasheet:: PMZ350XN,315.pdf

Description:: MOSFET N-CH 30V 1.87A DFN1006-3

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:9,613

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PMZ350XN,315 from NXP Semiconductors is an N-channel enhancement-mode TrenchMOS FET in a leadless SC-101 (SOT883) package, rated for V_DS = 30 V, I_D = 1.87 A at T_mb = 25 °C, and R_DS(on) ≤ 420 mΩ at V_GS = 4.5 V. It serves as a low-voltage load switch in space-constrained portable electronics, delivering fast switching and low threshold voltage (V_GS(th) = 0.5–1.5 V) for efficient battery-powered operation.

For engineers reviewing the PMZ350XN,315 datasheet, PMZ350XN,315 pinout, PMZ350XN,315 application, or PMZ350XN,315 equivalent, key selection criteria include its ultra-small footprint (1.0 × 0.6 × 0.5 mm), ESD robustness (65 V HBM), thermal resistance (R_th(j-sp) = 50 K/W), and guaranteed R_DS(on) performance down to V_GS = 2.5 V - critical for 3.3 V logic-driven switching in wearables and IoT edge nodes.

Technical Context

This device employs TrenchMOS technology to achieve low on-resistance and fast switching with minimal gate charge (Q_G(tot) = 0.65 nC, Q_GD = 0.18 nC). Its gate-source plateau voltage (V_GS(pl) = 2.45 V) ensures stable turn-on under low-voltage drive conditions typical of modern microcontrollers.

The source-drain diode exhibits V_SD = 0.78–1.2 V at I_S = 0.3 A, supporting synchronous rectification in DC-DC converters. Thermal design is enabled by its solder-point-centric thermal path (R_th(j-sp) = 50 K/W), optimized for PCB-mounted thermal relief in thin-profile assemblies.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V maximum drain-source voltage - supports 24 V rail and 12 V automotive auxiliary systems without derating.
R_DS(on)	≤420 mΩ at V_GS = 4.5 V, T_j = 25 °C - enables <100 mW conduction loss at 0.5 A load current.
V_GS(th)	0.5–1.5 V at I_D = 0.25 mA - ensures full enhancement with 1.8 V/3.3 V GPIOs without level-shifting.
Q_G(tot)	0.65 nC - reduces gate drive power and enables >1 MHz switching in compact DC-DC stages.
P_tot	2.50 W at T_mb = 25 °C - defines maximum continuous dissipation before thermal derating begins.
R_th(j-sp)	50 K/W - quantifies junction-to-solder-point thermal resistance for accurate board-level thermal modeling.
V_ESD	65 V HBM - meets industrial handling requirements without additional protection circuitry.

Pinout & Package

Package: SC-101 (SOT883), leadless ultra-small plastic package with 3 solder lands; body dimensions 1.0 × 0.6 × 0.5 mm. Designed for high-density PCB layouts and reflow-compatible assembly.

Pin/Terminal	Circuit Role	Design Meaning
1	Gate (G)	Control terminal accepting logic-level voltage; low input capacitance (C_iss = 37 pF) minimizes drive burden.
2	Source (S)	Reference node for gate drive and current return path; internally connected to substrate in standard-level FET.
3	Drain (D)	High-side or low-side power path terminal; exposed drain pad enhances thermal conduction to PCB copper.

Key Features

Feature	Design Value
Ultra-compact footprint	90 % smaller than SOT23 - saves >0.8 mm² PCB area per device in wearable sensor modules.
Low R_DS(on) at 2.5 V drive	650 mΩ max at V_GS = 2.5 V, I_D = 0.1 A - enables direct MCU GPIO control without external drivers.
TrenchMOS architecture	55 % lower profile vs. SOT23 - improves mechanical reliability in flex-rigid PCBs and drop-tested devices.
Fast switching	t_d(on) = 6.5 ns, t_f = 5.5 ns - supports high-frequency (>500 kHz) PWM dimming and buck converter operation.
Leadless construction	No gull-wing leads - eliminates solder bridging risk and improves coplanarity yield in fine-pitch reflow.

Applications

Portable Power Management

USB-C Load Switching

Use Scenario: Battery-powered medical sensors requiring ultra-low standby current and rapid power sequencing.

IC Role / Device Role / Timing Role: Low-side load switch enabling controlled power-up/down of analog front-end ICs.

Use Value: Sub-1 µA IDSS leakage at 25 °C preserves battery life over multi-week deployments.

Use Scenario: USB-C port power delivery where VBUS must be switched after CC detection and PD negotiation.

IC Role / Device Role / Timing Role: High-speed, low-RDS(on) pass element in 5 V/3 A load switch IC replacement.

Use Value: 0.65 nC QG(tot) allows clean 100 ns turn-on with minimal overshoot during hot-plug events.

DC-DC Converter Synchronous Rectifier

IoT Edge Node Peripherals Control

Use Scenario: 3.3 V output buck converter in LPWA modules operating at 2 MHz switching frequency.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacing Schottky diode.

Use Value: 0.78 V VSD forward drop at 0.3 A reduces conduction loss by 40 % vs. 0.3 V Schottky at same current.

Use Scenario: Remote environmental monitor using BLE SoC with multiple peripheral rails (sensor, radio, memory).

IC Role / Device Role / Timing Role: Individual rail enable switch for dynamic power gating of non-active subsystems.

Use Value: 1.5 V max VGS(th) ensures reliable turn-on even with 10 % VDD droop during RF transmit bursts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage load switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN2004LK-7	R_DS(on) = 300 mΩ @ V_GS = 4.5 V; larger SOT-723 package (1.2 × 0.8 mm); higher Q_G = 0.9 nC	Better R_DS(on) but 2× footprint - suitable when thermal margin exists and layout density is secondary	Select if lower conduction loss outweighs PCB area penalty and higher gate drive demand is acceptable
AO3400	R_DS(on) = 44 mΩ @ V_GS = 10 V; SOT-23 package; V_GS(th) = 0.8–1.8 V; not specified below 2.5 V	Lower R_DS(on) only at 10 V drive - requires level shifter for 3.3 V MCU control	Choose only when 10 V gate drive is available and board space permits SOT-23 mounting

Compared with DMN2004LK-7 and AO3400, PMZ350XN,315 uniquely balances ultra-miniature size, guaranteed 2.5 V operation, and ESD-hardened construction - making it optimal for space- and voltage-constrained IoT endpoints where gate drive simplicity and reliability are prioritized over absolute lowest R_DS(on).

Availability

PMZ350XN,315 is available at Aetrix Electronics and suitable for portable power management, USB-C load switching, DC-DC converter synchronous rectification, and IoT edge node peripherals control requiring stable component supply across long-lifecycle designs.

Supply support for PMZ350XN,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

PMZ350XN,315 belongs to NXP's TrenchMOS standard-level FET product line, engineered specifically for low-voltage, high-density load switching in battery-powered portable electronics and energy-efficient power conversion.

FAQ

What is the maximum continuous drain current at 100 °C mounting base temperature?

The PMZ350XN,315 supports 1.18 A continuous drain current at T_mb = 100 °C and V_GS = 10 V, as specified in Table 3 of the datasheet. This derating reflects thermal limitations of the SC-101 package and must be applied in thermally constrained enclosures or high-ambient environments.

Can PMZ350XN,315 be used in a high-side switch configuration?

No - PMZ350XN,315 is a standard-level N-channel MOSFET with source tied to substrate, requiring gate drive referenced to source potential. High-side switching would necessitate either a P-channel device or an N-channel with isolated gate driver; this part is intended for low-side or common-source configurations only.

Is the SC-101 package compatible with standard reflow soldering profiles?

Yes - the SC-101 (SOT883) package is qualified for lead-free reflow per J-STD-020. Figure 16 in the datasheet provides the recommended solder paste stencil and footprint, including 0.30 mm solder land width and 0.35 mm spacing between lands to prevent bridging during peak temperatures up to 260 °C.

What is the significance of the 50 K/W junction-to-solder-point thermal resistance?

R_th(j-sp) = 50 K/W defines the dominant thermal path from die to PCB copper via the drain solder land. Unlike ambient-based metrics, this value enables precise thermal simulation when the device is mounted on a defined copper area, allowing designers to calculate actual junction temperature rise under real board-level cooling conditions.

PMZ350XN,315 Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: TrenchMOS™

Package/Case:: SC-101, SOT-883

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 1.87A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 4.5V

Rds On (Max) @ Id, Vgs:: 420mOhm @ 200mA, 4.5V

Vgs(th) (Max) @ Id:: 1.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 0.65 nC @ 4.5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 37 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 2.5W (Tc)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-883

PMZ350XN,315 FAQ

1.How can I place an order for PMZ350XN,315 through Aetrix?

Please submit a Request for Quotation (RFQ) for PMZ350XN,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMZ350XN,315 reliable?

The price and inventory of PMZ350XN,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMZ350XN,315 is usually 5 days.

3.What payment methods are accepted for PMZ350XN,315?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMZ350XN,315 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMZ350XN,315?

PMZ350XN,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMZ350XN,315 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMZ350XN,315?

For technical support, including PMZ350XN,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMZ350XN,315 requirements.

6.How does Aetrix verify that PMZ350XN,315 is sourced from the original manufacturer or authorized distributors?

All PMZ350XN,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMZ350XN,315 meets industry standards.

7.What is the process for return or replacement of PMZ350XN,315?

All PMZ350XN,315 units undergo pre-shipment inspection (PSI). If there is an issue with PMZ350XN,315, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMZ350XN,315 part is unused and in its original packaging.

Return procedure for PMZ350XN,315:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…