Nexperia USA Inc. PMZB290UN,315
- Part No.:
- PMZB290UN,315
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
PMZB290UN,315.pdf
- Description:
- MOSFET N-CH 20V 1A DFN1006B-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,132
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMZB290UN from Nexperia is a single N-channel enhancement-mode Trench MOSFET in a DFN1006B-3 (SOT883B) ultra-thin surface-mount package, rated for 20 V drain-source voltage, 1 A continuous drain current at 25 °C, and 290 mΩ typical RDS(on) at VGS = 4.5 V - optimized for low-side load switching in space-constrained portable electronics.
For engineers reviewing the PMZB290UN datasheet, PMZB290UN pinout, PMZB290UN application, or PMZB290UN equivalent, key selection criteria include its 0.37 mm profile height, 2 kV HBM ESD rating, fast 4.5 ns turn-on delay, and guaranteed operation down to –55 °C ambient temperature.
Technical Context
This MOSFET employs Trench technology to achieve low gate charge (0.89 nC typical) and high transconductance (5.8 S), enabling efficient switching in battery-powered systems where gate drive strength is limited. Its sub-threshold behavior is characterized by a 0.45–0.95 V gate threshold voltage range at 25 °C.
The device features an integrated source-drain diode with 0.75–1.2 V forward voltage at 300 mA, and thermal resistance of 305 K/W junction-to-ambient on FR4 PCB - critical for thermal management in unheatsinked layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V maximum - defines safe operating voltage ceiling for low-voltage logic-level switching applications. |
| RDS(on) | 290 mΩ typical at VGS = 4.5 V, ID = 200 mA, Tj = 25 °C - enables <100 mW conduction loss at 0.5 A load current. |
| VGS(th) | 0.7 V typical - ensures reliable turn-on with 1.8 V or higher logic outputs, supporting modern low-voltage microcontrollers. |
| QG(tot) | 0.89 nC typical - reduces gate drive power and allows use with weak GPIOs or low-current drivers. |
| Tj max | 150 °C - sets maximum junction temperature limit for continuous operation under thermal derating curves. |
| ESD Rating | 2 kV HBM - provides robustness against handling-induced electrostatic discharge without external protection. |
| Ptot | 360 mW at Tamb = 25 °C on FR4 - defines maximum steady-state power dissipation before thermal shutdown or reliability risk. |
Pinout & Package
Package: DFN1006B-3 (SOT883B), leadless ultra-small plastic package; dimensions 1.0 × 0.6 × 0.37 mm; 3 solder lands; tin-plated copper pad for drain thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control terminal; accepts logic-level voltage (≤8 V) to modulate channel conductivity; high-impedance input requiring minimal drive current. |
| 2 | S (Source) | Reference node for gate voltage and return path for load current; internally connected to substrate; must be tied to system ground in low-side configuration. |
| 3 | D (Drain) | Power output terminal; connects to load; thermally coupled to PCB mounting pad for heat dissipation; carries full switched current. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-thin profile | 0.37 mm height - enables integration into slim handheld devices and wearables where Z-height is constrained. |
| Low RDS(on) at 1.8 V VGS | 650 mΩ max - supports partial turn-on for analog control or PWM dimming in low-voltage LED drivers. |
| Fast switching speed | 9 ns max turn-off delay - minimizes transition losses in high-frequency (>1 MHz) DC-DC or motor control circuits. |
| ESD-protected gate | 2 kV HBM rating - eliminates need for external gate protection diodes in production assembly lines. |
| Thermal performance | Rth(j-sp) = 40 K/W - enables direct thermal coupling to PCB copper, improving reliability over standard SOT packages. |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
|
Use Scenario: Replacing electromechanical relays in IoT sensor nodes to reduce size, bounce, and power consumption. IC Role / Device Role / Timing Role: Low-side switch controlling coil current; operates in saturation with <100 µs response time. Use Value: Eliminates mechanical wear and enables 100% duty-cycle digital control while maintaining <100 mW self-heating at 500 mA load. |
Use Scenario: Driving short PCB traces or capacitive loads in USB-C PD communication or display interface signaling. IC Role / Device Role / Timing Role: Active pull-down element in open-drain bus topology; switches at >10 MHz with controlled edge rates. Use Value: Achieves <15 ns total propagation delay due to low Ciss (68 pF max) and fast gate charge delivery. |
| Low-Side Load Switch | Switching Power Circuit |
|
Use Scenario: Enabling/disabling power to peripherals (e.g., sensors, radios) in battery-powered wearables to extend runtime. IC Role / Device Role / Timing Role: Controlled power path switch; biased with 3.3 V MCU GPIO; handles up to 1 A pulsed load. Use Value: Delivers <200 mW conduction loss at full load, reducing thermal impact on adjacent components in 2.5 mm² board area. |
Use Scenario: Synchronous rectification in buck converter output stage for portable medical devices requiring <1% efficiency loss. IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diode; driven by gate driver with 4.5 V output. Use Value: Reduces forward voltage drop from ~0.4 V to <0.15 V at 500 mA, cutting conduction loss by >60% versus diode solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H023R | RDS(on) = 23 mΩ at VGS = 4.5 V - 12× lower than PMZB290UN; larger SOT-23 package (2.9 × 1.3 × 1.0 mm). | Requires more PCB area and higher gate drive current; suited for higher-current (>2 A), less space-constrained designs. | Select when lower conduction loss outweighs size and cost constraints; verify thermal margin with larger footprint. |
| AO3400 | RDS(on) = 28 mΩ at VGS = 10 V but only 45 mΩ at VGS = 2.5 V - weaker low-voltage drive capability than PMZB290UN's 650 mΩ at 1.8 V. | Less suitable for 1.8 V/2.5 V logic interfaces; better for 3.3 V/5 V systems with higher gate drive availability. | Prefer for legacy 3.3 V systems where gate drive strength is ample and ultra-thin profile is not required. |
Compared with DMN10H023R and AO3400, the PMZB290UN uniquely balances ultra-miniature packaging, strong 1.8 V turn-on, and 2 kV ESD tolerance - making it optimal for next-gen compact battery-powered systems where board space and low-voltage compatibility are non-negotiable.
Availability
PMZB290UN is available at Aetrix Electronics and suitable for relay driver modules, high-speed line driver circuits, and low-side loadswitch implementations requiring stable component supply, consistent parametric performance across batches, and long-term lifecycle support.
Supply support for PMZB290UN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade and industrial MOSFETs, ESD protection, and logic ICs.
The PMZB290UN belongs to Nexperia's TrenchMOS family - engineered specifically for space-constrained, battery-operated applications demanding low RDS(on), fast switching, and robust ESD immunity in sub-1 mm packages.
FAQ
What is the maximum continuous drain current for PMZB290UN at 100 °C ambient temperature?
The maximum continuous drain current is 0.6 A at Tamb = 100 °C, as specified in Table 5 (Limiting values). This derating reflects thermal limitations on FR4 PCB with single-sided copper; actual current capacity depends on PCB copper area and airflow.
Does PMZB290UN require external gate resistors for ESD protection?
No - the device integrates 2 kV HBM ESD protection on the gate terminal, eliminating the need for external series resistors or TVS diodes in standard handling and operation. External gate resistors may still be used for switching speed control or ringing suppression.
Can PMZB290UN be used in a high-side switching configuration?
No - the PMZB290UN is a single N-channel MOSFET with source tied to internal substrate; it lacks a floating gate driver and body diode orientation required for high-side operation. It is designed exclusively for low-side switching where source connects to ground.
What is the recommended reflow soldering footprint for DFN1006B-3 package?
The official footprint specifies 0.35 mm wide × 0.65 mm long solder lands for pins 1 (G) and 2 (S), and a 0.95 mm × 0.65 mm thermal pad for pin 3 (D), with 0.25 mm solder paste stencil openings - per Figure 20 in the datasheet.
PMZB290UN,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 1A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 380mOhm @ 500mA, 4.5V
- Vgs(th) (Max) @ Id:
- 950mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.68 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 83 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 360mW (Ta), 2.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006B-3
PMZB290UN,315 FAQ
1.How can I place an order for PMZB290UN,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMZB290UN,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMZB290UN,315 reliable?
The price and inventory of PMZB290UN,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMZB290UN,315 is usually 5 days.
3.What payment methods are accepted for PMZB290UN,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMZB290UN,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMZB290UN,315?
PMZB290UN,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMZB290UN,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMZB290UN,315?
For technical support, including PMZB290UN,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMZB290UN,315 requirements.
6.How does Aetrix verify that PMZB290UN,315 is sourced from the original manufacturer or authorized distributors?
All PMZB290UN,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMZB290UN,315 meets industry standards.
7.What is the process for return or replacement of PMZB290UN,315?
All PMZB290UN,315 units undergo pre-shipment inspection (PSI). If there is an issue with PMZB290UN,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMZB290UN,315 part is unused and in its original packaging.
Return procedure for PMZB290UN,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMZB290UN,315 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

