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NXP Semiconductors PMZB380XN,315
- Part No.:
- PMZB380XN,315
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-101, SOT-883
- Datasheet:
-
PMZB380XN,315.pdf
- Description:
- MOSFET N-CH 30V 930MA DFN1006B-3
- Quantity:
- Payment:
- Shipping:
Inventory:236,794
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Product details
Overview
PMZB380XN from NXP Semiconductors is a single N-channel enhancement-mode Trench MOSFET in a DFN1006B-3 (SOT883B) ultra-thin surface-mount package, rated for 30 V drain-source voltage, 930 mA continuous drain current at 4.5 V gate drive, and 0.38 Ω typical RDS(on) at 200 mA/25 °C - used as a low-side load switch in space-constrained portable electronics.
For engineers reviewing the PMZB380XN datasheet, PMZB380XN pinout, PMZB380XN application, or PMZB380XN equivalent, this page delivers verified electrical specs, thermal behavior, switching timing, package dimensions, and real-world substitution guidance - all confirmed against NXP's official 2012 product data sheet.
Technical Context
This device uses Trench MOSFET technology to achieve low threshold voltage (0.5–1.5 V), fast switching (turn-on delay ≤13 ns, fall time ≤5.5 ns), and stable performance across junction temperatures from −55 °C to 150 °C. Its gate charge profile (QG(tot) = 0.65–0.87 nC) and capacitance values (Ciss = 37–56 pF, Coss = 8.6 pF) support high-frequency operation in compact DC-DC and signal-switching circuits.
The PMZB380XN operates as a voltage-controlled low-side switch with source tied to ground, requiring no external bias network. Its ultra-thin 0.37 mm height and 1.0 × 0.6 mm footprint enable integration into wearables and thin mobile accessories where board space and z-height are critical constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V maximum - supports 24 V rail switching and automotive 12 V systems with margin. |
| RDS(on) | 0.38 Ω typ @ VGS = 4.5 V, ID = 200 mA, 25 °C - enables <100 mW conduction loss at 500 mA. |
| ID | 930 mA max @ VGS = 4.5 V, Tamb = 25 °C - suitable for LED drivers and sensor interface loads. |
| VGS(th) | 0.5–1.5 V - ensures reliable turn-on with 1.8 V or 3.3 V logic-level microcontrollers. |
| QG(tot) | 0.65–0.87 nC - minimizes gate drive power and supports >1 MHz PWM operation. |
| Tj range | −55 to +150 °C - qualified for industrial ambient environments without derating below −40 °C. |
| Package | DFN1006B-3 (SOT883B), 1.0 × 0.6 × 0.37 mm - compatible with 0201-class reflow footprints. |
Pinout & Package
DFN1006B-3 (SOT883B) is a leadless, ultra-small plastic package with three solder lands on the bottom side and a transparent top view. The body measures 1.0 mm × 0.6 mm × 0.37 mm height, optimized for automated placement and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control input; accepts logic-level voltages (0.5–1.5 V threshold); requires no series resistor for 3.3 V MCU drive. |
| 2 | S (Source) | Reference node tied to system ground; forms return path for switched load current. |
| 3 | D (Drain) | High-side connection to load; thermally connected to large copper pad (1 cm² recommended) for 2.7 W power dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-thin 0.37 mm profile | Enables use in sub-1 mm-thick devices such as smart bands and hearing aids without mechanical interference. |
| Trench MOSFET architecture | Delivers lower RDS(on) per die area than planar MOSFETs, improving power efficiency in battery-powered systems. |
| Low VGS(th) (0.5–1.5 V) | Guarantees full enhancement with 1.8 V I/O rails, eliminating level-shifter requirements in modern SoC designs. |
| Fast switching (tf ≤ 5.5 ns) | Reduces transition losses in high-frequency load switching, supporting >500 kHz PWM dimming or data-line control. |
| FR4-compatible thermal design | Rated for 715 mW power dissipation on standard single-sided tin-plated PCB - no thermal vias required for ≤500 mA loads. |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
Use Scenario: Replacing electromechanical relays in IoT node power management to reduce size, bounce, and coil drive complexity. IC Role / Device Role / Timing Role: Low-side switch controlling 12 V solenoid or indicator LED bank with 5 V or 3.3 V GPIO. Use Value: Eliminates relay coil inductance and contact wear while maintaining <1 µs response time and 10⁶-cycle reliability. | Use Scenario: Driving short-length differential or single-ended signal lines in portable test equipment or sensor hubs. IC Role / Device Role / Timing Role: Active pull-down element in open-drain bus interfaces or level-translated clock distribution paths. Use Value: Provides 0.38 Ω on-resistance and 5.5 ns fall time to maintain signal integrity up to 20 MHz without overshoot. |
| Low-Side Load Switch | Switching Circuits |
Use Scenario: Enabling/disabling power to USB peripherals, display backlights, or RF modules in handheld medical devices. IC Role / Device Role / Timing Role: Controlled power gate between battery and load, with gate driven directly by microcontroller GPIO. Use Value: Achieves <100 µA quiescent current in off-state and <100 mW conduction loss at 500 mA - extending battery life by >8% in duty-cycled systems. | Use Scenario: Building compact DC-DC converter synchronous rectifiers or buck converter high-side switches in PMIC modules. IC Role / Device Role / Timing Role: Power switch in non-isolated point-of-load regulators operating at 500 kHz–1 MHz switching frequency. Use Value: QG(tot) of 0.65–0.87 nC and Coss of 8.6 pF minimize switching losses and EMI generation in high-frequency topologies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H400SFG-7 | Higher VDS (40 V), larger SOT-723 package (1.7 × 1.2 × 0.5 mm), RDS(on) = 0.35 Ω @ 4.5 V - slightly better conduction but 3.5× larger footprint. | Preferred where higher voltage margin or thermal headroom is needed; not suitable for 0201-class layouts. | Select when system voltage may exceed 30 V or when PCB layout allows larger package; avoid if height <0.4 mm is mandatory. |
| AO3400 | SOT-23 package (3.0 × 1.4 × 1.1 mm), VDS = 30 V, RDS(on) = 0.042 Ω @ 10 V - lower RDS(on) but requires 10 V gate drive and occupies 5× more board area. | Better for high-current (>1 A), low-thermal-resistance applications where space is not constrained. | Choose only if gate drive supports ≥10 V and board area permits SOT-23; unsuitable for ultra-thin or high-density designs. |
Compared with DMN10H400SFG-7 and AO3400, the PMZB380XN uniquely balances 0.37 mm height, 1.0 × 0.6 mm footprint, and 0.38 Ω RDS(on) at logic-level drive - making it the only option among the three viable for sub-1 mm wearable PCBs requiring 3.3 V compatibility.
Availability
PMZB380XN is available at Aetrix Electronics and suitable for portable medical monitors, wireless sensor nodes, and compact consumer audio accessories requiring stable component supply and long-term obsolescence management.
Supply support for PMZB380XN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The PMZB380XN belongs to NXP's TrenchMOS family - engineered specifically for ultra-compact, logic-level switching in battery-powered edge devices where minimal height, low gate charge, and robust thermal performance are essential.
FAQ
What is the maximum continuous drain current for PMZB380XN at 100 °C ambient temperature?
The PMZB380XN supports 590 mA continuous drain current at Tamb = 100 °C with VGS = 4.5 V, as specified in Table 5 (Limiting Values) of the NXP datasheet. This reflects thermal derating due to reduced heat dissipation capability at elevated ambient conditions, and assumes mounting on an FR4 PCB with single-sided copper and a 1 cm² drain pad.
Does PMZB380XN require a gate resistor for driving from a 3.3 V microcontroller?
No, the PMZB380XN does not require an external gate resistor when driven by a standard 3.3 V microcontroller GPIO. Its low gate charge (QG(tot) = 0.65–0.87 nC) and logic-level threshold (VGS(th) = 0.5–1.5 V) allow direct connection. However, a small resistor (≤10 Ω) may be added to dampen ringing in high-speed switching applications.
What is the thermal resistance from junction to ambient (Rth(j-a)) for PMZB380XN on a standard FR4 PCB?
The PMZB380XN has a typical Rth(j-a) of 305 K/W when mounted on an FR4 PCB with single-sided copper, tin-plated, and standard footprint (Table 6). This value increases to 360 K/W maximum and drops to 150 K/W when using a 1 cm² drain pad - confirming its strong dependence on PCB copper area for thermal performance.
Can PMZB380XN be used in automotive applications?
No, the PMZB380XN is not automotive-qualified. Per Section 12.3 of the NXP datasheet, it is explicitly designated as a non-automotive qualified product - lacking AEC-Q101 stress testing, extended temperature validation, or automotive-specific reliability reporting. It must not be used in safety-critical or vehicle-mounted systems without independent qualification.
What marking code identifies PMZB380XN on the device top surface?
The PMZB380XN is marked with the binary code "0000 1001" on its top surface, as shown in Table 4 and Figure 1 of the NXP datasheet. This 8-bit code is read left-to-right with pin 1 indicated by a dot or notch, and serves as the unique visual identifier for traceability and counterfeit detection.
PMZB380XN,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SC-101, SOT-883
- Packaging:
- Bulk
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 930mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 460mOhm @ 200mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.87 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 56 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 360mW (Ta), 2.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006B-3
PMZB380XN,315 FAQ
1.How can I place an order for PMZB380XN,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMZB380XN,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMZB380XN,315 reliable?
The price and inventory of PMZB380XN,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMZB380XN,315 is usually 5 days.
3.What payment methods are accepted for PMZB380XN,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMZB380XN,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMZB380XN,315?
PMZB380XN,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMZB380XN,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMZB380XN,315?
For technical support, including PMZB380XN,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMZB380XN,315 requirements.
6.How does Aetrix verify that PMZB380XN,315 is sourced from the original manufacturer or authorized distributors?
All PMZB380XN,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMZB380XN,315 meets industry standards.
7.What is the process for return or replacement of PMZB380XN,315?
All PMZB380XN,315 units undergo pre-shipment inspection (PSI). If there is an issue with PMZB380XN,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMZB380XN,315 part is unused and in its original packaging.
Return procedure for PMZB380XN,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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