NXP Semiconductors PSMN005-25D,118
- Part No.:
- PSMN005-25D,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PSMN005-25D,118.pdf
- Description:
- MOSFET N-CH 25V 75A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,375
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Product details
Overview
PSMN005-25D from Philips Semiconductors is an N-channel logic-level TrenchMOS transistor in SOT428 (DPAK) package, rated for 25 V VDSS, 75 A continuous drain current at Tmb = 25 °C, and RDS(ON) ≤ 7.5 mΩ at VGS = 5 V. It delivers fast switching, low conduction loss, and robust avalanche capability (EAS = 120 mJ), making it suitable for high-efficiency DC-DC converters and switched-mode power supplies.
For engineers reviewing the PSMN005-25D datasheet, PSMN005-25D pinout, PSMN005-25D application, or PSMN005-25D equivalent, key selection factors include its logic-level gate drive compatibility (VGS(th) = 1–2 V), thermal resistance to mounting base (Rth j-mb = 1.2 K/W), and body diode recovery characteristics (trr = 140 ns, Qrr = 0.27 µC).
Technical Context
The PSMN005-25D employs Philips' proprietary TrenchMOS technology to minimize on-state resistance while maintaining stable threshold voltage across temperature (VGS(TO) = 0.5–2.3 V). Its gate charge profile (Qg(tot) = 60 nC, Qgd = 32 nC) supports efficient high-frequency switching in synchronous rectification and PWM control stages.
Designed for surface-mount operation with the tab connected to drain, the device features internal drain and source inductances (Ld = 3.5 nH, Ls = 7.5 nH) that influence switching waveform integrity. The body diode exhibits low forward voltage (VSD = 0.95–1.2 V at 25 A) and controlled reverse recovery, enabling use in freewheeling paths without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 25 V - Maximum drain-source blocking voltage; defines safe operating range in low-voltage power rails. |
| ID (continuous) | 75 A at Tmb = 25 °C - High-current capability enabled by low RDS(ON) and efficient thermal path to mounting base. |
| RDS(ON) | ≤ 7.5 mΩ at VGS = 5 V - Enables direct logic-level MCU or gate-driver control without level-shifting circuitry. |
| EAS | 120 mJ - Specifies single-pulse unclamped inductive avalanche energy handling; critical for reliability in hard-switched topologies. |
| trr | 140 ns - Body diode reverse recovery time; impacts switching losses and EMI in synchronous buck or flyback configurations. |
| Rth j-mb | 1.2 K/W - Thermal resistance from junction to mounting base; enables high-power dissipation when heatsinked directly to PCB copper pour. |
| Qg(tot) | 60 nC - Total gate charge required for full turn-on; determines driver strength requirement and switching speed trade-off. |
Pinout & Package
SOT428 (DPAK) surface-mount package with isolated leadframe; metal tab is electrically connected to drain and serves as primary thermal interface. Pin 2 (drain1) is internally connected to the tab and not externally accessible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; accepts logic-level input (VGS(th) = 1–2 V); requires ESD protection during handling. |
| 2 | Drain1 | Internally bonded to metal tab; not externally accessible-no PCB pad connection required. |
| 3 | Source | Power return path; referenced to gate drive ground; carries full load current and body diode conduction. |
| Tab | Drain | Main drain terminal and thermal interface; must be soldered to large copper area for thermal management. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS technology | Enables lowest RDS(ON) per silicon area in 25 V class, improving power density in compact converters. |
| Logic-level gate drive | Operates fully enhanced at VGS = 5 V, eliminating need for gate boosters in 3.3 V/5 V microcontroller-driven systems. |
| Low Qgd/Qg ratio | Miller charge of 32 nC out of 60 nC total enables stable high-dV/dt immunity and reduced risk of spurious turn-on. |
| Robust body diode | Specified trr = 140 ns and Qrr = 0.27 µC support reliable freewheeling in non-synchronous topologies without oscillation. |
| Avalanche-rated | Guaranteed 120 mJ single-pulse EAS allows operation in inductive switching circuits without external snubbers. |
Applications
| DC-DC Converters | Switched-Mode Power Supplies |
|---|---|
Use Scenario: High-current synchronous buck converter in telecom power modules delivering 12 V @ 50 A. IC Role / Device Role / Timing Role: Primary high-side switch handling PWM-controlled power delivery with fast turn-on/turn-off timing. Use Value: Low RDS(ON) (≤7.5 mΩ) minimizes conduction loss; logic-level gate enables direct drive from PWM controller's 5 V output. | Use Scenario: Secondary-side synchronous rectifier in 24 V offline SMPS for industrial PLC power supplies. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce forward drop and improve efficiency. Use Value: Body diode VSD ≤ 1.2 V and trr = 140 ns ensure clean commutation; RDS(ON) < 8 mΩ cuts conduction loss vs. 0.5 V Schottky. |
| Motor Drive Half-Bridge | Hot-Swap Controllers |
Use Scenario: Low-voltage BLDC motor driver stage in battery-powered power tools (18–24 V nominal). IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration, commutated at 20–50 kHz with dead-time control. Use Value: Fast switching (td(off) = 270 ns, tf = 216 ns) enables precise PWM resolution; avalanche rating protects against inductive kickback. | Use Scenario: Inrush current limiter in redundant 12 V backplane supply for network switches. IC Role / Device Role / Timing Role: Series pass element controlling hot-insertion sequencing and fault current limiting. Use Value: 75 A continuous rating supports high hold-up current; low RDS(ON) limits power dissipation during steady-state operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLZ44NPBF | VDSS = 55 V, RDS(ON) = 22 mΩ @ 5 V, SOT-223 package, higher Rth j-a (62 K/W) | Higher voltage margin but lower current density; unsuitable for >40 A continuous designs | Choose only if system requires >25 V blocking or SOT-223 footprint compatibility. |
| DMN2004LK-7 | VDSS = 20 V, RDS(ON) = 4.5 mΩ @ 4.5 V, SOT-23 package, 4.8 A ID rating | Lower voltage and current capability; limited to sub-5 A loads | Select only for space-constrained, low-power logic-level switching where 25 V rating suffices. |
Compared with IRLZ44NPBF and DMN2004LK-7, the PSMN005-25D uniquely combines 25 V rating, 75 A current, 7.5 mΩ RDS(ON) at 5 V, and DPAK thermal performance-making it optimal for medium-power, logic-driven switching where thermal management and conduction loss are critical.
Availability
PSMN005-25D is available at Aetrix Electronics and suitable for DC-DC converters, switched-mode power supplies, and motor drive half-bridges requiring stable component supply and long-term industrial availability.
Supply support for PSMN005-25D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Philips Semiconductors (now NXP Semiconductors) is a global semiconductor innovator with leadership in power MOSFETs, analog ICs, and automotive electronics.
The PSMN005-25D belongs to Philips' SiliconMAX TrenchMOS family, engineered specifically for high-efficiency, low-voltage power conversion in industrial and telecom infrastructure where logic-level drive and thermal robustness are essential.
FAQ
What is the maximum continuous drain current rating for the PSMN005-25D at 100 °C mounting base temperature?
The PSMN005-25D supports 70 A continuous drain current at Tmb = 100 °C and VGS = 5 V, as specified in the Limiting Values table. This derating reflects thermal constraints of the SOT428 package and ensures safe junction temperature operation up to 175 °C. Designers must verify PCB copper area and heatsinking to maintain Tmb ≤ 100 °C under full load.
Does the PSMN005-25D have a specified gate threshold voltage range, and how does it vary with temperature?
Yes, the PSMN005-25D has a gate threshold voltage VGS(TO) of 1.0–2.0 V at Tj = 25 °C, tightening to 0.5–2.3 V across the full junction temperature range (−55 °C to +175 °C). This wide specification ensures reliable turn-on at elevated temperatures and prevents unintended conduction at cold start, critical for automotive and industrial environments.
Can the PSMN005-25D be used in avalanche mode, and what are the validated conditions?
Yes, the PSMN005-25D is rated for non-repetitive avalanche with EAS = 120 mJ under defined conditions: unclamped inductive load, IAS = 75 A, tp = 100 µs, VDD ≤ 15 V, RGS = 50 Ω, and VGS = 5 V. This rating is validated per IEC 134 and supports robustness in hard-switched topologies without external clamping.
What is the thermal resistance from junction to mounting base (Rth j-mb) for the PSMN005-25D, and why is it important?
The PSMN005-25D has a maximum Rth j-mb of 1.2 K/W, measured from silicon junction to the metal tab. This low value enables efficient heat transfer to an external heatsink or PCB copper pour, allowing sustained 75 A operation when properly mounted. It is significantly lower than Rth j-a (50 K/W), confirming that thermal design must prioritize tab-to-heatsink interface over ambient convection.
How does the body diode performance of the PSMN005-25D compare to discrete Schottky diodes in synchronous rectification?
The PSMN005-25D body diode has VSD = 0.95–1.2 V at 25 A and trr = 140 ns, offering lower forward drop than many 30 V Schottky diodes (typically 0.4–0.6 V at low current but rising sharply above 10 A) while providing integrated functionality. Its Qrr = 0.27 µC is well-controlled, reducing switching loss and EMI compared to slower bipolar diodes-making it viable for synchronous rectification without external diode substitution.
PSMN005-25D,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.8mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 60 nC @ 5 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3500 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 125W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PSMN005-25D,118 FAQ
1.How can I place an order for PSMN005-25D,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN005-25D,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN005-25D,118 reliable?
The price and inventory of PSMN005-25D,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN005-25D,118 is usually 5 days.
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5.How can I obtain technical support or documentation for PSMN005-25D,118?
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6.How does Aetrix verify that PSMN005-25D,118 is sourced from the original manufacturer or authorized distributors?
All PSMN005-25D,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN005-25D,118 meets industry standards.
7.What is the process for return or replacement of PSMN005-25D,118?
All PSMN005-25D,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN005-25D,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN005-25D,118 part is unused and in its original packaging.
Return procedure for PSMN005-25D,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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