NXP Semiconductors PSMN005-55B,118
- Part No.:
- PSMN005-55B,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PSMN005-55B,118.pdf
- Description:
- MOSFET N-CH 55V 75A D2PAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PSMN005-55B,118 from NXP Semiconductors (formerly Philips) is an N-channel logic-level TrenchMOS™ power MOSFET in SOT404 (D2PAK) surface-mount package, rated for 55 V VDSS, 75 A continuous drain current at Tmb = 25 °C, and RDS(ON) ≤ 5.8 mΩ at VGS = 10 V. It serves as a high-efficiency synchronous rectifier or main switch in d.c.-to-d.c. converters and switched-mode power supplies.
For engineers reviewing the PSMN005-55B,118 datasheet, PSMN005-55B,118 pinout, PSMN005-55B,118 application, or PSMN005-55B,118 equivalent, key selection criteria include its low RDS(ON) at 5 V gate drive, 268 mJ unclamped avalanche energy rating, thermal resistance of 0.65 K/W junction-to-mounting-base, and body diode reverse recovery time of 80 ns - all critical for high-frequency, high-current power stage design.
Technical Context
This device employs Philips' proprietary TrenchMOS™ technology to minimize on-state resistance while maintaining robust switching performance. Its logic-level gate threshold (VGS(TO) = 1.0–2.0 V at 25 °C) enables direct drive from 3.3 V or 5 V controllers without level-shifting circuitry.
The SOT404 package features an exposed mounting base thermally connected to the drain, enabling efficient heat transfer to PCB copper or heatsinks. Internal drain inductance is 3.5 nH (measured from tab to die center), and total gate charge is 103 nC at VGS = 5 V, supporting fast turn-on with controlled dV/dt.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 55 V - Maximum blocking voltage before avalanche; supports 48 V input systems with margin. |
| ID (continuous) | 75 A at Tmb = 25 °C - Enables high-current output stages without parallel devices in compact layouts. |
| RDS(ON) | ≤ 5.8 mΩ at VGS = 10 V - Minimizes conduction loss in high-duty-cycle applications like buck converters. |
| RDS(ON) @ 5 V | ≤ 6.3 mΩ - Ensures usable on-resistance with standard logic-level gate drivers (e.g., microcontroller GPIO). |
| EAS | 268 mJ - Specifies single-pulse avalanche ruggedness under unclamped inductive switching, critical for reliability in hard-switched topologies. |
| trr | 80 ns - Fast body diode recovery reduces switching loss and voltage overshoot during synchronous rectification. |
| Rth j-mb | 0.65 K/W - Low thermal resistance allows >200 W power dissipation with moderate heatsinking (e.g., 25 °C ambient → ~100 °C junction at 150 W). |
Pinout & Package
SOT404 (D2PAK) surface-mount package with exposed drain-connected mounting base; pin 2 is internal and inaccessible - only pins 1 (gate), 3 (source), and tab (drain) are externally accessible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Control terminal; requires ESD protection; driven by logic-level signal (VGS ≤ ±15 V max). |
| Pin 3 | Source | Reference node for gate drive; connects to power ground or low-side switch return path. |
| Tab (Drain) | Drain | Main high-side current path; electrically and thermally connected to PCB copper pour or heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ technology | Enables lowest RDS(ON) per silicon area in 55 V class, reducing die size and cost without sacrificing ruggedness. |
| Logic-level gate drive | VGS(TO) = 1.0–2.0 V ensures full enhancement with 3.3 V/5 V controllers, eliminating gate driver ICs in many designs. |
| Low Qg/Qgd ratio | Qgd/Qg ≈ 50 % (52/103 nC) improves Miller immunity and enables stable high-speed switching up to 500 kHz. |
| Robust body diode | VSD = 0.85–1.2 V at 25 A and trr = 80 ns support efficient synchronous rectification in LLC and phase-shifted full-bridge converters. |
| Avalanche-rated | Rated for 268 mJ non-repetitive avalanche energy - withstands transient overvoltage events without failure in unclamped inductive loads. |
Applications
| DC-DC Converter Primary Switch | High-Current Synchronous Rectifier |
|---|---|
Use Scenario: High-efficiency 12 V–48 V input buck converter delivering 50–100 A to server VRMs or telecom power modules. IC Role / Device Role / Timing Role: Main high-side switching element operating at 200–500 kHz with gate drive synchronized to controller PWM output. Use Value: 5.8 mΩ RDS(ON) minimizes conduction loss; 103 nC Qg enables fast, low-loss transitions; 0.65 K/W Rth j-mb sustains thermal stability under sustained load. |
Use Scenario: Secondary-side rectification in isolated forward or LLC resonant converters for 12 V or 5 V outputs in industrial PSUs. IC Role / Device Role / Timing Role: Low-side synchronous rectifier driven by dedicated gate driver or controller's complementary output. Use Value: Body diode trr = 80 ns prevents cross-conduction loss; low VSD (0.85 V) reduces forward drop vs. Schottky alternatives; 75 A IS supports high-current outputs. |
| Motor Drive Half-Bridge Leg | Hot-Swap ORing FET |
Use Scenario: 24–48 V BLDC motor inverter leg handling peak currents up to 150 A in e-bike or power tool applications. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration; commutated at variable frequency up to 20 kHz. Use Value: Avalanche rating (268 mJ) absorbs inductive kickback during PWM dead-time; 75 A ID supports short-term overload; SOT404 footprint enables dense layout. |
Use Scenario: Redundant 48 V power supply ORing in telecom or datacom backplanes requiring fault isolation and low insertion loss. IC Role / Device Role / Timing Role: Back-to-back configured N-channel FET acting as ideal diode with active gate control. Use Value: Logic-level VGS(TO) simplifies gate biasing from supply monitor ICs; low RDS(ON) limits voltage drop to <10 mV at 50 A; thermal robustness ensures reliability during hot-plug events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP75NF55 | TO-220 package (SOT78); higher RDS(ON) (6.5 mΩ @ 10 V); same VDSS/ID ratings. | Requires through-hole assembly and larger heatsink; less suitable for space-constrained SMT designs. | Choose when legacy TO-220 layout compatibility or lower unit cost outweighs SMT density benefits. |
| IRF1405PBF | Higher RDS(ON) (5.3 mΩ @ 10 V but 7.5 mΩ @ 5 V); TO-220 package; no specified avalanche energy rating. | Limited suitability for hard-switched or inductive-load applications due to missing EAS spec. | Prefer only in low-frequency, low-stress linear or switching applications where avalanche immunity is not required. |
Compared with STP75NF55 and IRF1405PBF, PSMN005-55B,118 delivers superior thermal performance (0.65 K/W vs. ≥1.0 K/W), verified avalanche ruggedness (268 mJ), and true logic-level operation down to 4.5 V gate drive - making it optimal for high-density, high-reliability SMT power stages.
Availability
PSMN005-55B,118 is available at Aetrix Electronics and suitable for d.c.-to-d.c. converters, switched-mode power supplies, and motor drive inverters requiring stable component supply, long-lifecycle availability, and traceable sourcing.
Supply support for PSMN005-55B,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, headquartered in Eindhoven, Netherlands, develops high-performance analog and power semiconductors for automotive, industrial, and computing markets.
The PSMN005-55B,118 belongs to NXP's SiliconMAX™ TrenchMOS™ portfolio, engineered specifically for high-current, high-efficiency power conversion in space-constrained applications where low RDS(ON), fast switching, and thermal resilience are essential.
FAQ
What is the maximum gate-source voltage rating for PSMN005-55B,118?
The PSMN005-55B,118 has a continuous gate-source voltage rating of ±15 V and a peak pulsed rating of ±20 V at Tj ≤ 150 °C. Exceeding ±15 V continuously risks gate oxide degradation; transient spikes must be clamped below ±20 V using Zener diodes or gate drivers with built-in protection. This specification is confirmed in the Absolute Maximum Ratings table of the October 1999 datasheet.
Can PSMN005-55B,118 operate reliably with a 3.3 V gate drive?
Yes - PSMN005-55B,118 is a logic-level MOSFET with VGS(TO) = 1.0–2.0 V at 25 °C, ensuring full enhancement at 3.3 V. At VGS = 3.3 V, RDS(ON) increases to ~9.5 mΩ (interpolated from 4.5 V/6.7 mΩ and 5 V/6.3 mΩ data), which remains usable in medium-duty-cycle applications. The PSMN005-55B,118 datasheet confirms operation down to 4.5 V, validating 3.3 V feasibility with appropriate derating.
What is the thermal resistance from junction to mounting base for PSMN005-55B,118?
The thermal resistance from junction to mounting base (Rth j-mb) for PSMN005-55B,118 is 0.65 K/W maximum, as specified in the Thermal Resistances section of the datasheet. This value assumes proper soldering of the exposed drain tab to a minimum 10 cm² copper pour on a 2-layer PCB. The PSMN005-55B,118 achieves this low Rth via direct die-to-tab thermal path in the SOT404 package.
Does PSMN005-55B,118 have a specified avalanche energy rating?
Yes - PSMN005-55B,118 is rated for 268 mJ of non-repetitive avalanche energy (EAS) under unclamped inductive load conditions (IAS = 75 A, tp = 100 µs, VDD ≤ 15 V). This rating is explicitly listed in the Avalanche Energy Limiting Values table and confirms ruggedness against transient overvoltage events common in hard-switched power converters.
How does the body diode performance of PSMN005-55B,118 compare to discrete Schottky diodes?
The PSMN005-55B,118 body diode has VSD = 0.85–1.2 V at 25–75 A and trr = 80 ns, offering lower forward voltage than typical 45 V Schottkys (≥0.5 V) at high current but slower recovery than ultrafast Schottkys (<30 ns). Its integrated nature eliminates extra footprint and parasitic inductance, making it ideal for synchronous rectification where timing control and layout simplicity outweigh marginal VF advantages of discrete diodes.
PSMN005-55B,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.8mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 103 nC @ 5 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6500 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PSMN005-55B,118 FAQ
1.How can I place an order for PSMN005-55B,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN005-55B,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN005-55B,118 reliable?
The price and inventory of PSMN005-55B,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN005-55B,118 is usually 5 days.
3.What payment methods are accepted for PSMN005-55B,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN005-55B,118 transactions.
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4.How is shipping managed for PSMN005-55B,118?
PSMN005-55B,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN005-55B,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN005-55B,118?
For technical support, including PSMN005-55B,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN005-55B,118 requirements.
6.How does Aetrix verify that PSMN005-55B,118 is sourced from the original manufacturer or authorized distributors?
All PSMN005-55B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN005-55B,118 meets industry standards.
7.What is the process for return or replacement of PSMN005-55B,118?
All PSMN005-55B,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN005-55B,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN005-55B,118 part is unused and in its original packaging.
Return procedure for PSMN005-55B,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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