Nexperia USA Inc. PSMN005-75P,127
- Part No.:
- PSMN005-75P,127
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
PSMN005-75P,127.pdf
- Description:
- MOSFET N-CH 75V 75A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:2,934
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Product details
Overview
PSMN005-75P from Nexperia is a standard-level N-channel TrenchMOS power MOSFET in TO-220AB (SOT78) package, designed for high-current, high-frequency switching in DC-DC converters and OR-ing circuits. It delivers 75 V VDS, 75 A ID (Tmb = 25 °C), and 4.3 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, enabling low conduction loss in computing and industrial power rails.
For engineers reviewing the PSMN005-75P datasheet, PSMN005-75P pinout, PSMN005-75P application, or PSMN005-75P equivalent, key selection criteria include its 0.65 K/W Rth(j-mb), 50 nC QGD, 165 nC QG(tot), avalanche energy rating of 500 mJ, and thermal stability up to 175 °C junction temperature.
Technical Context
This device uses TrenchMOS silicon technology to achieve low RDS(on) and fast switching with 37 ns td(on), 73 ns tr, 144 ns td(off), and 74 ns tf. Its gate threshold voltage ranges from 1 V (Tj = 175 °C) to 4.4 V (Tj = −55 °C), supporting robust turn-on control across wide temperature extremes.
The integrated body diode exhibits VSD = 1.0 V at IS = 25 A and Tj = 25 °C, and supports 75 A continuous source current. Avalanche ruggedness is specified at 500 mJ (unclamped, 0.1 ms pulse), enabling reliable operation under inductive load transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V - Maximum drain-source blocking voltage; defines safe operating range in 48 V and 54 V bus systems. |
| RDS(on) | 4.3 mΩ (typ, VGS = 10 V, ID = 25 A, Tj = 25 °C) - Enables <1.5 W conduction loss at 60 A, critical for high-efficiency VRMs. |
| ID | 75 A (continuous, Tmb = 25 °C) - Supports high-current phases in multi-phase CPU/GPU VRMs without parallel devices. |
| QGD | 50 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency. |
| Rth(j-mb) | 0.65 K/W - Junction-to-mounting-base thermal resistance enables direct heatsink mounting for >200 W dissipation capability. |
| EAS | 500 mJ - Non-repetitive avalanche energy rating ensures survivability during unclamped inductive turn-off events. |
Pinout & Package
PSMN005-75P is housed in a plastic TO-220AB (SOT78) package with isolated mounting base, optimized for heatsink attachment via single mounting hole. The package provides mechanical robustness and thermal performance suitable for industrial-grade power conversion.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - G | Gate | Control terminal; requires ≤20 V gate drive; 100 nA IGSS leakage ensures low standby power. |
| 2 - D | Drain | Main high-side current path; electrically connected to mounting base; must be isolated from heatsink unless referenced to same potential. |
| 3 - S | Source | Power return and reference node; ties gate drive return; forms common node for current sensing and feedback. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) | 4.3 mΩ typ at 10 V drive enables <1.5 W conduction loss at 60 A, reducing thermal burden in dense VRM layouts. |
| Fast switching | 37 ns td(on) + 73 ns tr + 144 ns td(off) + 74 ns tf supports >500 kHz switching in synchronous buck topologies. |
| TrenchMOS silicon | Enables superior cell density and lower gate charge vs planar MOSFETs, improving figure-of-merit (RDS(on) × QG). |
| Avalanche-rated | 500 mJ EAS allows safe operation under unclamped inductive switching without external snubbers in OR-ing and hot-swap designs. |
Applications
| Server VRM Phase FET | OR-ing Diode Replacement |
|---|---|
|
Use Scenario: High-current, multi-phase voltage regulator module supplying CPU/GPU cores in 1U/2U rack servers. IC Role / Device Role / Timing Role: High-side synchronous rectifier in buck converter phase leg, switching at 300–600 kHz with precise gate timing. Use Value: 4.3 mΩ RDS(on) reduces conduction loss by >40% vs legacy 8 mΩ parts, directly lowering board temperature rise and cooling cost. |
Use Scenario: Redundant 12 V/48 V power supply backplane where two supplies feed a common rail with automatic fault isolation. IC Role / Device Role / Timing Role: Active OR-ing switch replacing Schottky diodes; controlled via external gate driver to minimize forward drop. Use Value: 1.0 V VSD at 25 A cuts forward voltage drop by ~500 mV vs 1500 mV Schottky, reducing power loss by >12 W per rail at 25 A. |
| Industrial DC-DC Converter | Hot-Swap Controller Interface |
|
Use Scenario: 48 V input to 12 V output isolated DC-DC converter in programmable logic controller (PLC) power subsystems. IC Role / Device Role / Timing Role: Primary-side high-side switch in active clamp forward or LLC resonant topology, operating at 200–400 kHz. Use Value: 0.65 K/W Rth(j-mb) allows direct heatsink mounting without thermal interface material, simplifying mechanical design and improving long-term reliability. |
Use Scenario: Inrush current limiting and fault isolation in hot-pluggable I/O modules compliant with IEEE 1621 or IPC-9592. IC Role / Device Role / Timing Role: Load switch controlled by hot-swap controller (e.g., LTC4215) to manage turn-on slew rate and overcurrent shutdown. Use Value: 400 A peak drain current (tp ≤ 10 µs) withstands high dI/dt surges during capacitive load insertion without failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFB4115PBF | RDS(on) = 5.0 mΩ (VGS = 10 V); QG = 190 nC; Rth(j-mb) = 0.75 K/W; TO-220AB package. | Higher gate charge increases switching loss in >300 kHz designs; slightly higher thermal resistance limits power density. | Preferred where gate drive strength exceeds 2 A and thermal margin >0.1 K/W is available. |
| STP75NF75 | RDS(on) = 7.5 mΩ (VGS = 10 V); QG = 120 nC; Rth(j-mb) = 0.60 K/W; TO-220FP (full-pack) variant. | Higher on-resistance increases conduction loss by ~75% at 60 A; lower QG benefits gate drive simplicity but not overall efficiency. | Selected when cost sensitivity outweighs efficiency targets and heatsink mounting is constrained by full-pack insulation. |
Compared with IRFB4115PBF and STP75NF75, PSMN005-75P offers the lowest RDS(on) and best RDS(on) × QG figure-of-merit among TO-220AB N-channel 75 V MOSFETs, making it optimal for high-efficiency, high-power-density server and industrial DC-DC designs.
Availability
PSMN005-75P is available at Aetrix Electronics and suitable for server VRMs, redundant OR-ing power systems, and industrial DC-DC converters requiring stable component supply and long-lifecycle support.
Supply support for PSMN005-75P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.
This part belongs to the SiliconMAX standard-level TrenchMOS family, engineered specifically for high-current, high-frequency power conversion in computing and industrial infrastructure where efficiency, thermal robustness, and avalanche tolerance are critical.
FAQ
Is PSMN005-75P suitable for synchronous rectification in a 48 V to 12 V buck converter?
Yes. With 4.3 mΩ RDS(on) at 10 V gate drive and 50 nC QGD, it achieves low conduction and switching losses at 300–500 kHz. Its 75 A continuous rating supports ≥60 A output current per phase, and the TO-220AB package enables direct heatsink mounting for thermal management in compact VRM layouts.
What is the maximum safe operating temperature for continuous use?
The absolute maximum junction temperature is 175 °C, and the device is rated for continuous operation at Tj = 175 °C with derated current. At Tmb = 100 °C, the continuous drain current remains 75 A (per Figure 1), confirming suitability for thermally demanding industrial environments with forced-air or heatsink cooling.
Does PSMN005-75P require a negative gate voltage for reliable turn-off?
No. Gate-source voltage is rated from −20 V to +20 V, but turn-off is fully achieved at VGS = 0 V due to its 2–4 V VGS(th) at 25 °C. A negative gate bias is unnecessary for standard operation, though −5 V may improve noise immunity in high-dI/dt environments.
Can this MOSFET replace a Schottky diode in an OR-ing application without gate drive complexity?
No - it requires active gate control. Unlike ideal diode controllers with integrated drivers, PSMN005-75P needs an external gate driver (e.g., LM5050-1 or LTC4412) to sense forward voltage and drive the gate. Its benefit lies in <1.0 V forward drop vs >0.45 V for Schottkys, but gate control is mandatory for bidirectional blocking and fast reverse recovery.
PSMN005-75P,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 165 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 8250 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
PSMN005-75P,127 FAQ
1.How can I place an order for PSMN005-75P,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN005-75P,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that PSMN005-75P,127 is sourced from the original manufacturer or authorized distributors?
All PSMN005-75P,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN005-75P,127 meets industry standards.
7.What is the process for return or replacement of PSMN005-75P,127?
All PSMN005-75P,127 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN005-75P,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN005-75P,127 part is unused and in its original packaging.
Return procedure for PSMN005-75P,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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