Nexperia USA Inc. PSMN008-75B,118
- Part No.:
- PSMN008-75B,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PSMN008-75B,118.pdf
- Description:
- MOSFET N-CH 75V 75A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,951
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Product details
Overview
PSMN008-75B from Nexperia is an N-channel TrenchMOS SiliconMAX standard-level power MOSFET in SOT404 (D2PAK) package, rated for 75 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 230 W total power dissipation. It features 6.5 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C, low thermal resistance (Rth(j-mb) = 0.65 K/W), and avalanche ruggedness (EAS = 395 mJ), targeting high-efficiency DC-to-DC converters and UPS systems.
For engineers reviewing the PSMN008-75B datasheet, PSMN008-75B pinout, PSMN008-75B application, or PSMN008-75B equivalent, key selection criteria include its 75 V blocking capability, 6.5–8.5 mΩ RDS(on) range across temperature, fast switching (td(on) = 18 ns, tf = 80 ns), and mounting-base thermal interface optimized for high-power PCB layouts.
Technical Context
This MOSFET employs TrenchMOS silicon technology to achieve low on-resistance and high current density in a surface-mount D2PAK package with integrated mounting base connected to drain. Its gate threshold voltage ranges from 2–4 V at 25 °C and remains functional up to 175 °C junction temperature, supporting stable operation in thermally demanding industrial power stages.
The device exhibits fast dynamic performance: QGD = 50 nC, QG(tot) = 122.8 nC, and Ciss = 5260 pF at VDS = 25 V, enabling efficient high-frequency switching in synchronous buck converters and motor drive half-bridges where gate drive loss and Miller effect must be minimized.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V maximum drain-source voltage - defines safe operating voltage ceiling in DC-link and flyback applications. |
| RDS(on) | 6.5 mΩ typ @ VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1.6 W conduction loss at 25 A, critical for thermal management. |
| ID | 75 A continuous drain current @ Tmb = 25 °C - supports high-current output stages without forced air cooling. |
| Rth(j-mb) | 0.65 K/W junction-to-mounting-base thermal resistance - allows direct heatsink attachment via metal tab for efficient heat extraction. |
| EAS | 395 mJ non-repetitive avalanche energy @ ID = 63 A - provides robustness against inductive switching transients in unclamped circuits. |
| QGD | 50 nC gate-drain charge - directly impacts Miller plateau duration and turn-off speed in hard-switched topologies. |
| tf | 80 ns fall time @ VDS = 38 V, RG(ext) = 10 Ω - reduces switching losses during high-frequency PWM operation. |
Pinout & Package
SOT404 (D2PAK) plastic single-ended surface-mounted package with isolated leads and integral metal mounting base electrically connected to drain terminal. Mounting base enables low-thermal-resistance mechanical attachment to heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control electrode; requires 10 V drive for full enhancement; gate leakage <100 nA at ±20 V. |
| 2 (D) | Drain | Main high-side current path; internally bonded to mounting base - must be electrically isolated from PCB ground plane. |
| 3 (S) | Source | Reference node for gate drive and current sensing; forms return path for load current and body diode conduction. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) with TrenchMOS | 6.5 mΩ typ enables <1.6 W conduction loss at 25 A, reducing thermal design burden in compact power modules. |
| Mounting-base thermal interface | Rth(j-mb) = 0.65 K/W allows direct heatsink coupling - eliminates need for thermal vias or complex copper pours. |
| Avalanche-rated ruggedness | 395 mJ EAS supports reliable operation in inductive load switching without external snubbers. |
| Fast switching dynamics | QGD/QG(tot) ratio of ~0.4 enables clean turn-off with minimal Miller-induced shoot-through risk. |
| High-temperature gate stability | VGS(th) shifts only from 2–4 V (25 °C) to 1–4.4 V (-55 to 175 °C), ensuring predictable turn-on across automotive-grade thermal range. |
Applications
| DC-DC Converters | Uninterruptible Power Supplies (UPS) |
|---|---|
Use Scenario: High-current synchronous buck converter in server VRMs or telecom POL modules. IC Role / Device Role / Timing Role: Primary high-side switching element handling 50–75 A load current at 100–500 kHz switching frequency. Use Value: Low RDS(on) and fast tf reduce conduction + switching losses, improving efficiency above 94% at full load. |
Use Scenario: Inverter stage in line-interactive UPS delivering 1–3 kVA output. IC Role / Device Role / Timing Role: Half-bridge switch in H-bridge inverter driving transformer-coupled AC output. Use Value: Avalanche rating absorbs inductive kickback during battery switchover; mounting base simplifies heatsinking in space-constrained enclosures. |
| Motor Drive Half-Bridges | Industrial SMPS Front-Ends |
Use Scenario: 24–48 V BLDC motor controller for HVAC blowers or conveyor drives. IC Role / Device Role / Timing Role: Low-side or high-side switch in three-phase inverter leg, commutated at ≤20 kHz. Use Value: Fast trr (70 ns) and low Qr (100 nC) minimize body diode reverse recovery losses during freewheeling. |
Use Scenario: Active clamp forward or LLC resonant converter in industrial 48 V/12 V auxiliary supplies. IC Role / Device Role / Timing Role: Main switching FET in primary-side power stage operating at 200–400 kHz. Use Value: High Ciss/Coss ratio (5260/525 pF) supports ZVS transition; 75 V rating accommodates 48 V input with margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFB4110PBF | 75 V VDS, 100 A ID, RDS(on) = 5.8 mΩ, TO-220 package, no mounting base. | Lacks integrated mounting base; requires insulating hardware and higher Rth(j-c) (~1.0 K/W). | Preferred where board-level heatsinking is impractical but TO-220 mechanical retention is acceptable. |
| STP75NF75 | 75 V VDS, 75 A ID, RDS(on) = 10.5 mΩ, TO-220 package, higher RDS(on) and slower switching. | Higher conduction loss (+2.5 W at 25 A); unsuitable for >200 kHz designs due to higher QGD. | Lower-cost option for lower-frequency (<100 kHz), lower-efficiency industrial SMPS where thermal margin exists. |
Compared with IRFB4110PBF and STP75NF75, PSMN008-75B delivers superior thermal performance via its mounting-base interface and tighter RDS(on) tolerance, making it optimal for high-density, high-efficiency power stages where PCB real estate and thermal headroom are constrained.
Availability
PSMN008-75B is available at Aetrix Electronics and suitable for DC-to-DC converters, uninterruptible power supplies, and motor drive half-bridges requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for PSMN008-75B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, serving automotive, industrial, and computing markets with ISO/TS 16949-certified manufacturing.
This device belongs to the SiliconMAX standard-level TrenchMOS family, engineered for high-current, high-efficiency power conversion in cost-sensitive industrial and communications infrastructure applications.
FAQ
What is the maximum continuous drain current rating for PSMN008-75B?
The PSMN008-75B is rated for 75 A continuous drain current at mounting base temperature (Tmb) = 25 °C with VGS = 10 V. Derating applies above 25 °C: current drops to ~40 A at Tmb = 100 °C per Figure 1 in the datasheet. Peak pulsed current is 240 A for tp ≤10 µs.
Is the mounting base electrically isolated from the PCB?
No - the mounting base is internally connected to the drain terminal (Pin 2), as confirmed in Table 2 and Figure 14. When mounted to a heatsink, the drain node becomes electrically tied to that heatsink; isolation requires insulating hardware (e.g., silicone pads, ceramic washers) and careful layout to avoid shorting to ground planes.
Does PSMN008-75B support gate drive at 5 V logic levels?
No - the gate threshold voltage (VGS(th)) is 2–4 V at 25 °C, but full enhancement requires ≥10 V to achieve specified RDS(on). At 5 V, RDS(on) increases significantly (>25 mΩ), causing excessive conduction loss; use with 10 V gate drivers only.
What is the significance of the "SiliconMAX standard level" designation?
"SiliconMAX standard level" indicates this MOSFET is optimized for 10 V gate drive (not logic-level), targets industrial/commercial temperature range (−55 to +175 °C), and emphasizes ruggedness (avalanche rating, high ID/IDM) over ultra-low RDS(on) - distinguishing it from logic-level or automotive-qualified variants in Nexperia's portfolio.
PSMN008-75B,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 8.5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 122.8 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5260 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PSMN008-75B,118 FAQ
1.How can I place an order for PSMN008-75B,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN008-75B,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN008-75B,118 reliable?
The price and inventory of PSMN008-75B,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN008-75B,118 is usually 5 days.
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6.How does Aetrix verify that PSMN008-75B,118 is sourced from the original manufacturer or authorized distributors?
All PSMN008-75B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN008-75B,118 meets industry standards.
7.What is the process for return or replacement of PSMN008-75B,118?
All PSMN008-75B,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN008-75B,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN008-75B,118 part is unused and in its original packaging.
Return procedure for PSMN008-75B,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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