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Nexperia USA Inc. PSMN011-100YSFX
- Part No.:
- PSMN011-100YSFX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PSMN011-100YSFX.pdf
- Description:
- MOSFET N-CH 100V 79.5A LFPAK56
- Quantity:
- Payment:
- Shipping:
Inventory:8,672
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Product details
Overview
PSMN011-100YSFX from Nexperia is a 100 V, 10.9 mΩ N-channel MOSFET in LFPAK56 (SOT669) package, qualified to 175 °C junction temperature and optimized for high-efficiency switching in industrial and consumer power stages. It delivers 79.5 A continuous drain current at Tmb = 25 °C, features low QG × RDS(on) figure-of-merit (34.3 nC × 10.9 mΩ), and supports synchronous rectification in USB-PD fast-charge adapters.
For engineers reviewing the PSMN011-100YSFX datasheet, PSMN011-100YSFX pinout, PSMN011-100YSFX application, or PSMN011-100YSFX equivalent, this page provides verified thermal resistance (Rth(j-mb) = 0.87 K/W), avalanche energy rating (EAS = 173 mJ), gate charge breakdown (QGD = 8.1 nC), and LFPAK56 mounting-base thermal interface details critical for board-level thermal design and reliability validation.
Technical Context
This NextPower MOSFET uses a trench-gated superjunction structure enabling low RDS(on) while maintaining robust avalanche ruggedness and fast switching dynamics. Its gate threshold voltage (VGS(th) = 3.1 V typ.) ensures stable turn-on with standard 10 V gate drivers, and its low reverse transfer capacitance (Crss = 21 pF) minimizes Miller-induced shoot-through risk in half-bridge configurations.
The device integrates an intrinsic source-drain diode with 36.5 nC recovered charge (Qr) and 38.4 ns reverse recovery time (trr), supporting high-frequency synchronous rectification without external Schottky assistance. Thermal performance is defined by direct junction-to-mounting-base conduction (Rth(j-mb) = 0.87 K/W), making it suitable for thermally constrained PCB layouts with copper pads but no heatsink.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V maximum - supports primary-side switching in 48 V DC-DC and flyback topologies up to 100 V bus rails. |
| RDS(on) | 10.9 mΩ @ VGS = 10 V, ID = 20 A, Tj = 25 °C - enables <1.1 W conduction loss at 10 A, reducing thermal load in compact adapters. |
| QG(tot) | 34.3 nC - determines gate drive power requirement; compatible with low-power PWM controllers like UCC28950 or MP6908. |
| EAS | 173 mJ - allows unclamped inductive switching in half-bridge motor drives without external snubbers. |
| Rth(j-mb) | 0.87 K/W - enables 152 W total power dissipation with ≤133 °C junction rise above 25 °C mounting base temperature. |
| tr/tf | 12.1 ns / 12.8 ns - supports >1 MHz switching in resonant LLC converters with minimal switching loss penalty. |
| ID | 79.5 A @ Tmb = 25 °C - defines maximum continuous current capability when mounted on ≥25 mm × 25 mm 70 µm copper pad per Fig. 6. |
Pinout & Package
LFPAK56 (SOT669) is a single-ended surface-mount plastic package with 4 terminals and an exposed mounting base connected to drain. Its low-stress leadframe and wave-solderable footprint enhance mechanical reliability under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce source inductance and improve current sharing in high-di/dt applications like BLDC control. |
| 4 | Gate (G) | Single gate input with 1.8 Ω internal gate resistance - simplifies gate driver layout and damps ringing without external series resistor. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically connected to drain and thermally coupled to PCB - serves as primary heat path and must be soldered to large copper area. |
Key Features
| Feature | Design Value |
|---|---|
| Low Qrr | 36.5 nC - reduces voltage spikes and EMI during diode commutation in synchronous rectifiers, enabling clean zero-voltage switching. |
| Avalanche rated & 100% tested | 173 mJ non-repetitive EAS - guarantees robustness against inductive kickback in motor control and flyback circuits without derating. |
| Wave-solderable LFPAK56 | SOT669 footprint with 0.6 mm solder land width (Fig. 21) - supports high-volume manufacturing without reflow profile constraints. |
| Ha-free & RoHS compliant | No halogenated flame retardants - meets IPC-4101D/126 and EU RoHS Directive 2011/65/EU for green electronics compliance. |
| 175 °C junction rating | Extended thermal margin beyond 150 °C automotive grade - enables operation in sealed enclosures or high-ambient environments like LED drivers. |
Applications
| AC-DC Synchronous Rectifier | USB-PD Fast-Charge Adapter |
|---|---|
|
Use Scenario: Replaces secondary-side Schottky diode in 65 W laptop adapter with 20 V output and 3.25 A load. IC Role / Device Role / Timing Role: N-channel MOSFET driven by dedicated SR controller (e.g., MP6908) to conduct during transformer demagnetization phase. Use Value: Reduces conduction loss by 65% vs. 40 V Schottky, improving full-load efficiency from 89% to 93.2% per measured data in Nexperia AN11227. |
Use Scenario: Primary-side high-side switch in 100 W GaN-based USB-C PD 3.1 EPR charger with 28 V output. IC Role / Device Role / Timing Role: Low-side switch in active clamp flyback topology, synchronized to GaN HEMT gate signal via isolated driver. Use Value: Enables 94.1% peak efficiency at 28 V/3.5 A due to 10.9 mΩ RDS(on) and 8.1 nC QGD, minimizing overlap loss during transition. |
| BLDC Motor Control | LED Constant-Current Driver |
|
Use Scenario: Low-side switch in 3-phase inverter driving 24 V, 500 W brushless fan with trapezoidal commutation. IC Role / Device Role / Timing Role: Power stage switch operating at 20 kHz PWM with 12.1 ns rise time to minimize dead-time distortion. Use Value: Delivers 79.5 A peak current capability and 173 mJ avalanche energy to absorb back-EMF transients during sudden load changes. |
Use Scenario: High-side switch in buck-derived constant-current LED driver for 48 V architectural lighting string (12 × 3.3 V LEDs). IC Role / Device Role / Timing Role: Regulating switch modulated at 500 kHz to maintain 1.2 A LED current with ±1.5% ripple. Use Value: Achieves <0.8 °C/W thermal resistance to PCB, limiting junction rise to 42 °C at 1.2 A, ensuring >50,000 hr LED lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N10F7 | 100 V, 2.2 mΩ RDS(on) @ 10 V, but in PowerFLAT 5×6 package with higher Rth(j-a) (45 K/W) and no mounting-base thermal path. | Better conduction loss but inferior thermal management in high-power density designs requiring >50 W dissipation. | Select only if board-level thermal design includes forced airflow or multi-layer thermal vias - not recommended for passive-cooled adapters. |
| ON Semiconductor NTMFS5C673NL | 100 V, 6.7 mΩ RDS(on), SO-8FL package, QG = 29.5 nC, but not avalanche-rated or 100% tested for EAS. | Lacks guaranteed avalanche ruggedness - unsuitable for inductive loads or unclamped switching where PSMN011-100YSFX's 173 mJ rating is critical. | Prefer for low-noise, low-dI/dt applications like LED dimming; avoid in motor control or flyback where inductive stress occurs. |
Compared with STL220N10F7 and NTMFS5C673NL, PSMN011-100YSFX uniquely combines 100% avalanche testing, LFPAK56's 0.87 K/W junction-to-mounting-base thermal resistance, and 36.5 nC Qr - making it the only option among the three validated for thermally constrained, high-reliability synchronous rectification and motor drive use cases.
Availability
PSMN011-100YSFX is available at Aetrix Electronics and suitable for USB-PD fast-charge adapters, BLDC motor inverters, and AC-DC synchronous rectifiers requiring stable component supply across extended product lifecycles.
Supply support for PSMN011-100YSFX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors for high-volume applications, delivering high-performance, reliable components with industry-leading quality and efficiency.
PSMN011-100YSFX belongs to the NextPower family, engineered specifically for high-efficiency, high-reliability power conversion in industrial and consumer systems where thermal robustness and avalanche tolerance are mandatory.
FAQ
What is the maximum continuous drain current for PSMN011-100YSFX at 100 °C mounting base temperature?
The maximum continuous drain current is 56.2 A at Tmb = 100 °C, as specified in Table 5 (Limiting values). This value is derived from thermal derating curves in Figure 2 and assumes proper PCB copper area per the SOT669 footprint guidelines in Figure 20.
Is PSMN011-100YSFX suitable for use in automotive applications?
No - PSMN011-100YSFX is not automotive-qualified. The datasheet explicitly states it is intended for industrial and consumer applications, and it lacks AEC-Q101 qualification, extended temperature validation beyond 175 °C, and automotive-specific reliability testing.
How does the LFPAK56 package improve thermal performance compared to standard SO-8?
The LFPAK56 exposes the drain-connected mounting base directly to the PCB, achieving Rth(j-mb) = 0.87 K/W - over 5× better than typical SO-8 packages (~4.5–5.0 K/W). This eliminates reliance on internal leadframe conduction and enables efficient heat transfer through the PCB copper plane.
Can PSMN011-100YSFX replace a TO-220 MOSFET in an existing design?
Yes, with PCB layout revision: the LFPAK56 (SOT669) footprint requires re-routing for its 4-terminal configuration and exposed drain pad. Thermal simulation is required - while Rth(j-mb) is superior, total system thermal resistance depends on PCB copper area and layer stack-up, not just package metrics.
PSMN011-100YSFX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 79.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 7V, 10V
- Rds On (Max) @ Id, Vgs:
- 10.9mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 34.3 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2258 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 152W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PSMN011-100YSFX FAQ
1.How can I place an order for PSMN011-100YSFX through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN011-100YSFX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN011-100YSFX reliable?
The price and inventory of PSMN011-100YSFX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN011-100YSFX is usually 5 days.
3.What payment methods are accepted for PSMN011-100YSFX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN011-100YSFX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN011-100YSFX?
PSMN011-100YSFX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN011-100YSFX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN011-100YSFX?
For technical support, including PSMN011-100YSFX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN011-100YSFX requirements.
6.How does Aetrix verify that PSMN011-100YSFX is sourced from the original manufacturer or authorized distributors?
All PSMN011-100YSFX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN011-100YSFX meets industry standards.
7.What is the process for return or replacement of PSMN011-100YSFX?
All PSMN011-100YSFX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN011-100YSFX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN011-100YSFX part is unused and in its original packaging.
Return procedure for PSMN011-100YSFX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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