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Nexperia USA Inc. PSMN011-60HLX

Part No.:
PSMN011-60HLX
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
SOT-1205, 8-LFPAK56
Datasheet:
AetrixPSMN011-60HLX.pdf
Description:
MOSFET 2N-CH 60V 35A LFPAK56D
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,100

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Product details

Overview

PSMN011-60HL from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated 60 V VDS, 11.5 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, qualified to 175 °C junction temperature, and designed for high-efficiency synchronous rectification and brushless DC motor control.

For engineers reviewing the PSMN011-60HL datasheet, PSMN011-60HL pinout, PSMN011-60HL application, or PSMN011-60HL equivalent, this device supports dual-FET topologies requiring low conduction loss, repetitive avalanche capability, and robust thermal performance in compact surface-mount power stages.

Technical Context

This dual MOSFET integrates two identical N-channel TrenchMOS devices in a single LFPAK56D package with copper-clip die attach and solder die bonding, enabling independent gate control (G1/S1/D1 and G2/S2/D2) and shared mounting base thermal path. Its logic-level gate threshold (VGS(th) = 1.4–2.1 V typ.) ensures full enhancement with 5 V drive.

The device features repetitive avalanche rating up to 118 mJ per FET under defined conditions, and its normalized RDS(on) increases only ~2.2× from 25 °C to 175 °C, supporting stable operation across industrial temperature ranges without derating-induced current collapse.

Key Specifications

ParameterValue and Actual Design Meaning
VDS60 V - Maximum drain-source blocking voltage; defines upper limit for DC-to-DC converter input or motor phase voltage handling.
RDS(on) @ 5 V, 25 °C11.5 mΩ - Confirmed on-resistance at logic-level gate drive; enables <1.7 W conduction loss at 35 A continuous current.
ID @ 5 V, Tmb = 25 °C35 A - Package-limited continuous drain current; supported by low Rth(j-mb) = 2.21 K/W for direct heatsink coupling.
QG(tot)24.5 nC - Total gate charge at VGS = 5 V; determines switching energy and driver strength requirement for <100 ns turn-on/turn-off times.
EAS118 mJ - Non-repetitive avalanche energy per FET; supports fault tolerance in inductive load commutation without external snubbers.
Tj max175 °C - Maximum junction temperature rating; enables operation in server PSU or motor drive environments with minimal thermal margin loss.
Ciss3470 pF max - Input capacitance at VDS = 25 V; impacts gate drive loop stability and Miller effect during hard-switching transitions.

Pinout & Package

PSMN011-60HL uses the LFPAK56D (SOT1205) dual-power SO8 package: 8-pin surface-mount outline with exposed copper mounting base for enhanced thermal conduction and mechanical robustness. Dimensions: 4.95 × 5.30 mm footprint, 1.02 mm height, 0.65 mm lead pitch.

Pin/TerminalCircuit RoleDesign Meaning
1S1Source terminal of FET1 - referenced to local ground node in half-bridge or synchronous rectifier configuration.
2G1Gate terminal of FET1 - requires isolated 5 V logic-level drive; low QGD = 8.27 nC minimizes Miller-induced shoot-through risk.
3S2Source terminal of FET2 - electrically independent from S1; enables dual-channel control without common-source constraints.
4G2Gate terminal of FET2 - independently controllable; allows asymmetric PWM or complementary switching with dead-time management.
5, 6D2Drain terminal of FET2 - internally paralleled pins (5 & 6) reduce bond-wire inductance and improve current sharing in high-di/dt applications.
7, 8D1Drain terminal of FET1 - internally paralleled pins (7 & 8); supports >200 A peak pulsed current (IDM) with low parasitic inductance.

Key Features

FeatureDesign Value
Dual N-channel topologyTwo fully independent MOSFETs in one package - eliminates board space and layout complexity of discrete dual-FET solutions while maintaining separate gate control.
Repetitive avalanche rated118 mJ non-repetitive EAS per FET - enables reliable operation in BLDC motor phase commutation and flyback clamp circuits without external protection.
Copper-clip die attachReduces thermal resistance Rth(j-mb) to 2.21 K/W - delivers 3× better heat transfer than standard wire-bond packages, critical for high-power density server PSUs.
Logic-level gate driveVGS(th) = 1.4–2.1 V typ. - ensures full enhancement with standard 3.3 V or 5 V microcontroller GPIO, eliminating need for level-shifting or gate drivers.
175 °C qualificationRated for continuous operation up to Tj = 175 °C - supports extended lifetime in thermally constrained environments such as enclosed power supplies or automotive under-hood modules.

Applications

Brushless DC Motor ControlHigh-Efficiency Server PSU

Use Scenario: Three-phase inverter stage driving 48 V BLDC motors in industrial automation systems with 20 kHz PWM switching.

IC Role / Device Role / Timing Role: Dual-FET configured as high-side/low-side pair per phase leg; each FET handles bidirectional current with body diode conduction during dead time.

Use Value: Low 11.5 mΩ RDS(on) reduces I²R losses by >30% vs. comparable 20 mΩ MOSFETs, improving system efficiency from 92% to 94.5% at full load.

Use Scenario: Secondary-side synchronous rectification in 12 V output stage of 1.5 kW telecom rectifier with 500 kHz LLC resonance.

IC Role / Device Role / Timing Role: Dual-FET used in parallel per rectifier leg to halve effective RDS(on) and distribute thermal load across shared mounting base.

Use Value: Copper-clip construction and 2.21 K/W Rth(j-mb) enable 35 A continuous current without forced air, reducing heatsink size by 40% versus SO-8 alternatives.

DC-to-DC ConvertersHigh-Performance Synchronous Rectification

Use Scenario: 48 V–12 V buck converter in data center rack PDUs with 300 kHz fixed-frequency operation and 80 A output current.

IC Role / Device Role / Timing Role: Upper and lower switches implemented using one PSMN011-60HL per phase; gate timing controlled via dedicated controller with adaptive dead-time insertion.

Use Value: Matched dynamic parameters (QG, QGD) between FET1/FET2 ensure symmetrical switching behavior, minimizing cross-conduction losses and EMI generation.

Use Scenario: Isolated forward converter secondary side with 48 V input, 5 V/60 A output, operating in discontinuous conduction mode (DCM).

IC Role / Device Role / Timing Role: Dual-FET used as active rectifiers replacing Schottky diodes; body diode conduction replaced by synchronous gate drive during reverse recovery interval.

Use Value: 0.78 V typical VSD and 18.1 nC Qr enable faster reverse recovery than 45 V Schottkys, cutting rectifier losses by 2.1 W per leg at 25 °C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon BSC014N06LSSingle-channel 60 V, 14 mΩ MOSFET in SuperSO8; no integrated dual topology or avalanche rating.Requires two discrete devices and additional PCB area; lacks repetitive avalanche ruggedness for motor control.Select when needing higher voltage margin (65 V) or tighter RDS(on) tolerance, but accept added layout complexity and reduced fault tolerance.
Vishay SiZF300DTDual 30 V, 3.0 mΩ MOSFET in PowerPAIR 3x3; lower voltage rating and smaller package thermal mass.Not suitable for 48 V bus applications; limited to ≤30 V DC-DC or low-voltage motor drives.Choose only for sub-30 V systems where ultra-low RDS(on) and minimal footprint outweigh voltage and thermal limitations.

Compared with BSC014N06LS and SiZF300DT, PSMN011-60HL uniquely combines dual-FET integration, 60 V rating, 175 °C qualification, and repetitive avalanche capability in a thermally optimized LFPAK56D package-making it the only option among the three for high-reliability 48 V BLDC inverters and server synchronous rectifiers.

Availability

PSMN011-60HL is available at Aetrix Electronics and suitable for brushless DC motor control, high-efficiency server power supplies, DC-to-DC converters, and high-performance synchronous rectification requiring stable component supply and long-term industrial lifecycle support.

Supply support for PSMN011-60HL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency-enhancing components, delivering high-volume, high-reliability discrete and logic devices for automotive, industrial, and computing markets.

PSMN011-60HL belongs to Nexperia's TrenchMOS logic-level dual-FET product line, engineered specifically for high-density power conversion topologies demanding low RDS(on), robust thermal performance, and integrated dual-channel functionality without compromising ruggedness.

FAQ

What is the maximum continuous drain current for PSMN011-60HL at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current remains 35 A per FET, as specified in Figure 2 of the datasheet. This reflects package-limited current handling rather than silicon-limited conduction, enabled by the copper-clip construction and low Rth(j-mb) = 2.21 K/W.

Can PSMN011-60HL be used in a synchronous buck converter with 3.3 V gate drive?

Yes - its logic-level VGS(th) range (1.4–2.1 V typ.) and full enhancement at VGS = 3.3 V ensure reliable operation. At 3.3 V, RDS(on) rises to ~18 mΩ (extrapolated from Fig. 7), still supporting efficient operation up to ~25 A continuous current with appropriate thermal design.

How does the LFPAK56D package compare thermally to standard SO-8 for this device?

LFPAK56D achieves Rth(j-mb) = 2.21 K/W versus ~3.5–4.0 K/W for standard SO-8 equivalents. This 40% lower thermal resistance results from copper-clip die attach and direct metal mounting base contact, enabling 25% higher power dissipation at the same temperature rise.

Is PSMN011-60HL suitable for automotive applications?

No - the datasheet explicitly states this is a non-automotive qualified product. It is not tested to AEC-Q101, lacks automotive-grade process controls, and carries no automotive warranty. Use only in industrial, computing, or consumer applications where automotive qualification is not required.

PSMN011-60HLX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1205, 8-LFPAK56
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
60V
Current - Continuous Drain (Id) @ 25°C:
35A (Ta)
Rds On (Max) @ Id, Vgs:
10.7mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
24.5nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds:
3470pF @ 25V
Power - Max:
68W (Ta)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56D

PSMN011-60HLX FAQ

1.How can I place an order for PSMN011-60HLX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN011-60HLX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN011-60HLX reliable?

The price and inventory of PSMN011-60HLX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN011-60HLX is usually 5 days.

3.What payment methods are accepted for PSMN011-60HLX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN011-60HLX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN011-60HLX?

PSMN011-60HLX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN011-60HLX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN011-60HLX?

For technical support, including PSMN011-60HLX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN011-60HLX requirements.

6.How does Aetrix verify that PSMN011-60HLX is sourced from the original manufacturer or authorized distributors?

All PSMN011-60HLX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN011-60HLX meets industry standards.

7.What is the process for return or replacement of PSMN011-60HLX?

All PSMN011-60HLX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN011-60HLX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN011-60HLX part is unused and in its original packaging.

Return procedure for PSMN011-60HLX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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