Nexperia USA Inc. PSMN013-100PS,127
- Part No.:
- PSMN013-100PS,127
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
PSMN013-100PS,127.pdf
- Description:
- MOSFET N-CH 100V 68A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:3,294
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Product details
Overview
PSMN013-100PS from Nexperia is an N-channel standard-level MOSFET in TO-220AB (SOT78) package, rated for 100 V drain-source voltage, 13.9 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 68 A continuous drain current at Tmb = 25 °C, and qualified to 175 °C junction temperature. It serves as a high-current power switch in industrial DC-DC converters and server power supplies.
For engineers reviewing the PSMN013-100PS datasheet, PSMN013-100PS pinout, PSMN013-100PS application, or PSMN013-100PS equivalent, key selection criteria include its 100 V VDS, low 13.9 mΩ on-resistance at 25 °C, 170 W total power dissipation at Tmb = 25 °C, robust 128 mJ unclamped avalanche energy, and TO-220AB thermal performance with Rth(j-mb) = 0.5 K/W typical.
Technical Context
This MOSFET employs planar silicon technology optimized for standard gate drive (VGS = 10 V), delivering low conduction loss and enhanced dynamic avalanche ruggedness. Its gate threshold voltage ranges from 2 V to 4.6 V across -55 °C to 175 °C, enabling reliable turn-on under industrial temperature extremes.
The device features a mounting base (pin 2) electrically connected to the drain, supporting heatsink-integrated thermal management. Its dynamic characteristics-59 nC total gate charge, 17 nC gate-drain charge, and 25 ns rise time-support efficient switching in hard-switched topologies up to several hundred kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage before breakdown; defines use in 48 V and 60 V bus systems with margin. |
| RDS(on) | 13.9 mΩ @ VGS = 10 V, Tj = 25 °C - Low conduction loss enabling <1 W I²R loss at 27 A, critical for high-efficiency power stages. |
| ID | 68 A @ Tmb = 25 °C - Continuous current rating limited by TO-220AB package thermal capacity, not die capability. |
| Ptot | 170 W @ Tmb = 25 °C - Total power dissipation ceiling; requires active heatsinking for full-rated operation. |
| Rth(j-mb) | 0.5 K/W typical - Thermal resistance from junction to mounting base; enables ~85 W dissipation with 42.5 K rise above heatsink temperature. |
| EAS | 128 mJ unclamped - Non-repetitive avalanche energy; supports robustness against inductive switching transients in motor drives and SMPS. |
| QG(tot) | 59 nC - Total gate charge; determines gate driver current requirement (~1.2 A peak for 50 ns turn-on with 4.7 Ω external resistor). |
Pinout & Package
TO-220AB (SOT78) plastic single-ended package with heatsink mounting base; 3 leads, 1 mounting hole; mounting base electrically connected to drain terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control electrode; requires ≥10 V for full enhancement; 1 Ω internal AC gate resistance limits ringing. |
| 2 | Drain (D) / Mounting Base (mb) | Main high-side current path; mounting base is electrically tied to drain, requiring isolation when heatsink is grounded. |
| 3 | Source (S) | Reference node for gate drive and current sensing; source-drain diode VSD = 0.85 V @ 15 A, 25 °C. |
Key Features
| Feature | Design Value |
|---|---|
| Standard-level gate drive compatibility | Operates fully enhanced at VGS = 10 V, eliminating need for level-shifting or bootstrap circuits in 12 V/15 V control systems. |
| Enhanced dynamic avalanche ruggedness | 128 mJ EAS rating ensures survivability during unclamped inductive turn-off events common in motor control and relay driving. |
| High-temperature junction qualification | Rated for continuous operation up to Tj = 175 °C, supporting reliability in enclosed industrial enclosures without forced air cooling. |
| Low RDS(on) × QG figure of merit | 13.9 mΩ × 59 nC = 0.82 nΩ·F - Balances conduction and switching losses for medium-frequency (<500 kHz) hard-switched applications. |
Applications
| DC-to-DC Converters | Server Power Supplies |
|---|---|
Use Scenario: Primary-side switch in 48 V input, 12 V output isolated forward or half-bridge converter for telecom infrastructure. IC Role / Device Role / Timing Role: High-side synchronous rectifier replacement; handles 68 A pulsed drain current with 100 V blocking. Use Value: 13.9 mΩ RDS(on) reduces conduction loss by >30% vs. comparable 20 mΩ MOSFETs, improving full-load efficiency by ~0.8% at 50 A. | Use Scenario: OR-ing FET in redundant 12 V intermediate bus architecture for datacenter servers. IC Role / Device Role / Timing Role: Load switch controlling power path between parallel PSUs; operates in linear region during current balancing. Use Value: 175 °C Tj rating and 170 W Ptot support sustained 40 A operation with minimal derating in high-ambient server chassis. |
| Motor Control | Load Switching |
Use Scenario: Half-bridge high-side switch in 24 V brushed DC motor driver for industrial automation actuators. IC Role / Device Role / Timing Role: Power switch subjected to inductive kickback; must withstand repetitive avalanche stress during PWM commutation. Use Value: 128 mJ EAS enables reliable operation without snubbers in 500 W motor drives, reducing BOM count and board space. | Use Scenario: Main power disconnect switch for programmable logic controller (PLC) I/O module with 24 V DC field power. IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relay; switched at <1 Hz with high inrush current tolerance. Use Value: 272 A peak drain current (IDM) accommodates 10× inrush of capacitive loads, eliminating contact welding failure mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V, 110 A, 9.5 mΩ @ 10 V, TO-220FP package; lower RDS(on) but higher QG (85 nC); no mounting base isolation. | Higher current handling but requires larger heatsink due to FP package's higher Rth(j-a); unsuitable where mounting base must be isolated. | Select when max current >68 A is required and heatsink isolation is not needed. |
| IRF540NPBF | 100 V, 33 A, 44 mΩ @ 10 V, TO-220; older process, higher RDS(on), lower EAS (55 mJ), no 175 °C rating. | Limited to lower-power 24 V systems; insufficient avalanche margin for motor control; derates significantly above 100 °C ambient. | Select only for cost-sensitive, non-critical 24 V load switching where 175 °C operation is unnecessary. |
Compared with STP110N10F7, PSMN013-100PS offers superior thermal interface via isolated mounting base and better avalanche ruggedness, while IRF540NPBF trades performance for legacy compatibility and lower cost in non-demanding applications.
Availability
PSMN013-100PS is available at Aetrix Electronics and suitable for industrial motor control, server power supply design, DC-DC converter development, and programmable logic controller (PLC) load switching requiring stable component supply and long-term manufacturability.
Supply support for PSMN013-100PS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic solutions.
This device belongs to Nexperia's standard-level power MOSFET product line, engineered for industrial and communications equipment demanding robust thermal performance, avalanche tolerance, and compatibility with conventional 10 V gate drivers.
FAQ
Is PSMN013-100PS suitable for automotive applications?
No. The datasheet explicitly states this part is not automotive-qualified. It lacks AEC-Q101 stress testing, automotive-specific PPAP documentation, and guaranteed operation over -40 °C to +150 °C case temperature. Use only in industrial, computing, or communications equipment per its 175 °C junction rating and industrial qualification scope.
What is the maximum gate-source voltage rating for safe operation?
The absolute maximum VGS is ±20 V. Operation beyond this risks permanent gate oxide damage. For reliable long-term use, keep VGS within -12 V to +15 V under transient conditions, and limit steady-state drive to 10 V for standard-level enhancement. Gate driver output impedance must be low enough to prevent ringing-induced overshoot.
How does the mounting base connection affect PCB layout?
The mounting base (pin 2) is internally connected to the drain. When using a grounded heatsink, electrical isolation between heatsink and PCB ground plane is mandatory-typically achieved with mica or ceramic washers and shoulder washers. Failure to isolate causes short-circuit between drain and system ground, destroying the device and potentially downstream circuitry.
Can PSMN013-100PS replace a logic-level MOSFET in a 5 V gate drive circuit?
No. As a standard-level device, it requires ≥10 V VGS for full enhancement. At 5 V, RDS(on) rises sharply (>100 mΩ), causing excessive conduction loss and thermal runaway. It is incompatible with 3.3 V or 5 V microcontroller GPIO direct drive; a gate driver IC or level shifter is mandatory for proper operation.
PSMN013-100PS,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 68A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 13.9mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 59 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3195 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 170W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
PSMN013-100PS,127 FAQ
1.How can I place an order for PSMN013-100PS,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN013-100PS,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN013-100PS,127 reliable?
The price and inventory of PSMN013-100PS,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN013-100PS,127 is usually 5 days.
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6.How does Aetrix verify that PSMN013-100PS,127 is sourced from the original manufacturer or authorized distributors?
All PSMN013-100PS,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN013-100PS,127 meets industry standards.
7.What is the process for return or replacement of PSMN013-100PS,127?
All PSMN013-100PS,127 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN013-100PS,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN013-100PS,127 part is unused and in its original packaging.
Return procedure for PSMN013-100PS,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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