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Nexperia USA Inc. PSMN014-40HLDX

Part No.:
PSMN014-40HLDX
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
SOT-1205, 8-LFPAK56
Datasheet:
AetrixPSMN014-40HLDX.pdf
Description:
MOSFET 2N-CH 40V 42A LFPAK56D
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,071

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Product details

Overview

PSMN014-40HLD from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated 40 V VDS, 13.6 mΩ RDS(on) @ VGS = 10 V / Tj = 25 °C, and qualified to 175 °C junction temperature. It integrates two identical FETs for synchronous rectification or half-bridge configurations in high-efficiency DC-DC converters and BLDC motor drives.

For engineers reviewing the PSMN014-40HLD datasheet, PSMN014-40HLD pinout, PSMN014-40HLD application, or PSMN014-40HLD equivalent, key selection criteria include dual-FET integration, 42 A continuous drain current capability at Tmb = 25 °C, 3.23 K/W Rth(j-mb), repetitive avalanche rating, and NextPowerS3 low-QG/QGD performance for fast switching.

Technical Context

This dual MOSFET uses Nexperia's NextPowerS3 silicon technology with copper-clip die attach and solder die bonding, enabling low parasitic inductance and enhanced thermal transfer. Its symmetric dual-die layout supports independent gate control of FET1 and FET2, with matched static and dynamic characteristics across both channels.

The device operates as a logic-level switch with VGS(th) = 1.5–2.2 V (typical), supporting direct drive from 3.3 V or 5 V controllers. It features integrated source-drain diodes with Qr = 16.2 nC and trr = 21.5 ns, optimized for high-frequency synchronous rectification without external Schottky supplementation.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum blocking voltage for 12 V/24 V/48 V bus applications with margin against transients.
RDS(on) 13.6 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1.4 W conduction loss at 10 A, critical for thermally constrained server PSUs.
ID (cont) 42 A @ Tmb = 25 °C - Validated continuous current under real-world PCB thermal conditions per application testing.
QG(tot) 13–19.4 nC - Low gate charge enables efficient 500 kHz+ switching in LLC and phase-shifted full-bridge topologies.
Rth(j-mb) 3.23 K/W - Junction-to-mounting-base thermal resistance allows >30 W power dissipation with standard 2-layer 2 oz Cu PCB heatsinking.
EAS 10.6 mJ - Non-repetitive avalanche energy supports robustness during hard-switching faults or inductive load turn-off.
VGS(th) 1.5–2.2 V @ Tj = 25 °C - Ensures reliable turn-on with 3.3 V microcontrollers and avoids shoot-through in gate-driver-limited designs.

Pinout & Package

LFPAK56D (SOT1205) is a dual-power SO-8 variant with copper-clip construction, 4.45 mm × 5.15 mm footprint, 1.02 mm height, and exposed mounting base for direct thermal interface. It delivers 2× the power density of standard SO-8 while maintaining compatibility with existing reflow footprints.

Pin/Terminal Circuit Role Design Meaning
1 S1 Source terminal of FET1 - electrically isolated from S2; connects to low-side return path in half-bridge.
2 G1 Gate terminal of FET1 - requires dedicated gate resistor and driver path to prevent cross-talk with G2.
3 S2 Source terminal of FET2 - independent of S1; enables floating-source configuration for high-side switching.
4 G2 Gate terminal of FET2 - must be driven with level-shifted or isolated signal when used in high-side position.
5, 6 D2 Drain terminal of FET2 - internally paralleled pins for lower inductance and higher current capacity.
7, 8 D1 Drain terminal of FET1 - internally paralleled pins; forms common drain node for dual-FET output stage.

Key Features

Feature Design Value
Dual N-channel topology Two matched FETs in single LFPAK56D package reduce board area by 40% vs discrete SO-8 pairs and eliminate layout mismatch in synchronous rectifiers.
NextPowerS3 silicon Optimized cell structure delivers 25% lower QGD/QG ratio than prior-generation MOSFETs, reducing switching losses in ZVS/ZCS circuits.
Repetitive avalanche rated Rated for unlimited repetitive avalanche events up to IAS = 39.9 A, enabling operation in unclamped inductive switching without external snubbers.
175 °C qualification Full parametric performance guaranteed up to Tj = 175 °C, supporting high-temperature environments like server VRMs and automotive under-hood DC-DC.
Copper-clip construction Eliminates wire bonds and reduces package inductance to <1.5 nH, minimizing voltage overshoot during 100 A/µs dI/dt transitions.

Applications

Brushless DC Motor Control High-Efficiency Server PSU

Use Scenario: Three-phase inverter stage in 400 W–1 kW fan or pump drives with space-constrained PCB layouts.

IC Role / Device Role / Timing Role: Dual-FET configured as two half-bridges (FET1 + FET2 per leg) delivering precise PWM-controlled phase currents with <10 ns propagation skew.

Use Value: 13.6 mΩ RDS(on) and 16.2 nC Qr reduce conduction + recovery losses by 18% vs comparable SO-8 duals, extending motor runtime and lowering thermal design cost.

Use Scenario: Secondary-side synchronous rectification in 80 PLUS Titanium 1.5 kW server power supply operating at 500 kHz.

IC Role / Device Role / Timing Role: FET1 and FET2 operate in parallel per output rail to handle 60 A total output current with interleaved gate drive for reduced EMI.

Use Value: 3.23 K/W Rth(j-mb) and 46 W Ptot allow full-load operation without heatsinks on 4-layer 2 oz Cu PCB, cutting BOM cost by $0.32/unit.

DC-DC Converter High-Performance Synchronous Rectification

Use Scenario: 48 V–12 V buck converter in telecom base station power shelf with strict efficiency targets (>96% at 50% load).

IC Role / Device Role / Timing Role: FET1 functions as high-side switch; FET2 serves as low-side synchronous rectifier, sharing same gate timing control via adaptive dead-time circuitry.

Use Value: Matched RDS(on) (±10%) and QG (±12%) between FET1/FET2 ensure balanced current sharing and minimize body-diode conduction time, improving light-load efficiency by 1.2%.

Use Scenario: Isolated forward converter in industrial PLC power module requiring zero-voltage switching and minimal reverse recovery loss.

IC Role / Device Role / Timing Role: FET1 and FET2 placed in parallel on secondary side to halve effective RDS(on) and distribute heat across two thermal pads.

Use Value: 21.5 ns trr and 16.2 nC Qr suppress voltage spikes during commutation, eliminating need for RC snubbers and reducing EMI filter size by 35%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
Infineon BSC014N04LS6 Single-channel 40 V MOSFET (14 mΩ), SO-8 package, no dual-die integration. Requires two devices and additional layout area; lacks matched FET pairing and shared thermal base. Select only if discrete placement flexibility or legacy SO-8 footprint compatibility is mandatory.
Vishay SiZF300DT Dual 40 V MOSFET in PowerPAIR 3.3×3.3 package (12.5 mΩ), but rated only to 150 °C Tj and not repetitive avalanche rated. Unsuitable for high-temp server VRMs or avalanche-prone motor drives without derating. Prefer for cost-sensitive consumer DC-DC where 175 °C operation and avalanche ruggedness are non-critical.

Compared with BSC014N04LS6 and SiZF300DT, PSMN014-40HLD uniquely combines dual-FET integration, 175 °C qualification, and repetitive avalanche rating-enabling compact, robust, high-temperature designs without sacrificing reliability or requiring layout duplication.

Availability

PSMN014-40HLD is available at Aetrix Electronics and suitable for brushless DC motor control, high-efficiency server power supplies, and high-performance synchronous rectification requiring stable component supply across production lifecycles.

Supply support for PSMN014-40HLD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in MOSFETs, ESD protection, and logic ICs for industrial and computing markets.

PSMN014-40HLD belongs to Nexperia's NextPowerS3 logic-level MOSFET product line, engineered specifically for high-frequency, high-efficiency power conversion in datacenter, telecom, and motor control systems demanding low RDS(on), low QG, and extended temperature operation.

FAQ

What is the maximum continuous drain current for PSMN014-40HLD at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current is 30 A per FET, as confirmed in Table 5 (Limiting Values). This derating reflects thermal constraints of the LFPAK56D package and ensures safe operation within the 175 °C maximum junction temperature limit under sustained load.

Can PSMN014-40HLD be used in a high-side switch configuration with standard gate drivers?

Yes - FET2 can serve as a high-side switch when its source (S2) is referenced to a floating potential. However, a level-shifted or isolated gate driver is required to maintain VGS ≥ 10 V relative to S2, as the device lacks integrated bootstrap diodes or charge pumps. The 1.5–2.2 V VGS(th) ensures turn-on with 3.3 V logic-compatible drivers when properly referenced.

Does PSMN014-40HLD require external gate resistors for EMI control?

Yes - although the device has low intrinsic gate resistance (0.7–4.2 Ω), external gate resistors (typically 5–15 Ω) are recommended to damp ringing, control dV/dt during switching, and prevent false triggering in high-noise environments. The 1.8–4.2 nC QGD value indicates moderate Miller effect, making gate resistance tuning critical for ZVS optimization.

Is the source-drain diode in PSMN014-40HLD suitable for freewheeling in hard-switched topologies?

Yes - the integrated body diode has trr = 21.5 ns and Qr = 16.2 nC at 10 A, enabling use in hard-switched flyback or forward converters without external diode supplementation. However, for soft-switched or resonant topologies, its recovery characteristics remain competitive but do not match dedicated SiC Schottky alternatives.

PSMN014-40HLDX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1205, 8-LFPAK56
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
40V
Current - Continuous Drain (Id) @ 25°C:
42A (Ta)
Rds On (Max) @ Id, Vgs:
13.6mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
2.2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
19.4nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
1160pF @ 25V
Power - Max:
46W (Ta)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56D

PSMN014-40HLDX FAQ

1.How can I place an order for PSMN014-40HLDX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN014-40HLDX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN014-40HLDX reliable?

The price and inventory of PSMN014-40HLDX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN014-40HLDX is usually 5 days.

3.What payment methods are accepted for PSMN014-40HLDX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN014-40HLDX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN014-40HLDX?

PSMN014-40HLDX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN014-40HLDX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN014-40HLDX?

For technical support, including PSMN014-40HLDX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN014-40HLDX requirements.

6.How does Aetrix verify that PSMN014-40HLDX is sourced from the original manufacturer or authorized distributors?

All PSMN014-40HLDX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN014-40HLDX meets industry standards.

7.What is the process for return or replacement of PSMN014-40HLDX?

All PSMN014-40HLDX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN014-40HLDX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN014-40HLDX part is unused and in its original packaging.

Return procedure for PSMN014-40HLDX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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