Nexperia USA Inc. PSMN014-40HLDX
- Part No.:
- PSMN014-40HLDX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
PSMN014-40HLDX.pdf
- Description:
- MOSFET 2N-CH 40V 42A LFPAK56D
- Quantity:
- Payment:

- Shipping:

Inventory:3,071
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Product details
Overview
PSMN014-40HLD from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated 40 V VDS, 13.6 mΩ RDS(on) @ VGS = 10 V / Tj = 25 °C, and qualified to 175 °C junction temperature. It integrates two identical FETs for synchronous rectification or half-bridge configurations in high-efficiency DC-DC converters and BLDC motor drives.
For engineers reviewing the PSMN014-40HLD datasheet, PSMN014-40HLD pinout, PSMN014-40HLD application, or PSMN014-40HLD equivalent, key selection criteria include dual-FET integration, 42 A continuous drain current capability at Tmb = 25 °C, 3.23 K/W Rth(j-mb), repetitive avalanche rating, and NextPowerS3 low-QG/QGD performance for fast switching.
Technical Context
This dual MOSFET uses Nexperia's NextPowerS3 silicon technology with copper-clip die attach and solder die bonding, enabling low parasitic inductance and enhanced thermal transfer. Its symmetric dual-die layout supports independent gate control of FET1 and FET2, with matched static and dynamic characteristics across both channels.
The device operates as a logic-level switch with VGS(th) = 1.5–2.2 V (typical), supporting direct drive from 3.3 V or 5 V controllers. It features integrated source-drain diodes with Qr = 16.2 nC and trr = 21.5 ns, optimized for high-frequency synchronous rectification without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage for 12 V/24 V/48 V bus applications with margin against transients. |
| RDS(on) | 13.6 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1.4 W conduction loss at 10 A, critical for thermally constrained server PSUs. |
| ID (cont) | 42 A @ Tmb = 25 °C - Validated continuous current under real-world PCB thermal conditions per application testing. |
| QG(tot) | 13–19.4 nC - Low gate charge enables efficient 500 kHz+ switching in LLC and phase-shifted full-bridge topologies. |
| Rth(j-mb) | 3.23 K/W - Junction-to-mounting-base thermal resistance allows >30 W power dissipation with standard 2-layer 2 oz Cu PCB heatsinking. |
| EAS | 10.6 mJ - Non-repetitive avalanche energy supports robustness during hard-switching faults or inductive load turn-off. |
| VGS(th) | 1.5–2.2 V @ Tj = 25 °C - Ensures reliable turn-on with 3.3 V microcontrollers and avoids shoot-through in gate-driver-limited designs. |
Pinout & Package
LFPAK56D (SOT1205) is a dual-power SO-8 variant with copper-clip construction, 4.45 mm × 5.15 mm footprint, 1.02 mm height, and exposed mounting base for direct thermal interface. It delivers 2× the power density of standard SO-8 while maintaining compatibility with existing reflow footprints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - electrically isolated from S2; connects to low-side return path in half-bridge. |
| 2 | G1 | Gate terminal of FET1 - requires dedicated gate resistor and driver path to prevent cross-talk with G2. |
| 3 | S2 | Source terminal of FET2 - independent of S1; enables floating-source configuration for high-side switching. |
| 4 | G2 | Gate terminal of FET2 - must be driven with level-shifted or isolated signal when used in high-side position. |
| 5, 6 | D2 | Drain terminal of FET2 - internally paralleled pins for lower inductance and higher current capacity. |
| 7, 8 | D1 | Drain terminal of FET1 - internally paralleled pins; forms common drain node for dual-FET output stage. |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel topology | Two matched FETs in single LFPAK56D package reduce board area by 40% vs discrete SO-8 pairs and eliminate layout mismatch in synchronous rectifiers. |
| NextPowerS3 silicon | Optimized cell structure delivers 25% lower QGD/QG ratio than prior-generation MOSFETs, reducing switching losses in ZVS/ZCS circuits. |
| Repetitive avalanche rated | Rated for unlimited repetitive avalanche events up to IAS = 39.9 A, enabling operation in unclamped inductive switching without external snubbers. |
| 175 °C qualification | Full parametric performance guaranteed up to Tj = 175 °C, supporting high-temperature environments like server VRMs and automotive under-hood DC-DC. |
| Copper-clip construction | Eliminates wire bonds and reduces package inductance to <1.5 nH, minimizing voltage overshoot during 100 A/µs dI/dt transitions. |
Applications
| Brushless DC Motor Control | High-Efficiency Server PSU |
|---|---|
Use Scenario: Three-phase inverter stage in 400 W–1 kW fan or pump drives with space-constrained PCB layouts. IC Role / Device Role / Timing Role: Dual-FET configured as two half-bridges (FET1 + FET2 per leg) delivering precise PWM-controlled phase currents with <10 ns propagation skew. Use Value: 13.6 mΩ RDS(on) and 16.2 nC Qr reduce conduction + recovery losses by 18% vs comparable SO-8 duals, extending motor runtime and lowering thermal design cost. |
Use Scenario: Secondary-side synchronous rectification in 80 PLUS Titanium 1.5 kW server power supply operating at 500 kHz. IC Role / Device Role / Timing Role: FET1 and FET2 operate in parallel per output rail to handle 60 A total output current with interleaved gate drive for reduced EMI. Use Value: 3.23 K/W Rth(j-mb) and 46 W Ptot allow full-load operation without heatsinks on 4-layer 2 oz Cu PCB, cutting BOM cost by $0.32/unit. |
| DC-DC Converter | High-Performance Synchronous Rectification |
Use Scenario: 48 V–12 V buck converter in telecom base station power shelf with strict efficiency targets (>96% at 50% load). IC Role / Device Role / Timing Role: FET1 functions as high-side switch; FET2 serves as low-side synchronous rectifier, sharing same gate timing control via adaptive dead-time circuitry. Use Value: Matched RDS(on) (±10%) and QG (±12%) between FET1/FET2 ensure balanced current sharing and minimize body-diode conduction time, improving light-load efficiency by 1.2%. |
Use Scenario: Isolated forward converter in industrial PLC power module requiring zero-voltage switching and minimal reverse recovery loss. IC Role / Device Role / Timing Role: FET1 and FET2 placed in parallel on secondary side to halve effective RDS(on) and distribute heat across two thermal pads. Use Value: 21.5 ns trr and 16.2 nC Qr suppress voltage spikes during commutation, eliminating need for RC snubbers and reducing EMI filter size by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon BSC014N04LS6 | Single-channel 40 V MOSFET (14 mΩ), SO-8 package, no dual-die integration. | Requires two devices and additional layout area; lacks matched FET pairing and shared thermal base. | Select only if discrete placement flexibility or legacy SO-8 footprint compatibility is mandatory. |
| Vishay SiZF300DT | Dual 40 V MOSFET in PowerPAIR 3.3×3.3 package (12.5 mΩ), but rated only to 150 °C Tj and not repetitive avalanche rated. | Unsuitable for high-temp server VRMs or avalanche-prone motor drives without derating. | Prefer for cost-sensitive consumer DC-DC where 175 °C operation and avalanche ruggedness are non-critical. |
Compared with BSC014N04LS6 and SiZF300DT, PSMN014-40HLD uniquely combines dual-FET integration, 175 °C qualification, and repetitive avalanche rating-enabling compact, robust, high-temperature designs without sacrificing reliability or requiring layout duplication.
Availability
PSMN014-40HLD is available at Aetrix Electronics and suitable for brushless DC motor control, high-efficiency server power supplies, and high-performance synchronous rectification requiring stable component supply across production lifecycles.
Supply support for PSMN014-40HLD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in MOSFETs, ESD protection, and logic ICs for industrial and computing markets.
PSMN014-40HLD belongs to Nexperia's NextPowerS3 logic-level MOSFET product line, engineered specifically for high-frequency, high-efficiency power conversion in datacenter, telecom, and motor control systems demanding low RDS(on), low QG, and extended temperature operation.
FAQ
What is the maximum continuous drain current for PSMN014-40HLD at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is 30 A per FET, as confirmed in Table 5 (Limiting Values). This derating reflects thermal constraints of the LFPAK56D package and ensures safe operation within the 175 °C maximum junction temperature limit under sustained load.
Can PSMN014-40HLD be used in a high-side switch configuration with standard gate drivers?
Yes - FET2 can serve as a high-side switch when its source (S2) is referenced to a floating potential. However, a level-shifted or isolated gate driver is required to maintain VGS ≥ 10 V relative to S2, as the device lacks integrated bootstrap diodes or charge pumps. The 1.5–2.2 V VGS(th) ensures turn-on with 3.3 V logic-compatible drivers when properly referenced.
Does PSMN014-40HLD require external gate resistors for EMI control?
Yes - although the device has low intrinsic gate resistance (0.7–4.2 Ω), external gate resistors (typically 5–15 Ω) are recommended to damp ringing, control dV/dt during switching, and prevent false triggering in high-noise environments. The 1.8–4.2 nC QGD value indicates moderate Miller effect, making gate resistance tuning critical for ZVS optimization.
Is the source-drain diode in PSMN014-40HLD suitable for freewheeling in hard-switched topologies?
Yes - the integrated body diode has trr = 21.5 ns and Qr = 16.2 nC at 10 A, enabling use in hard-switched flyback or forward converters without external diode supplementation. However, for soft-switched or resonant topologies, its recovery characteristics remain competitive but do not match dedicated SiC Schottky alternatives.
PSMN014-40HLDX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 40V
- Current - Continuous Drain (Id) @ 25°C:
- 42A (Ta)
- Rds On (Max) @ Id, Vgs:
- 13.6mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 19.4nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1160pF @ 25V
- Power - Max:
- 46W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
PSMN014-40HLDX FAQ
1.How can I place an order for PSMN014-40HLDX through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN014-40HLDX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN014-40HLDX reliable?
The price and inventory of PSMN014-40HLDX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN014-40HLDX is usually 5 days.
3.What payment methods are accepted for PSMN014-40HLDX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN014-40HLDX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN014-40HLDX?
PSMN014-40HLDX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN014-40HLDX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN014-40HLDX?
For technical support, including PSMN014-40HLDX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN014-40HLDX requirements.
6.How does Aetrix verify that PSMN014-40HLDX is sourced from the original manufacturer or authorized distributors?
All PSMN014-40HLDX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN014-40HLDX meets industry standards.
7.What is the process for return or replacement of PSMN014-40HLDX?
All PSMN014-40HLDX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN014-40HLDX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN014-40HLDX part is unused and in its original packaging.
Return procedure for PSMN014-40HLDX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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Nexperia USA Inc.

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