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Nexperia USA Inc. PSMN015-100B,118

Part No.:
PSMN015-100B,118
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixPSMN015-100B,118.pdf
Description:
MOSFET N-CH 100V 75A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,091

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Product details

Overview

PSMN015-100B from Nexperia is a standard-level N-channel TrenchMOS power MOSFET in D2PAK (SOT404) package, rated for 100 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 12 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C. It features avalanche ruggedness (320 mJ unclamped), low gate charge (QG(tot) = 90 nC), and is qualified for computing, communications, consumer, and industrial DC-DC and SMPS applications.

For engineers reviewing the PSMN015-100B datasheet, PSMN015-100B pinout, PSMN015-100B application, or PSMN015-100B equivalent, key selection criteria include its 100 V blocking capability, thermal resistance of 0.5 K/W (junction-to-mounting base), avalanche energy rating, gate-drive compatibility with 10 V logic, and mounting-base–integrated drain connection for high-current PCB thermal management.

Technical Context

This device employs TrenchMOS silicon technology to achieve low on-resistance and fast switching performance. Its gate threshold voltage ranges from 2 V to 4 V at 25 °C, enabling reliable turn-on with standard 10 V gate drivers while maintaining low leakage (IDSS ≤ 10 µA at 25 °C). The integrated mounting base serves as both mechanical anchor and thermal path, directly connecting to the drain terminal.

Dynamic behavior is characterized by QGD = 35 nC and Ciss = 4900 pF at VDS = 25 V, supporting efficient hard-switching in high-frequency power converters. The source-drain diode exhibits VSD = 0.8–1.1 V at 25 A and trr = 80 ns, suitable for synchronous rectification and freewheeling roles where body-diode conduction occurs.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 100 V - Maximum drain-source blocking voltage; supports 48 V input bus designs with 2× safety margin.
RDS(on) 12 mΩ (typ) @ VGS = 10 V, ID = 25 A, Tj = 25 °C - Enables <1.9 W conduction loss at 35 A, critical for high-efficiency power stages.
ID (cont) 75 A @ Tmb = 25 °C - High current handling enabled by low RDS(on) and D2PAK thermal design.
EAS 320 mJ (unclamped) - Confirmed avalanche energy rating ensures robustness against inductive switching transients.
QG(tot) 90 nC - Total gate charge determines driver strength requirement; compatible with common 1–2 A peak gate drivers.
Rth(j-mb) 0.5 K/W - Junction-to-mounting base thermal resistance enables direct heatsink coupling for >200 W dissipation capability.
tr/tf 65 ns / 50 ns - Fast switching transitions reduce switching losses in 100–500 kHz SMPS topologies.

Pinout & Package

PSMN015-100B uses the SOT404 (D2PAK) plastic surface-mount package with an exposed metal mounting base electrically connected to the drain. Pin 2 is internally connected to the mounting base and not externally accessible; only pins 1 (Gate), 3 (Source), and the mounting base (Drain) are functional terminals.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Gate (G) Control terminal; requires 10 V drive for full enhancement; low input capacitance (Ciss = 4900 pF) eases driver design.
Pin 3 Source (S) Reference node for gate drive and current sensing; isolated from mounting base to enable high-side or low-side configuration.
Mounting Base (mb) Drain (D) Primary current and thermal path; must be soldered to large copper area or heatsink; electrically identical to internal drain node.

Key Features

Feature Design Value
Low RDS(on) 12 mΩ typ at 10 V drive reduces conduction loss by >30% vs. legacy planar MOSFETs in same package.
Avalanche ruggedness 320 mJ non-repetitive EAS allows safe operation under inductive load switching without external snubbers.
TrenchMOS technology Enables higher cell density and lower gate charge, improving figure-of-merit (RDS(on) × QG) by 2.2× over comparable planar devices.
Mounting base thermal path 0.5 K/W Rth(j-mb) delivers >3× better thermal performance than junction-to-ambient (50 K/W), enabling compact high-power designs.

Applications

Server VRM Power Stage Industrial DC-DC Converter

Use Scenario: Primary switch in 48 V–12 V buck converter for CPU voltage regulation in data center servers.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 300–600 kHz with 10 V gate drive.

Use Value: 12 mΩ RDS(on) and 90 nC QG minimize combined conduction and switching losses, achieving >95% efficiency at 60 A output.

Use Scenario: Main switching FET in 24 V input, 5 V/30 A isolated forward converter for factory automation PLCs.

IC Role / Device Role / Timing Role: Primary-side power switch with unclamped inductive turn-off during fault conditions.

Use Value: 320 mJ avalanche rating eliminates need for external clamping circuits, reducing BOM count and board space.

Telecom PSU Half-Bridge Consumer Laptop Adapter

Use Scenario: Low-side switch in LLC resonant half-bridge for 3 kW telecom rectifier modules.

IC Role / Device Role / Timing Role: Fast-turning, low-QGD FET synchronized to zero-voltage switching transitions.

Use Value: 35 nC QGD and 80 ns trr support clean commutation with minimal shoot-through risk and reduced EMI.

Use Scenario: Secondary-side synchronous rectifier in 19 V/4.74 A laptop AC-DC adapter.

IC Role / Device Role / Timing Role: Source-drain diode used for freewheeling during dead time; VSD = 0.8–1.1 V minimizes forward drop.

Use Value: Low VSD and 115 nC Qr reduce reverse recovery loss, improving light-load efficiency by 1.2% over Schottky alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP110N10F7 RDS(on) = 9.5 mΩ @ 10 V but higher QG = 120 nC; TO-220FP package with insulated tab. Lacks mounting-base thermal path; requires insulating pad and separate heatsink interface. Prefer when isolation from heatsink is mandatory; avoid if board-level thermal management via copper pour is preferred.
IRF3205PBF RDS(on) = 8.0 mΩ @ 10 V but no specified avalanche rating; TO-220 package with higher Rth(j-a) = 62 K/W. Not qualified for repetitive avalanche stress; unsuitable for unclamped inductive loads. Select only for cost-sensitive, non-avalanche applications with conservative SOA derating and forced-air cooling.

Compared with STP110N10F7 and IRF3205PBF, PSMN015-100B offers superior thermal integration via its D2PAK mounting base, verified avalanche ruggedness, and optimized QG/RDS(on) trade-off-making it the preferred choice for compact, high-reliability, high-current power stages where PCB copper acts as primary heatsink.

Availability

PSMN015-100B is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and telecom power supplies requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for PSMN015-100B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with leadership in automotive-qualified and industrial-grade power components.

This device belongs to the SiliconMAX standard-level TrenchMOS family, engineered specifically for high-efficiency, high-current switching in computing, communications, and industrial power conversion systems.

FAQ

What is the maximum continuous drain current for PSMN015-100B at 100 °C mounting base temperature?

The maximum continuous drain current is 60.8 A at Tmb = 100 °C, as specified in Table 4 (Limiting Values) under VGS = 10 V condition. This reflects thermal derating due to reduced heat transfer efficiency at elevated mounting base temperatures, and must be applied in thermal design calculations alongside Rth(j-mb) = 0.5 K/W.

Is the mounting base electrically isolated from the drain terminal?

No-the mounting base is electrically connected to the drain (Pin 2), as confirmed in Table 2 (Pinning Information) and Figure 14 (Package Outline). This direct connection provides the primary thermal and current path, and requires careful PCB layout to ensure proper grounding or high-voltage isolation depending on circuit topology.

Does PSMN015-100B support gate drive voltages below 10 V?

Yes-VGS(th) ranges from 1 V to 4.4 V across temperature, enabling partial enhancement at 5 V. However, RDS(on) rises significantly below 10 V (e.g., ~32.4 mΩ at 175 °C and 10 V); full-rated performance requires ≥10 V gate drive to maintain low conduction loss and thermal stability.

Can PSMN015-100B be used in synchronous rectification configurations?

Yes-the integrated source-drain diode has VSD = 0.8–1.1 V at 25 A and trr = 80 ns, making it suitable for low-frequency synchronous rectification. For high-frequency (>300 kHz) operation, external MOSFET control is recommended to avoid body-diode conduction and associated reverse recovery losses.

PSMN015-100B,118 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
TrenchMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
75A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
15mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
90 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4900 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

PSMN015-100B,118 FAQ

1.How can I place an order for PSMN015-100B,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN015-100B,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN015-100B,118 reliable?

The price and inventory of PSMN015-100B,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN015-100B,118 is usually 5 days.

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Once your PSMN015-100B,118 order is processed, you will receive an email with the shipment details and tracking number.

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5.How can I obtain technical support or documentation for PSMN015-100B,118?

For technical support, including PSMN015-100B,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN015-100B,118 requirements.

6.How does Aetrix verify that PSMN015-100B,118 is sourced from the original manufacturer or authorized distributors?

All PSMN015-100B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN015-100B,118 meets industry standards.

7.What is the process for return or replacement of PSMN015-100B,118?

All PSMN015-100B,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN015-100B,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN015-100B,118 part is unused and in its original packaging.

Return procedure for PSMN015-100B,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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