Nexperia USA Inc. PSMN015-110P,127
- Part No.:
- PSMN015-110P,127
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
PSMN015-110P,127.pdf
- Description:
- MOSFET N-CH 110V 75A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:3,606
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Product details
Overview
PSMN015-110P from Nexperia is a standard-level N-channel TrenchMOS FET in TO-220AB (SOT78) package, designed for high-current switching in power conversion stages. It delivers 110 V VDS, 12 mΩ RDS(on) @ 10 V VGS/25 A/25 °C, and 300 W Ptot at Tmb = 25 °C, with low QG (90 nC) and QGD (35 nC) enabling efficient hard-switching in DC-DC converters and SMPS primary-side switches.
For engineers reviewing the PSMN015-110P datasheet, PSMN015-110P pinout, PSMN015-110P application, or PSMN015-110P equivalent, key selection criteria include its 110 V blocking rating, thermal resistance Rth(j-mb) of 0.5 K/W, avalanche energy rating (320 mJ), gate threshold voltage range (2–4 V), and mounting-base–referenced thermal design requirements.
Technical Context
This device employs TrenchMOS silicon technology to achieve low RDS(on) and optimized charge characteristics. Its gate drive requires only 10 V for full enhancement, with VGS(th) specified from 1 V (Tj = 175 °C) to 4.4 V (Tj = −55 °C), ensuring robust turn-on across industrial temperature ranges.
The source-drain diode exhibits VSD = 0.8–1.1 V @ 25 A and trr = 80 ns, supporting synchronous rectification and freewheeling in buck and half-bridge topologies. Thermal performance is defined relative to mounting base (not ambient), with Rth(j-mb) = 0.5 K/W enabling high-power operation when heatsink-mounted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 110 V - Maximum drain-source blocking voltage; defines use in ≤100 V bus systems with margin. |
| RDS(on) | 12 mΩ @ 10 V VGS, 25 A, 25 °C - Directly determines conduction loss (I²R) in continuous current paths. |
| QG(tot) | 90 nC - Total gate charge; sets minimum gate driver current and switching loss in PWM applications. |
| Rth(j-mb) | 0.5 K/W - Junction-to-mounting-base thermal resistance; enables 300 W dissipation with ≤150 K ΔT to heatsink. |
| EAS | 320 mJ - Non-repetitive avalanche energy; supports unclamped inductive switching without failure. |
| ID | 75 A @ Tmb = 25 °C - Continuous drain current rating under ideal heatsinking conditions. |
| Ciss | 4900 pF @ VDS = 25 V - Input capacitance affecting gate drive loop stability and Miller effect during switching. |
Pinout & Package
PSMN015-110P uses the TO-220AB (SOT78) plastic single-ended package with heatsink mounting. The metal mounting base is electrically connected to the drain terminal, requiring isolation when mounted to shared heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control electrode; accepts 0–20 V VGS; low QG enables fast switching with modest drive strength. |
| 2 (D) | Drain | Main high-side current path; internally bonded to mounting base - must be electrically isolated from heatsink unless drain-referenced. |
| 3 (S) | Source | Return path for load current; referenced to control ground; used for current sensing and gate drive return. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) | 12 mΩ @ 25 °C enables <1.9 W conduction loss at 40 A, reducing thermal burden in high-current SMPS outputs. |
| Low gate charge | QG = 90 nC and QGD = 35 nC minimize driver power and switching transition time in 100–500 kHz converters. |
| Avalanche-rated | 320 mJ EAS allows safe operation during inductive turn-off transients without external snubbers in flyback or forward converters. |
| Thermally optimized | Rth(j-mb) = 0.5 K/W permits 300 W dissipation with only 150 °C junction-to-heatsink rise - critical for compact power modules. |
| Wide VGS range | ±20 V absolute max rating supports robust gate drive design; VGS(th) shift over temperature ensures reliable turn-on down to −55 °C. |
Applications
| Server VRM | Industrial SMPS |
|---|---|
Use Scenario: High-efficiency 12 V input → 1 V/150 A output voltage regulator module for CPU/GPU power delivery. IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET in multiphase buck converter, operating at 300–600 kHz with precise gate timing. Use Value: Low RDS(on) and Ciss reduce conduction and switching losses; mounting-base thermal path enables direct heatsink coupling for phase interleaving thermal balancing. |
Use Scenario: 48 V input offline SMPS delivering 24 V/20 A for PLC I/O modules and motor drives. IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward topology, handling 75 A peak drain current with 110 V bus margin. Use Value: 320 mJ avalanche energy eliminates need for clamping circuits; 0.5 K/W Rth(j-mb) sustains continuous operation under forced-air cooling at 60 °C ambient. |
| Telecom DC-DC | EV Onboard Charger |
Use Scenario: 380 V nominal intermediate bus converter stepping down to 12 V for base station control logic and fans. IC Role / Device Role / Timing Role: Secondary-side synchronous FET in LLC resonant converter, driven by transformer-coupled gate signals. Use Value: Low QGD/QG ratio improves zero-voltage switching margin; VSD = 0.8 V minimizes body-diode conduction loss during dead-time. |
Use Scenario: Isolated DC-DC stage in bidirectional onboard charger converting 400 V battery to 14 V vehicle network. IC Role / Device Role / Timing Role: High-side switch in dual-active-bridge (DAB) power stage, switching at 100–200 kHz with soft commutation. Use Value: 110 V VDS rating provides safety margin above 100 V secondary-side transients; 240 A pulsed ID capability supports burst-mode peak loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V VDS, 8.5 mΩ RDS(on), TO-220FP package (isolated tab), higher QG (115 nC) | Limited to ≤100 V systems; lower RDS(on) but higher gate drive demand and no avalanche rating | Prefer where lower conduction loss dominates and avalanche stress is absent; avoid in unclamped inductive loads. |
| IRF1404ZPBF | 40 V VDS, 20 mΩ RDS(on), TO-220AB, 100% avalanche tested (600 mJ), higher Rth(j-mb) (0.75 K/W) | Not suitable for >40 V bus; superior ruggedness but higher on-resistance and thermal resistance | Select only for ≤40 V high-reliability industrial supplies where avalanche immunity outweighs voltage limitation. |
Compared with STP110N10F7 and IRF1404ZPBF, PSMN015-110P uniquely balances 110 V rating, 12 mΩ conduction, 0.5 K/W thermal resistance, and documented 320 mJ avalanche capability - making it optimal for 48–100 V industrial and telecom SMPS where both voltage margin and thermal density matter.
Availability
PSMN015-110P is available at Aetrix Electronics and suitable for server VRMs, industrial SMPS, telecom DC-DC converters, and EV onboard charger auxiliary power supplies requiring stable component supply and long-term manufacturability.
Supply support for PSMN015-110P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.
This part belongs to the SiliconMAX standard-level TrenchMOS family, engineered for cost-sensitive yet thermally demanding computing, communications, and industrial power conversion applications where robustness and consistent parametric performance are essential.
FAQ
Is PSMN015-110P suitable for synchronous rectification in a 48 V input buck converter?
Yes. With RDS(on) = 12 mΩ @ 10 V VGS and VSD = 0.8 V, it reduces conduction loss versus Schottky diodes while supporting gate drive from standard bootstrap controllers. Its 110 V rating provides ample margin for 48 V bus transients up to 80 V, and low QGD ensures clean turn-off in high-frequency operation.
What is the maximum continuous drain current at 100 °C mounting base temperature?
Per Figure 1 in the datasheet, the normalized ID derating factor at Tmb = 100 °C is ~81%. Since rated ID = 75 A at Tmb = 25 °C, the maximum continuous drain current at 100 °C mounting base is approximately 60.8 A - confirmed in Table 4 under "Limiting values".
Does the mounting base require electrical isolation when used with a common heatsink?
Yes. Pin 2 (Drain) is internally connected to the metal mounting base per Table 2 and Figure 14. If multiple devices share a heatsink, each PSMN015-110P must be mounted using an electrically isolating pad or shoulder washer to prevent shorted drain nodes - especially critical in half-bridge or multi-phase configurations.
How does the gate threshold voltage change over temperature, and what impact does this have on drive design?
VGS(th) decreases from 4.4 V at −55 °C to 1 V at 175 °C (Table 6). This wide range means gate drive must ensure ≥4 V over temperature to guarantee turn-on at cold start, while avoiding excessive VGS (>15 V) at high temperature to limit gate oxide stress. A 10–12 V regulated gate drive is recommended for robust operation.
PSMN015-110P,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 110 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 90 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
PSMN015-110P,127 FAQ
1.How can I place an order for PSMN015-110P,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN015-110P,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN015-110P,127 reliable?
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6.How does Aetrix verify that PSMN015-110P,127 is sourced from the original manufacturer or authorized distributors?
All PSMN015-110P,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN015-110P,127 meets industry standards.
7.What is the process for return or replacement of PSMN015-110P,127?
All PSMN015-110P,127 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN015-110P,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN015-110P,127 part is unused and in its original packaging.
Return procedure for PSMN015-110P,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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