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Nexperia USA Inc. PSMN017-30BL,118

Part No.:
PSMN017-30BL,118
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixPSMN017-30BL,118.pdf
Description:
MOSFET N-CH 30V 32A D2PAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,051

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Product details

Overview

PSMN017-30BL from Nexperia is a logic-level N-channel MOSFET in D2PAK (SOT404) package, rated for 30 V VDS, 17 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, qualified to 175 °C junction temperature, and optimized for high-efficiency load switching in server power supplies and motor control circuits.

For engineers reviewing the PSMN017-30BL datasheet, PSMN017-30BL pinout, PSMN017-30BL application, or PSMN017-30BL equivalent, this device supports logic-level gate drive (VGS(th) = 1.3–2.15 V), delivers 32 A continuous drain current at Tmb = 25 °C, and features low QGD (1.94 nC) and robust avalanche energy rating (13 mJ) for reliable hard-switching operation.

Technical Context

This MOSFET employs planar silicon technology with optimized channel geometry to achieve low on-resistance while maintaining stable threshold voltage across -55 °C to 175 °C. Its RDS(on) remains ≤23.5 mΩ up to Tj = 100 °C under VGS = 10 V, enabling thermally robust operation in compact power stages.

The device integrates an intrinsic body diode with VSD = 0.89–1.2 V at IS = 10 A and Tj = 25 °C, and exhibits fast reverse recovery (trr = 17.3 ns, Qr = 6.5 nC), supporting synchronous rectification and freewheeling in DC-DC converters without external Schottky supplementation.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V - Maximum drain-source blocking voltage; defines safe operating range in 24 V bus systems and 30 V-rated power rails.
RDS(on) @ VGS = 10 V, Tj = 25 °C 13.3–17 mΩ - Low conduction loss enabling <1.7 W I²R loss at 10 A, critical for high-efficiency 12–24 V load switches.
ID continuous @ Tmb = 25 °C 32 A - Package-limited current capacity; enables single-device use in 50–100 W power stages without paralleling.
QGD 1.94 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves controllability in high-frequency PWM (<500 kHz).
EAS 13 mJ - Non-repetitive avalanche energy rating; allows safe operation during inductive turn-off transients in motor drives and solenoid controls.
VGS(th) 1.3–2.15 V @ Tj = 25 °C - Logic-compatible threshold ensures full enhancement with 3.3 V or 5 V microcontroller GPIOs without level-shifting.
Rth(j-mb) 3.18–3.2 K/W - Low junction-to-mounting-base thermal resistance enables direct heatsink mounting for >30 W dissipation without thermal derating.

Pinout & Package

PSMN017-30BL uses the D2PAK (SOT404) surface-mount package with exposed mounting base electrically connected to the drain terminal. The package supports high-current PCB layouts via soldered thermal pad and accommodates mechanical heatsinking.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control input for MOSFET channel; requires ≤20 V absolute max; driven directly by 3.3 V/5 V logic sources.
2 (D) Drain Main high-side power path terminal; internally bonded to mounting base for low-inductance, high-current routing.
3 (S) Source Power return node and reference for gate drive; forms common node with driver IC ground in high-side configurations.
Mounting Base Drain (electrically tied) Thermal and electrical interface to heatsink; must be soldered to copper pour for Rth(j-mb) ≤3.2 K/W performance.

Key Features

Feature Design Value
Logic-level gate drive compatibility Operates fully enhanced with 3.3 V or 5 V gate voltage, eliminating need for dedicated gate drivers in MCU-based power control.
High-temperature qualification Rated for continuous operation up to 175 °C junction temperature, supporting sealed industrial enclosures and high-ambient server environments.
Low QG(tot) / QGD ratio QG(tot) = 5.1 nC at VGS = 4.5 V; QGD/QG(tot) ≈ 38 % - Enables fast, predictable switching with minimal shoot-through risk in half-bridge topologies.
Robust body diode trr = 17.3 ns, Qr = 6.5 nC - Supports efficient freewheeling in buck converters and reduces snubber requirements in flyback designs.
Package thermal performance Rth(j-mb) = 3.18 K/W - Delivers >12 W usable power dissipation at ΔT = 38 °C, enabling compact thermal design without forced air.

Applications

Server Power Supplies DC-DC Converters

Use Scenario: Primary-side synchronous rectification and secondary-side OR-ing in 12 V/48 V intermediate bus converters.

IC Role / Device Role / Timing Role: High-side N-channel switch controlling power delivery path; operates in continuous conduction mode at 200–500 kHz.

Use Value: 17 mΩ RDS(on) reduces conduction loss by >35 % vs. comparable 25 mΩ devices, improving system efficiency by 0.8–1.2 % at 20 A output.

Use Scenario: Buck converter high-side switch in point-of-load (POL) modules for FPGA and ASIC core voltage regulation.

IC Role / Device Role / Timing Role: Fast-switching power FET with controlled dV/dt; driven by integrated gate driver with 5 V logic interface.

Use Value: Low QGD (1.94 nC) and 9.2 ns rise time enable clean 400 kHz switching with <5 % duty-cycle dead-time overhead.

Motor Control Load Switching

Use Scenario: Half-bridge leg in 24 V brushed DC motor drivers for industrial actuators and HVAC blowers.

IC Role / Device Role / Timing Role: Low-side switching element handling bidirectional current; subjected to inductive kickback and PWM commutation.

Use Value: 13 mJ avalanche energy rating absorbs repetitive inductive spikes without derating, eliminating need for external TVS clamping.

Use Scenario: Hot-swap and inrush current limiting for peripheral modules in telecom line cards and test equipment backplanes.

IC Role / Device Role / Timing Role: Controlled power rail enable switch with soft-start via gate resistor; handles 32 A steady-state load.

Use Value: 32 A continuous rating at Tmb = 25 °C supports single-device implementation of 400 W loads without paralleling or thermal throttling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF3708PBF RDS(on) = 20 mΩ @ VGS = 10 V; QGD = 2.8 nC; TO-220 package; no 175 °C rating. Higher conduction loss and slower switching; unsuitable for high-temp sealed enclosures or high-frequency POLs. Select only if TO-220 mechanical fit is mandatory and ambient Tj stays below 125 °C.
DMN3028LSD-13 RDS(on) = 28 mΩ @ VGS = 4.5 V; SO-8 package; 25 A rating; lower avalanche energy (6.5 mJ). Limited current and thermal capability; inadequate for >20 A continuous loads or inductive motor switching. Prefer for space-constrained low-power applications where D2PAK footprint is prohibitive and peak current <15 A.

Compared with IRF3708PBF and DMN3028LSD-13, PSMN017-30BL delivers superior thermal robustness (175 °C), lower RDS(on), and higher avalanche margin-making it the optimal choice for industrial-grade 24–30 V power stages requiring long-term reliability under thermal stress.

Availability

PSMN017-30BL is available at Aetrix Electronics and suitable for server power supplies, DC-DC converters, motor control circuits, and high-current load switching applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for PSMN017-30BL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic ICs.

The PSMN017-30BL belongs to Nexperia's logic-level Power MOSFET product line, engineered specifically for high-efficiency, high-temperature power conversion in industrial and communications infrastructure where thermal resilience and gate-drive simplicity are critical.

FAQ

What is the maximum gate-source voltage rating for PSMN017-30BL?

The absolute maximum VGS is ±20 V per the datasheet Limiting Values table. Operation beyond ±16 V risks permanent gate oxide damage. For reliable logic-level drive, maintain VGS between 0 V and 10 V during normal switching, with transient overshoot limited to <15 V using appropriate gate resistor and layout practices.

Can PSMN017-30BL be used in high-side switch configurations?

Yes-it supports high-side operation when paired with a gate driver capable of providing VGS ≥10 V referenced to the source. Its logic-level threshold allows bootstrap or isolated gate drive solutions; however, the D2PAK mounting base is electrically connected to drain, so PCB layout must isolate heatsink potential from system ground in floating configurations.

How does RDS(on) change with temperature and gate voltage?

RDS(on) increases with junction temperature: at VGS = 10 V, it rises from 13.3–17 mΩ at 25 °C to 24–31.5 mΩ at 175 °C. At VGS = 4.5 V, RDS(on) is 18.6–23.3 mΩ at 25 °C but degrades to ≤43 mΩ at 175 °C-confirming strong gate overdrive is essential for high-temp stability.

Is the body diode suitable for synchronous rectification?

The intrinsic body diode has trr = 17.3 ns and Qr = 6.5 nC at IS = 10 A, making it viable for moderate-frequency (<300 kHz) synchronous rectification in buck converters. However, for highest efficiency above 200 kHz, an external Schottky diode or dedicated synchronous rectifier IC is recommended to minimize reverse recovery losses.

PSMN017-30BL,118 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
32A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
17mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
10.7 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
552 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
47W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

PSMN017-30BL,118 FAQ

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Please submit a Request for Quotation (RFQ) for PSMN017-30BL,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of PSMN017-30BL,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN017-30BL,118 is usually 5 days.

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5.How can I obtain technical support or documentation for PSMN017-30BL,118?

For technical support, including PSMN017-30BL,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN017-30BL,118 requirements.

6.How does Aetrix verify that PSMN017-30BL,118 is sourced from the original manufacturer or authorized distributors?

All PSMN017-30BL,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN017-30BL,118 meets industry standards.

7.What is the process for return or replacement of PSMN017-30BL,118?

All PSMN017-30BL,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN017-30BL,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN017-30BL,118 part is unused and in its original packaging.

Return procedure for PSMN017-30BL,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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