Nexperia USA Inc. PSMN025-100D,118
- Part No.:
- PSMN025-100D,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PSMN025-100D,118.pdf
- Description:
- MOSFET N-CH 100V 47A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,442
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Product details
Overview
PSMN025-100D,118 from Nexperia is a standard-level N-channel TrenchMOS FET in DPAK (SOT428) package, rated for 100 V VDS, 47 A continuous drain current at Tmb = 25 °C, and 22 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C. It delivers high power density in DC-to-DC converters and switched-mode power supplies via low thermal resistance (1 K/W Rth(j-mb)) and fast switching (QGD = 25 nC).
For engineers reviewing the PSMN025-100D,118 datasheet, PSMN025-100D,118 pinout, PSMN025-100D,118 application, or PSMN025-100D,118 equivalent, key selection criteria include its 100 V blocking capability, 22 mΩ on-resistance at 25 °C, 150 W total power dissipation, avalanche ruggedness (260 mJ), and DPAK thermal mounting base configuration.
Technical Context
This FET employs TrenchMOS silicon technology to achieve low RDS(on) and high current density while maintaining robust avalanche performance. Its gate threshold voltage (VGS(th)) ranges from 2–4 V at 25 °C, enabling reliable enhancement-mode operation with standard 10 V gate drive.
The device features integrated source-drain diode with 0.87–1.2 V forward voltage at 25 A and 82 ns reverse recovery time, supporting synchronous rectification. Thermal design centers on junction-to-mounting-base conduction (Rth(j-mb) = 1 K/W), not ambient, making it suitable for PCB-mounted heatsink interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum drain-source blocking voltage; supports 48 V input bus designs with 2× safety margin. |
| RDS(on) | 22 mΩ typ @ VGS = 10 V, ID = 25 A, Tj = 25 °C - Enables <1.2 W conduction loss at 50 A, critical for high-efficiency SMPS. |
| ID | 47 A @ Tmb = 25 °C - Continuous current rating defined at mounting base temperature, not case or ambient. |
| QGD | 25 nC - Low gate-drain charge minimizes Miller plateau duration, enabling clean 100+ kHz switching in hard-switched topologies. |
| Rth(j-mb) | 1 K/W - Junction-to-mounting-base thermal resistance enables direct heatsink attachment for high-power dissipation without thermal derating penalties. |
| EAS | 260 mJ - Non-repetitive avalanche energy rating allows safe operation under inductive turn-off transients in DC-DC controllers. |
| Ciss | 2600 pF @ VDS = 25 V - Input capacitance impacts gate driver sizing and switching loss trade-offs in high-frequency designs. |
Pinout & Package
PSMN025-100D,118 uses the SOT428 (DPAK) plastic surface-mount package with 3 leads and an exposed mounting base electrically connected to the drain terminal. The package supports high-power thermal management via direct metal interface to heatsinks or copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control electrode; requires 10 V drive for full enhancement; threshold 2–4 V at 25 °C ensures compatibility with standard logic-level drivers. |
| 2 (D) | Drain | Main high-side power terminal; internally bonded to mounting base - must be isolated from other circuit nodes when heatsink-mounted. |
| 3 (S) | Source | Power return path and reference for gate drive; low-inductance layout critical due to LS = 7.5 nH internal source inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) | 22 mΩ typ at 25 °C enables <1.2 W conduction loss at 50 A, reducing thermal load in compact power stages. |
| High avalanche ruggedness | 260 mJ non-repetitive EAS supports reliable operation during inductive turn-off events without external snubbers. |
| Fast switching | QGD = 25 nC and tr/tf = 72/58 ns allow efficient operation up to 500 kHz in resonant or hard-switched topologies. |
| Thermal efficiency | Rth(j-mb) = 1 K/W enables >100 W dissipation with ≤100 K rise to heatsink, eliminating need for forced air in many industrial designs. |
| Integrated body diode | VSD = 0.87 V @ 25 A and trr = 82 ns support synchronous rectification or freewheeling in buck/boost converters. |
Applications
| Server VRM Power Stage | Industrial AC-DC Front-End |
|---|---|
Use Scenario: High-current, high-efficiency 12 V input to 1 V output conversion in CPU/GPU voltage regulator modules. IC Role / Device Role / Timing Role: Primary high-side switch in multiphase buck converter; operates at 300–600 kHz with synchronous rectification. Use Value: 22 mΩ RDS(on) and 1 K/W thermal resistance minimize conduction loss and enable compact heatsink integration directly on PCB. |
Use Scenario: Active clamp flyback or LLC resonant converter in industrial 24/48 V AC-DC power supplies. IC Role / Device Role / Timing Role: Main switching FET handling 100 V bus transients and 47 A peak currents during burst-mode operation. Use Value: 100 V VDS rating with 260 mJ avalanche energy ensures robustness against line surges and transformer leakage spikes. |
| Telecom DC-DC Brick | Automated Test Equipment PSU |
Use Scenario: 48 V input to 5/12 V intermediate bus conversion in telecom power bricks with strict efficiency targets. IC Role / Device Role / Timing Role: High-side switch in phase-shifted full-bridge topology operating at 100–200 kHz. Use Value: Low QGD (25 nC) reduces Miller-induced switching delay, improving ZVS window and reducing gate drive losses. |
Use Scenario: Programmable DC power supply output stage delivering 0–30 V / 0–20 A with fast transient response. IC Role / Device Role / Timing Role: Pass element in linear-regulator hybrid architecture; biased in linear region for precision control. Use Value: 150 W Ptot and 1 K/W Rth(j-mb) allow sustained 20 A output at <30 °C temperature rise with direct heatsink mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF540NPBF | Higher RDS(on) (44 mΩ), lower ID (33 A), TO-220 package, no mounting base thermal path. | Limited to lower-power SMPS (<100 W); unsuitable for DPAK-reflow assembly or high-density layouts. | Choose only if legacy TO-220 footprint required and thermal budget permits higher conduction loss. |
| STP110N10F7 | Same VDS (100 V), lower RDS(on) (11 mΩ), but larger D2PAK package and higher QG (95 nC). | Better conduction loss but slower switching; less optimal for >200 kHz designs due to higher gate charge. | Select when ultra-low RDS(on) dominates over switching speed, and board space allows larger package. |
Compared with IRF540NPBF, PSMN025-100D,118 offers 45 % lower RDS(on) and superior thermal interface; versus STP110N10F7, it trades 11 mΩ for 30 % lower QGD and smaller DPAK footprint-favoring high-frequency, space-constrained SMPS.
Availability
PSMN025-100D,118 is available at Aetrix Electronics and suitable for server VRMs, industrial AC-DC front-ends, and telecom DC-DC bricks requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for PSMN025-100D,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs.
The SiliconMAX standard-level MOSFET product line targets computing, communications, consumer, and industrial power conversion-emphasizing low RDS(on), robust avalanche capability, and thermally optimized packages like DPAK.
FAQ
What is the maximum continuous drain current for PSMN025-100D,118 at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is derated to approximately 33 A per Figure 1 in the datasheet. This value is confirmed in Table 4 (Limiting Values) under "ID drain current" with condition "VGS = 10 V; Tmb = 100 °C", and reflects thermal equilibrium at the mounting base interface-not ambient or case temperature.
Is PSMN025-100D,118 suitable for linear-mode operation in adjustable LDOs or electronic loads?
Yes-its 150 W total power dissipation and 1 K/W Rth(j-mb) support sustained linear operation up to ~20 A at 30 V drop with appropriate heatsinking. However, SOA curves in Figure 4 confirm safe operation only up to 100 µs pulses at high VDS; continuous use requires strict thermal monitoring and mounting base temperature control below 100 °C.
Does the mounting base (pin 2) require electrical isolation from the PCB ground plane?
Yes-the mounting base is internally connected to the drain (pin 2), so it must be electrically isolated from any other net, including ground, unless the drain node is intentionally tied to chassis or heatsink potential. Standard practice uses insulating thermal pads or ceramic washers when mounting to grounded heatsinks.
What is the gate threshold voltage range across temperature, and how does it affect drive circuit design?
VGS(th) ranges from 1 V (min at Tj = 175 °C) to 6 V (max at Tj = −55 °C), with 2–4 V typical at 25 °C. This wide variation means gate drivers must supply ≥10 V to ensure full enhancement across temperature extremes and avoid linear-region operation that increases power loss and thermal stress.
PSMN025-100D,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 47A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 25mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 61 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PSMN025-100D,118 FAQ
1.How can I place an order for PSMN025-100D,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN025-100D,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN025-100D,118 reliable?
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
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6.How does Aetrix verify that PSMN025-100D,118 is sourced from the original manufacturer or authorized distributors?
All PSMN025-100D,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN025-100D,118 meets industry standards.
7.What is the process for return or replacement of PSMN025-100D,118?
All PSMN025-100D,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN025-100D,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN025-100D,118 part is unused and in its original packaging.
Return procedure for PSMN025-100D,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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