Nexperia USA Inc. PSMN030-150P,127
- Part No.:
- PSMN030-150P,127
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
PSMN030-150P,127.pdf
- Description:
- MOSFET N-CH 150V 55.5A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:9,605
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PSMN030-150P,127 from Nexperia is a standard-level N-channel TrenchMOS FET in TO-220AB (SOT78) package, designed for high-efficiency power switching in DC-DC converters and switched-mode power supplies. It delivers 150 V drain-source voltage rating, 55.5 A continuous drain current at Tmb = 25 °C, and 24 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C.
For engineers reviewing the PSMN030-150P,127 datasheet, PSMN030-150P,127 pinout, PSMN030-150P,127 application, or PSMN030-150P,127 equivalent, key selection criteria include thermal resistance (Rth(j-mb) = 0.6 K/W), fast switching performance (QGD = 38–50 nC), avalanche ruggedness (EAS = 300 mJ), and mounting-base–referenced power dissipation capability.
Technical Context
This device uses TrenchMOS silicon technology to achieve low conduction losses and high thermal efficiency. Its gate threshold voltage (VGS(th)) ranges from 2–4 V at 25 °C and drops to 1 V at 175 °C, enabling robust turn-on across industrial temperature ranges while maintaining safe margin against spurious conduction.
The internal structure integrates the mounting base electrically with the drain terminal, supporting direct heatsink attachment and minimizing thermal path resistance. Dynamic parameters-including QG(tot) = 98 nC, Ciss = 3680 pF, and tr/tf = 71/76 ns-support operation in high-frequency SMPS topologies up to several hundred kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - Maximum blocking voltage before breakdown; supports 120 V bus designs with 25 % safety margin. |
| RDS(on) | 24 mΩ (typ) @ VGS = 10 V, ID = 25 A, Tj = 25 °C - Enables <1.5 W conduction loss at 25 A, critical for high-current output stages. |
| ID | 55.5 A @ Tmb = 25 °C - Continuous current rating referenced to mounting base temperature, not ambient; enables compact heatsink sizing. |
| Rth(j-mb) | 0.6 K/W - Thermal resistance from junction to mounting base; allows ~250 W dissipation with ≤150 K rise above heatsink temperature. |
| QGD | 38–50 nC - Gate-drain charge determines Miller plateau duration; directly impacts switching loss and EMI in hard-switched converters. |
| EAS | 300 mJ - Non-repetitive avalanche energy rating; provides robustness against inductive switching transients without external snubbers. |
| VGS(th) | 2–4 V @ Tj = 25 °C - Ensures reliable enhancement-mode turn-on with standard 5 V or 10 V gate drivers; low drift over temperature improves system stability. |
Pinout & Package
Package: TO-220AB (SOT78), plastic single-ended package with heatsink-mounted mounting base electrically connected to drain. Three leads: Gate (pin 1), Drain (pin 2 + mounting base), Source (pin 3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; requires ≥10 V drive for full enhancement; low input capacitance (Ciss = 3680 pF) eases driver selection. |
| 2 (D) + Mounting Base | Drain | Main high-side power terminal; mounting base is electrically tied to drain, enabling low-inductance heatsink connection and simplified thermal design. |
| 3 (S) | Source | Power return node; serves as reference for gate drive; internal source inductance (LS = 7.5 nH) affects high-speed switching behavior. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) | 24 mΩ typ at 10 V drive enables high-efficiency power conversion with minimal conduction loss in high-current paths. |
| TrenchMOS technology | Delivers superior cell density and lower gate charge vs planar MOSFETs, improving switching efficiency in high-frequency SMPS. |
| Mounting-base–drain integration | Reduces thermal resistance to 0.6 K/W and eliminates need for insulating pads in many heatsink configurations. |
| Avalanche-rated | 300 mJ non-repetitive energy handling allows safe operation under unclamped inductive switching events without derating. |
| High-temperature VGS(th) stability | Threshold remains ≥1 V up to 175 °C junction, preventing thermal runaway during overload or transient conditions. |
Applications
| Server VRMs | Industrial AC-DC Adapters |
|---|---|
|
Use Scenario: High-current, multi-phase buck converters supplying CPU/GPU core voltage in enterprise servers. IC Role / Device Role / Timing Role: Primary synchronous rectifier switch operating at 300–600 kHz with 25–50 A per phase. Use Value: Low RDS(on) and high ID rating reduce conduction loss and thermal stress; mounting-base–drain interface simplifies thermal interface to cold plate. |
Use Scenario: Secondary-side synchronous rectification in 1–3 kW industrial AC-DC power supplies with universal input. IC Role / Device Role / Timing Role: High-side switch in active clamp forward or LLC resonant converter output stage. Use Value: 150 V VDS withstands reflected transients on 48 V or 54 V outputs; avalanche rating protects against transformer leakage inductance spikes. |
| Telecom DC-DC Modules | Renewable Energy Inverters |
|
Use Scenario: Isolated 48 V–12 V intermediate bus converters in 5G base station power systems. IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology operating at 100–200 kHz. Use Value: Fast switching (tr/tf = 71/76 ns) and low QGD minimize dead-time losses and improve ZVS margin. |
Use Scenario: DC link switching in string inverters converting PV array output (up to 1000 V) to grid-compatible AC. IC Role / Device Role / Timing Role: Auxiliary high-voltage buffer or auxiliary supply switch in control circuitry requiring 150 V isolation. Use Value: 175 °C max junction temperature and stable VGS(th) support operation in thermally constrained outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V VDS, 110 A ID, 7.5 mΩ RDS(on), TO-220FP package (isolated tab) | Limited to ≤100 V systems; higher current but lower voltage rating; insulated package avoids grounding conflicts. | Select when higher current and electrical isolation between tab and drain are required, and 100 V rating suffices. |
| IRFP4668PBF | 150 V VDS, 65 A ID, 22 mΩ RDS(on), TO-247AC package; higher QG (130 nC) | Higher peak current and slightly lower RDS(on), but larger footprint and slower switching due to higher gate charge. | Prefer for ultra-low conduction loss in lower-frequency (<100 kHz) applications where board space and thermal mass allow TO-247 mounting. |
Compared with STP110N10F7 and IRFP4668PBF, PSMN030-150P,127 offers optimal balance of 150 V rating, 55.5 A current, 24 mΩ on-resistance, and TO-220AB thermal performance-making it especially suitable for space-constrained, high-frequency industrial and telecom SMPS where mounting-base thermal coupling is advantageous.
Availability
PSMN030-150P,127 is available at Aetrix Electronics and suitable for server VRMs, industrial AC-DC adapters, and telecom DC-DC modules requiring stable component supply, long-lifecycle availability, and traceable sourcing.
Supply support for PSMN030-150P,127 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions for automotive, industrial, and computing markets.
This part belongs to the SiliconMAX standard-level TrenchMOS family, engineered for cost-sensitive yet thermally demanding power conversion applications where robustness, consistency, and manufacturability are prioritized over ultra-high frequency or ultra-low RDS(on).
FAQ
What is the maximum continuous drain current for PSMN030-150P,127?
The maximum continuous drain current is 55.5 A at mounting base temperature (Tmb) = 25 °C. At Tmb = 100 °C, it derates to 39 A. This rating assumes proper heatsinking via the electrically connected mounting base and accounts for thermal resistance Rth(j-mb) = 0.6 K/W.
Is the mounting base electrically isolated from the drain?
No-the mounting base is internally connected to the drain terminal (pin 2). This configuration reduces thermal resistance and simplifies mechanical mounting but requires electrical isolation from the heatsink if the drain node is not at chassis ground potential.
Can PSMN030-150P,127 be used in avalanche mode repeatedly?
No-it is rated for non-repetitive avalanche energy only (EAS = 300 mJ, unclamped, Tj(init) = 25 °C). Repeated avalanche operation is not characterized or guaranteed and may cause cumulative degradation or failure.
What gate drive voltage is recommended for full enhancement?
A minimum gate-source voltage of 10 V is recommended to achieve the specified RDS(on) of 24 mΩ. The device begins conducting at VGS(th) = 2–4 V (25 °C), but 10 V ensures low on-resistance and stable operation across temperature and process variation.
PSMN030-150P,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 55.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 30mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 98 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3680 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
PSMN030-150P,127 FAQ
1.How can I place an order for PSMN030-150P,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN030-150P,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN030-150P,127 reliable?
The price and inventory of PSMN030-150P,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN030-150P,127 is usually 5 days.
3.What payment methods are accepted for PSMN030-150P,127?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN030-150P,127 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN030-150P,127?
PSMN030-150P,127 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN030-150P,127 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN030-150P,127?
For technical support, including PSMN030-150P,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN030-150P,127 requirements.
6.How does Aetrix verify that PSMN030-150P,127 is sourced from the original manufacturer or authorized distributors?
All PSMN030-150P,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN030-150P,127 meets industry standards.
7.What is the process for return or replacement of PSMN030-150P,127?
All PSMN030-150P,127 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN030-150P,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN030-150P,127 part is unused and in its original packaging.
Return procedure for PSMN030-150P,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PSMN030-150P,127 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

