Nexperia USA Inc. PSMN041-80YLX
- Part No.:
- PSMN041-80YLX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PSMN041-80YLX.pdf
- Description:
- MOSFET N-CH 80V 25A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:6,051
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Product details
Overview
PSMN041-80YL from Nexperia is an N-channel logic-level enhancement-mode MOSFET in LFPAK56 (SOT669) package, rated for 80 V VDS, 41 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, with 25 A continuous drain current at Tmb = 25 °C. It serves as a high-efficiency power switch in DC-DC converters, load switching, and TV power supplies, featuring low conduction loss and full 175 °C junction temperature qualification.
For engineers reviewing the PSMN041-80YL datasheet, PSMN041-80YL pinout, PSMN041-80YL application, or PSMN041-80YL equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1.4–2.1 V), avalanche ruggedness (23.9 mJ), thermal resistance (Rth(j-mb) = 2.13 K/W), and LFPAK56 footprint compatibility with Power-SO8 designs.
Technical Context
This MOSFET employs a planar silicon process optimized for low RDS(on) and fast switching, with gate threshold voltage tightly distributed (1.4–2.1 V at 25 °C) to ensure reliable turn-on with 3.3 V or 5 V logic controllers. Its LFPAK56 package integrates a thermally enhanced mounting base directly connected to the drain, enabling efficient heat transfer to PCB copper.
The device exhibits robust unclamped inductive switching capability (EAS = 23.9 mJ at Tj(init) = 25 °C), supported by low QGD (4.3 nC) and moderate QG(tot) (21.9 nC), making it suitable for hard-switched topologies where gate drive strength and switching loss balance are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - Maximum drain-source blocking voltage; supports 48 V industrial bus and 60 V automotive transient systems. |
| RDS(on) | 41 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1 W conduction loss at 5 A, reducing heatsink requirements in compact power stages. |
| ID | 25 A @ Tmb = 25 °C - Continuous current rating defined at mounting base temperature, not ambient; requires direct thermal pad connection. |
| QG(tot) | 21.9 nC @ VGS = 10 V - Determines gate driver current demand; enables 1 MHz switching with ≤2 Ω external gate resistor. |
| Rth(j-mb) | 2.13 K/W - Junction-to-mounting-base thermal resistance; allows ~30 W dissipation with 65 K temperature rise above board temperature. |
| EAS | 23.9 mJ - Non-repetitive avalanche energy; supports safe operation during inductive turn-off transients without snubbers in many DC-DC applications. |
| VGS(th) | 1.7 V typical - Ensures full enhancement with standard 3.3 V microcontroller GPIOs; avoids partial turn-on and thermal runaway. |
Pinout & Package
PSMN041-80YL uses the LFPAK56 (SOT669) surface-mount package: a 4-lead plastic single-ended package with exposed mounting base (drain-connected) for low-inductance, high-current routing and superior thermal performance. The package is footprint-compatible with Power-SO8 layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Source | Primary source terminal; internally bonded to pins 1, 2, and 3 - all three pins are electrically common and must be routed to the same low-impedance source net. |
| 2 | Source | Redundant source connection; reduces bond wire inductance and improves current sharing in high-frequency switching. |
| 3 | Source | Third parallel source path; enhances thermal conduction from die to PCB via multiple solder joints. |
| 4 | Gate | Control input; requires low-impedance gate driver due to 2.02 Ω internal gate resistance and 21.9 nC total charge. |
| Mounting base | Drain | Exposed copper pad on underside; electrically connected to drain and provides primary thermal path to PCB ground plane or heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) = 1.4–2.1 V ensures full enhancement with 3.3 V or 5 V controllers without level-shifting circuitry. |
| LFPAK56 thermal performance | Rth(j-mb) = 2.13 K/W enables higher power density than SO-8 equivalents, reducing board area in space-constrained converters. |
| Avalanche-rated design | 23.9 mJ EAS allows reliable unclamped inductive switching - eliminates need for external clamping diodes in many flyback or buck applications. |
| High-temperature qualification | Rated for continuous operation up to Tj = 175 °C and qualified per industrial standards - supports use in sealed enclosures or high-ambient environments. |
| Power-SO8 footprint compatibility | SOT669 outline matches legacy Power-SO8 land patterns, enabling drop-in replacement in existing designs without PCB rework. |
Applications
| DC-DC Converters | Load Switch |
|---|---|
Use Scenario: Synchronous buck converter in telecom power module operating at 300 kHz with 12 V input and 5 V/10 A output. IC Role / Device Role / Timing Role: High-side power switch controlling energy transfer into output inductor; duty-cycle modulated by PWM controller. Use Value: Low 41 mΩ RDS(on) minimizes conduction loss (<0.4 W at 10 A), while 21.9 nC QG(tot) enables efficient gate drive with minimal driver losses. | Use Scenario: Hot-swap power rail enable for FPGA core voltage (1.2 V/20 A) in industrial PLC backplane. IC Role / Device Role / Timing Role: Low-side load switch providing controlled inrush current limiting and overcurrent protection via external sense resistor. Use Value: 175 °C junction rating ensures reliability under sustained overload conditions; 100 A peak current rating handles startup surges without failure. |
| TV Power Supplies | Industrial Motor Drives |
Use Scenario: Standby power supply in smart TV using quasi-resonant flyback topology with 380 V DC bus. IC Role / Device Role / Timing Role: Primary-side switching transistor handling 80 V clamp voltage and unclamped inductive energy during MOSFET turn-off. Use Value: 23.9 mJ avalanche energy rating permits safe operation without snubber circuits, simplifying BOM and improving efficiency. | Use Scenario: Half-bridge high-side switch in 24 V BLDC motor gate driver for HVAC fan control. IC Role / Device Role / Timing Role: High-voltage, high-current switching element in inverter leg; driven by isolated gate driver with 5 V logic interface. Use Value: Logic-level VGS(th) ensures clean turn-on with standard isolated drivers; LFPAK56 mounting base improves thermal coupling to heatsink in enclosed chassis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PSMN035-80YL | Lower RDS(on) (35 mΩ @ 10 V), same VDS and package; slightly higher QG(tot) (24.5 nC). | Better conduction efficiency at high DC loads; marginally slower switching due to higher gate charge. | Select when minimizing I²R loss dominates over switching loss - e.g., in low-frequency, high-current linear regulators or battery disconnect switches. |
| IPB041N08N5 | Same RDS(on) (41 mΩ), higher VDS (85 V), TO-263 package; no mounting base drain connection. | Larger footprint and inferior thermal resistance (Rth(j-c) ≈ 1.5 K/W but requires heatsink); lacks integrated drain thermal path. | Choose only if TO-263 mechanical fit is mandatory and PCB thermal design includes external heatsinking; avoid when board-level thermal management is constrained. |
Compared with PSMN041-80YL, PSMN035-80YL trades marginal gate drive overhead for improved conduction efficiency, while IPB041N08N5 sacrifices thermal integration and footprint compatibility for higher voltage margin and legacy package familiarity - neither offers identical thermal-electrical trade-offs in compact, high-power-density designs.
Availability
PSMN041-80YL is available at Aetrix Electronics and suitable for DC-DC converters, load switch implementations, and TV power supplies requiring stable component supply, long-term industrial lifecycle support, and consistent parametric performance across production batches.
Supply support for PSMN041-80YL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in MOSFETs, ESD protection, and logic ICs for industrial, automotive, and consumer markets.
The PSMN041-80YL belongs to Nexperia's logic-level Power MOSFET product line, engineered specifically for high-efficiency, thermally constrained power conversion in industrial and consumer equipment where gate drive simplicity and thermal robustness are critical.
FAQ
What is the maximum continuous drain current for PSMN041-80YL at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is derated to 18 A, as specified in Table 5 (Limiting Values). This value reflects thermal limits of the LFPAK56 package under real-world PCB thermal conditions and must be used for thermal design-not the 25 A rating at 25 °C.
Does PSMN041-80YL have integrated ESD protection on the gate?
No, PSMN041-80YL does not include integrated gate ESD protection diodes. Its gate oxide is rated for ±20 V absolute maximum VGS, and external gate protection (e.g., Zener clamp or series resistor) is recommended in systems prone to handling or layout-induced transients.
Can PSMN041-80YL be used in synchronous rectification applications?
Yes - its low RDS(on) (41 mΩ), fast body diode (trr = 21.3 ns, Qr = 22 nC), and logic-level gate drive make it suitable for low-voltage synchronous rectification in buck or flyback topologies up to ~60 V output, provided gate timing avoids shoot-through.
Is the mounting base of PSMN041-80YL electrically isolated from other terminals?
No - the mounting base is internally connected to the drain terminal, as confirmed in Table 2 (Pinning information) and Figure 5 (package outline). It must be routed to the same net as drain and cannot serve as a floating thermal pad or ground reference.
PSMN041-80YLX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 25A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 41mOhm @ 5A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 21.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1108 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 64W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PSMN041-80YLX FAQ
1.How can I place an order for PSMN041-80YLX through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN041-80YLX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN041-80YLX reliable?
The price and inventory of PSMN041-80YLX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN041-80YLX is usually 5 days.
3.What payment methods are accepted for PSMN041-80YLX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN041-80YLX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN041-80YLX?
PSMN041-80YLX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN041-80YLX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN041-80YLX?
For technical support, including PSMN041-80YLX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN041-80YLX requirements.
6.How does Aetrix verify that PSMN041-80YLX is sourced from the original manufacturer or authorized distributors?
All PSMN041-80YLX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN041-80YLX meets industry standards.
7.What is the process for return or replacement of PSMN041-80YLX?
All PSMN041-80YLX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN041-80YLX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN041-80YLX part is unused and in its original packaging.
Return procedure for PSMN041-80YLX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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