Nexperia USA Inc. PSMN063-150D,118
- Part No.:
- PSMN063-150D,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PSMN063-150D,118.pdf
- Description:
- MOSFET N-CH 150V 29A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:7,468
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Product details
Overview
PSMN063-150D from Nexperia is a standard-level N-channel TrenchMOS FET in DPAK (SOT428) package, designed for high-efficiency power switching in DC-DC converters and SMPS. It delivers 150 V VDS, 63 mΩ RDS(on) at VGS = 10 V and ID = 15 A (Tj = 25 °C), 150 W Ptot at Tmb = 25 °C, and supports 116 A pulsed drain current with 502 mJ unclamped avalanche energy.
For engineers reviewing the PSMN063-150D datasheet, PSMN063-150D pinout, PSMN063-150D application, or PSMN063-150D equivalent, key selection considerations include thermal resistance (Rth(j-mb) = 1 K/W), fast switching (td(off) = 48 ns, QG(tot) = 55 nC), gate threshold stability (VGS(th) = 2–4 V at 25 °C), and ruggedness under repetitive transient stress in industrial power stages.
Technical Context
This MOSFET employs TrenchMOS silicon technology to achieve low on-resistance and high thermal efficiency in standard-level gate drive configurations (10 V). Its mounting base (pin 2) is internally connected to the drain, enabling direct heatsink attachment for enhanced thermal management in high-power density designs.
The device features a robust body diode with 105 ns reverse recovery time and 0.55 µC recovered charge, supporting synchronous rectification and freewheeling in hard-switched topologies. Avalanche rating (IAS = 29 A, EAS = 502 mJ) confirms suitability for unclamped inductive switching in non-isolated converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - Maximum blocking voltage for primary-side switching in 48 V input SMPS and 100 V bus DC-DC stages. |
| RDS(on) | 60–63 mΩ @ VGS = 10 V, ID = 15 A, Tj = 25 °C - Enables <1.4 W conduction loss at 15 A, critical for >95% efficiency targets. |
| Ptot | 150 W @ Tmb = 25 °C - Supports high continuous power handling when mounted on copper-clad PCB or external heatsink. |
| Rth(j-mb) | 1 K/W - Junction-to-mounting-base thermal resistance enables rapid heat transfer to heatsink, limiting ΔTj to 150 K at full 150 W dissipation. |
| QG(tot) | 55 nC - Total gate charge determines driver strength requirement; compatible with common 1-A peak gate drivers at 100–500 kHz switching. |
| td(off) | 48 ns - Turn-off delay ensures tight timing control in phase-shifted or resonant topologies requiring precise dead-time management. |
| EAS | 502 mJ - Non-repetitive avalanche energy rating validates reliability during load dump or short-circuit transients without external snubbers. |
Pinout & Package
PSMN063-150D uses the SOT428 (DPAK) plastic surface-mount package with three leads (one cropped), where the mounting base (mb) is electrically connected to the drain terminal and serves as the primary thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control electrode accepting 10 V logic-level drive; threshold range 2–4 V ensures compatibility with 3.3 V/5 V microcontrollers via level-shifting or buffer. |
| 2 (D / mb) | Drain & Mounting Base | High-side power node and thermally conductive metal pad; must be soldered to large copper area or heatsink for Rth(j-mb) = 1 K/W performance. |
| 3 (S) | Source | Reference node for gate drive and current sensing; tied to power ground in low-side switch configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) with TrenchMOS | 63 mΩ enables <1.5 W conduction loss at 15 A, reducing thermal footprint in compact 50–200 W power modules. |
| Integrated drain-to-mounting-base connection | Direct thermal path (Rth(j-mb) = 1 K/W) eliminates need for thermal vias or interface paste in PCB-mounted heatsinking. |
| Fast switching with low QG | 55 nC total gate charge and 48 ns td(off) support efficient operation up to 500 kHz in high-frequency SMPS designs. |
| Rugged body diode | 105 ns trr and 0.55 µC Qr minimize switching losses and voltage overshoot during freewheeling in buck and flyback converters. |
| Avalanche-rated structure | 502 mJ EAS allows safe operation under inductive turn-off stress without external clamping, simplifying protection circuitry. |
Applications
| DC-DC Converters | Switched-Mode Power Supplies |
|---|---|
Use Scenario: High-efficiency 12 V–48 V input, 3.3 V/5 V/12 V output buck converters in telecom and server power modules. IC Role / Device Role / Timing Role: Primary low-side synchronous rectifier or high-side main switch operating at 200–500 kHz. Use Value: 63 mΩ RDS(on) and 1 K/W thermal resistance maintain junction temperature below 125 °C at 15 A continuous, enabling fanless operation. | Use Scenario: AC-DC front-end PFC and secondary-side LLC resonant converter stages in industrial power supplies. IC Role / Device Role / Timing Role: Main switching FET in continuous conduction mode (CCM) boost PFC or half-bridge LLC primary switch. Use Value: 150 V VDS rating and 502 mJ avalanche energy ensure robustness against line surges and transformer leakage spikes. |
| Motor Drive Inverters | LED Driver Circuits |
Use Scenario: Low-voltage (<60 V) BLDC motor inverters in HVAC blowers, power tools, and robotics. IC Role / Device Role / Timing Role: Phase-leg low-side switch in 3-phase inverter with PWM frequencies up to 30 kHz. Use Value: Fast 38 ns fall time and low 27 nC QGD reduce switching losses and EMI generation during high-dV/dt commutation. | Use Scenario: Constant-current LED drivers for architectural and street lighting with 24–48 V input and multi-string outputs. IC Role / Device Role / Timing Role: Dimmable PWM-controlled high-side switch regulating current through LED strings. Use Value: Stable VGS(th) (2–4 V) and low gate leakage (<100 nA) ensure precise dimming resolution and minimal standby power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFZ44NPBF | RDS(on) = 28 mΩ @ 10 V but rated only for 55 V VDS; larger TO-220 package increases thermal resistance. | Not suitable for 100+ V bus applications; limited to ≤48 V systems. | Select only if lower on-resistance is prioritized over voltage rating and surface-mount assembly. |
| STP16NF15 | VDS = 150 V matched, but RDS(on) = 120 mΩ and Rth(j-mb) not specified; TO-220 package lacks integrated heatsink pad. | Higher conduction loss and inferior thermal performance limit use to lower-current <10 A designs. | Prefer only when legacy TO-220 footprint is mandatory and thermal margin is available. |
Compared with IRFZ44NPBF and STP16NF15, PSMN063-150D uniquely combines 150 V rating, 63 mΩ on-resistance, DPAK thermal integration (Rth(j-mb) = 1 K/W), and avalanche ruggedness-making it optimal for space-constrained, high-reliability 48–100 V industrial power stages.
Availability
PSMN063-150D is available at Aetrix Electronics and suitable for DC-DC converters, switched-mode power supplies, and motor drive inverters requiring stable component supply across extended production lifecycles.
Supply support for PSMN063-150D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.
This part belongs to the SiliconMAX standard-level TrenchMOS family, engineered for cost-sensitive yet thermally demanding industrial and computing power conversion applications where robustness and manufacturability are essential.
FAQ
What is the maximum continuous drain current for PSMN063-150D at 100 °C mounting base temperature?
The maximum continuous drain current is 20 A at Tmb = 100 °C and VGS = 10 V, as specified in Table 4 (Limiting Values). This derating from 29 A at 25 °C reflects thermal constraints of the DPAK package under real-world heatsink conditions.
Is the mounting base electrically isolated from the drain terminal?
No-the mounting base (pin 2) is internally connected to the drain, as confirmed in Pinning Information (Table 2) and Package Outline (Figure 15). This design enables direct thermal coupling but requires electrical isolation of the heatsink in high-side configurations.
Does PSMN063-150D support 3.3 V logic-level gate drive?
No-it is a standard-level MOSFET with VGS(th) ranging from 2 V to 4 V at 25 °C, but RDS(on) is only guaranteed at VGS = 10 V. At 3.3 V, the device remains in weak inversion and cannot deliver rated current; a gate driver or level shifter is required.
What is the typical reverse recovery charge (Qr) of the integrated body diode?
The typical reverse recovery charge is 0.55 µC, measured at IS = 20 A, dIS/dt = −100 A/µs, VDS = 25 V, and Tj = 25 °C (Table 6, Characteristics). This value directly impacts turn-on loss in synchronous rectification and must be accounted for in driver sizing.
PSMN063-150D,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 29A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 63mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 55 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2390 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PSMN063-150D,118 FAQ
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6.How does Aetrix verify that PSMN063-150D,118 is sourced from the original manufacturer or authorized distributors?
All PSMN063-150D,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN063-150D,118 meets industry standards.
7.What is the process for return or replacement of PSMN063-150D,118?
All PSMN063-150D,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN063-150D,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN063-150D,118 part is unused and in its original packaging.
Return procedure for PSMN063-150D,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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