Nexperia USA Inc. PSMN070-200B,118
- Part No.:
- PSMN070-200B,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PSMN070-200B,118.pdf
- Description:
- MOSFET N-CH 200V 35A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:6,770
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Product details
Overview
PSMN070-200B,118 from Nexperia is a standard-level N-channel TrenchMOS FET in D2PAK (SOT404) package, rated for 200 V drain-source voltage, 35 A continuous drain current at Tmb = 25 °C, and 250 W total power dissipation. It delivers 60 mΩ typical RDS(on) at VGS = 10 V and ID = 17 A, with fast switching enabled by 28 nC QGD and 77 nC QG(tot), targeting high-efficiency DC-to-DC converters and switched-mode power supplies.
For engineers reviewing the PSMN070-200B,118 datasheet, PSMN070-200B,118 pinout, PSMN070-200B,118 application, or PSMN070-200B,118 equivalent, key selection criteria include thermal resistance (Rth(j-mb) = 0.6 K/W), avalanche ruggedness (462 mJ unclamped EDS(AL)S), gate threshold voltage range (1–6 V over -55 to 175 °C), and diode reverse recovery performance (160 ns trr, 1 µC Qr).
Technical Context
This device employs TrenchMOS silicon technology optimized for standard-level operation-requiring ≥10 V gate drive for full enhancement-and features an integrated source-drain diode with 0.85–1.2 V forward drop at 25 A. Its mounting base is electrically connected to the drain terminal, enabling low-inductance heatsinking while defining the primary thermal path.
The FET supports high-frequency switching via low dynamic parameters: Ciss = 4570 pF, Coss = 370 pF, and Crss = 160 pF at VDS = 25 V; turn-on delay is 22 ns and fall time is 90 ns under standardized test conditions (VDS = 100 V, RL = 2.7 Ω, RG(ext) = 5.6 Ω).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V maximum - defines safe blocking capability in high-voltage DC bus or flyback primary-side applications |
| RDS(on) | 60 mΩ typical at VGS = 10 V, ID = 17 A, Tj = 25 °C - sets conduction loss floor in continuous-current topologies |
| QGD | 28 nC - directly impacts Miller-induced switching delay and gate driver power requirement |
| Rth(j-mb) | 0.6 K/W - enables high-power dissipation with minimal junction-to-heatsink temperature rise |
| trr | 160 ns - determines diode commutation loss and EMI generation during hard-switched freewheeling |
| EDS(AL)S | 462 mJ unclamped avalanche energy - provides robustness against inductive load transients without external snubbing |
Pinout & Package
PSMN070-200B,118 uses the SOT404 (D2PAK) plastic surface-mount package with three leads and an exposed metal mounting base electrically tied to the drain. Pin 2 is internally connected to the mounting base and not externally accessible for signal connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control input requiring ≥10 V for full enhancement; low gate charge (77 nC total) reduces driver losses |
| 2 | Drain (D) / Mounting Base | High-current output node and primary thermal interface; electrically common with tab-requires isolation from heatsink unless referenced to same potential |
| 3 | Source (S) | Power return path and reference for gate drive; internal source inductance (7.5 nH) affects high-di/dt switching stability |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × QG figure of merit | 60 mΩ × 77 nC = 4.62 Ω·nC - balances conduction and switching losses in 100–500 kHz SMPS designs |
| Integrated source-drain diode | 160 ns trr, 1 µC Qr - enables synchronous rectification or freewheeling without discrete diode in buck/boost stages |
| High avalanche energy rating | 462 mJ unclamped - withstands repetitive inductive turn-off stress in motor drives or relay drivers without derating |
| Thermal resistance optimization | Rth(j-mb) = 0.6 K/W - allows >200 W dissipation with <120 °C junction rise above 80 °C heatsink temperature |
Applications
| Server VRM Power Stage | Industrial AC-DC Front-End |
|---|---|
Use Scenario: High-current, high-efficiency 12 V input to 1 V output conversion in CPU/GPU voltage regulator modules. IC Role / Device Role / Timing Role: Synchronous high-side switch operating at 300–600 kHz with tight duty-cycle control. Use Value: 60 mΩ RDS(on) minimizes I²R loss at 35 A continuous, while 28 nC QGD ensures clean gate transitions under high dv/dt. |
Use Scenario: Active clamp flyback or LLC resonant converter in industrial 24–48 V DC input power supplies. IC Role / Device Role / Timing Role: Primary-side switching FET handling 200 V blocking and 35 A peak currents during burst-mode operation. Use Value: 462 mJ avalanche energy rating absorbs leakage inductance spikes without snubber, improving reliability in unregulated line conditions. |
| Telecom DC-DC Brick | Automated Test Equipment PSU |
Use Scenario: Isolated 48 V to 12 V intermediate bus converter in telecom shelf power systems. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward topology, driven with precise timing relative to primary switch. Use Value: Low 0.85 V VSD and 160 ns trr reduce conduction and recovery losses, increasing efficiency beyond 94% at full load. |
Use Scenario: Programmable high-current output stage in precision bench power supplies with fast transient response. IC Role / Device Role / Timing Role: Linear-assisted or hybrid switching pass element delivering up to 30 A with low thermal impedance. Use Value: 0.6 K/W Rth(j-mb) enables direct bolt-down heatsinking, maintaining <100 °C junction at 25 A continuous with forced air cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP35NF20 | 200 V, 35 A, RDS(on) = 55 mΩ typ, QG = 65 nC, TO-220 package | Higher Rth(j-a) (62 K/W vs. 0.6 K/W j-mb), no integrated mounting base | Preferred where PCB space permits through-hole mounting and lower gate charge is prioritized over thermal performance |
| IRFP4668PBF | 200 V, 65 A, RDS(on) = 22 mΩ typ, QG = 130 nC, TO-247 package | Lower RDS(on) but higher QG and larger footprint; Rth(j-c) = 0.45 K/W | Selected when >40 A continuous current is required and gate drive capability supports 130 nC charge |
Compared with STP35NF20 and IRFP4668PBF, PSMN070-200B,118 offers superior thermal management via its D2PAK mounting base, optimal RDS(on)/QG trade-off for 300–500 kHz operation, and verified avalanche ruggedness-making it ideal for compact, high-reliability SMPS where heatsink integration and transient robustness are critical.
Availability
PSMN070-200B,118 is available at Aetrix Electronics and suitable for server VRMs, industrial AC-DC front-ends, and telecom DC-DC bricks requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.
Supply support for PSMN070-200B,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with manufacturing rooted in process control and automotive-grade quality systems.
This device belongs to the SiliconMAX standard-level TrenchMOS family, engineered for cost-sensitive yet thermally demanding computing, communications, and industrial power conversion applications-not automotive or safety-critical use.
FAQ
What is the maximum continuous drain current rating for PSMN070-200B,118?
The maximum continuous drain current is 35 A at mounting base temperature (Tmb) = 25 °C, derating to 25 A at Tmb = 100 °C per the limiting values table. This rating assumes proper heatsinking via the exposed drain/mounting base and accounts for thermal resistance Rth(j-mb) = 0.6 K/W.
Is PSMN070-200B,118 suitable for avalanche operation?
Yes-PSMN070-200B,118 is characterized for unclamped inductive switching with EDS(AL)S = 462 mJ at Tj(init) = 25 °C, ID = 35 A, and Vsup ≤50 V. This rating is validated per JEDEC standards and supports reliable operation in circuits with significant leakage inductance.
How does the D2PAK package affect thermal design?
The SOT404 (D2PAK) package integrates a large copper mounting base electrically connected to the drain, providing a direct low-resistance thermal path from junction to heatsink (Rth(j-mb) = 0.6 K/W). Unlike TO-220 or SO-8 packages, this eliminates reliance on PCB copper for heat transfer and enables >200 W dissipation with appropriate mechanical clamping.
What is the gate threshold voltage range across temperature?
VGS(th) ranges from 1 V (min at Tj = 175 °C) to 6 V (max at Tj = -55 °C), with 2–4 V typical at 25 °C. This wide variation requires gate drive designs that ensure ≥10 V over temperature to maintain low RDS(on) and avoid linear-mode operation during hot startup.
PSMN070-200B,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 70mOhm @ 17A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 77 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4570 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PSMN070-200B,118 FAQ
1.How can I place an order for PSMN070-200B,118 through Aetrix?
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6.How does Aetrix verify that PSMN070-200B,118 is sourced from the original manufacturer or authorized distributors?
All PSMN070-200B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN070-200B,118 meets industry standards.
7.What is the process for return or replacement of PSMN070-200B,118?
All PSMN070-200B,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN070-200B,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN070-200B,118 part is unused and in its original packaging.
Return procedure for PSMN070-200B,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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