Nexperia USA Inc. PSMN1R0-80CSEJ
- Part No.:
- PSMN1R0-80CSEJ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 12-BESOP (0.370", 9.40mm Width), Exposed Pad
- Datasheet:
-
PSMN1R0-80CSEJ.pdf
- Description:
- PSMN1R0-80CSE/SOT8005A/CCPAK12
- Quantity:
- Payment:

- Shipping:

Inventory:5,647
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Product details
Overview
PSMN1R0-80CSEJ from Nexperia is an N-channel enhancement-mode MOSFET in CCPAK1212i (SOT8005A) package, rated for 80 V VDS, 0.95 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and qualified to 175 °C junction temperature. It delivers 495 A continuous drain current at Tmb = 25 °C and features enhanced Safe Operating Area (SOA) for linear-mode hot-swap and soft-start applications in 48 V telecom backplanes.
For engineers reviewing the PSMN1R0-80CSEJ datasheet, PSMN1R0-80CSEJ pinout, PSMN1R0-80CSEJ application, or PSMN1R0-80CSEJ equivalent, this page provides verified SOA performance data, thermal resistance (Rth(j-mb) = 0.075 K/W), gate charge (QG(tot) = 336 nC), avalanche energy (EAS = 1890 mJ), and mounting-base–referenced current derating curves - all critical for high-reliability power rail protection design.
Technical Context
This MOSFET employs a copper-clip inverted package (CCPAK1212i) with drain-connected mounting base for top-side cooling, enabling direct thermal interface to heatsinks. Its SOA is fully optimized for linear-mode operation, supporting robust inrush current handling during hot-swap turn-on without thermal runaway.
The device exhibits low threshold voltage variation (ΔVGS(th)/ΔT = −6.92 mV/K) and stable RDS(on) up to 175 °C (1.6–2.2 mΩ), ensuring predictable conduction loss across industrial temperature ranges. Gate drive requirements are defined by VGS(pl) = 4.5 V and QGD = 42.5 nC (typ), supporting fast, controlled switching with external gate resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - Maximum drain-source blocking voltage; supports 48 V systems with ≥1.6× safety margin against transients. |
| RDS(on) | 0.95 mΩ (typ) at VGS = 10 V, ID = 25 A, Tj = 25 °C - Enables sub-1 mΩ conduction loss for high-efficiency load switching. |
| ID (cont) | 495 A at Tmb = 25 °C - Continuous current rating referenced to mounting base temperature, not ambient; requires PCB thermal design per Fig. 2. |
| Rth(j-mb) | 0.075 K/W (typ) - Junction-to-mounting-base thermal resistance enables >1.5 kW power dissipation with minimal ΔT under forced cooling. |
| EAS | 1890 mJ (unclamped) - Avalanche energy rating validated at 129 A, 80 V, 282 µs; supports single-pulse fault tolerance in e-fuse applications. |
| QG(tot) | 336 nC (typ) - Total gate charge determines gate driver sizing and switching loss; low QGD/QG ratio improves hard-switching robustness. |
| tr/tf | 84 ns / 107 ns - Fast switching transitions reduce overlap loss; specified with RG(ext) = 5 Ω, enabling <100 ns turn-off control. |
Pinout & Package
CCPAK1212i (SOT8005A) is a 12-terminal surface-mount copper-clip package measuring 12 mm × 12 mm × 2.5 mm, with exposed drain-connected mounting base for top-side thermal management. The inverted layout places source and gate terminals on the top side, drain on the bottom via the thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–5 | Source (S) | Five parallel source terminals reduce source inductance and improve current sharing in high-di/dt hot-swap events. |
| 6 | Gate (G) | Single gate terminal with low-inductance path; requires Kelvin connection for precise gate drive in linear-mode operation. |
| 7–12 | Drain (D) | Six drain terminals plus mounting base provide low-impedance drain return; mounting base is electrically connected to drain. |
| mb | Mounting Base | Drain-connected thermal interface; must be soldered to PCB copper pour or heatsink for Rth(j-mb) performance. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced SOA | Validated linear-mode operation up to 100 A at 40 V (Fig. 3); prevents thermal runaway during soft-start inrush. |
| Inverted CCPAK1212i | Top-side cooling architecture enables direct heatsink attachment without thermal vias; JEDEC-qualified for second-source compatibility. |
| High-current capability | 495 A continuous (Tmb = 25 °C) and 3365 A pulsed (tp ≤ 10 µs); supports high-power 48 V server and telecom load switching. |
| Avalanche ruggedness | 100% tested unclamped EAS = 1890 mJ; eliminates need for external snubbers in e-fuse and overvoltage protection circuits. |
| Low RDS(on) drift | RDS(on) increases only 2.1× from 25 °C to 175 °C (Fig. 12); maintains efficiency in high-temperature environments. |
Applications
| Hot Swap | Load Switch |
|---|---|
|
Use Scenario: Insertion of line cards into live 48 V telecom backplanes without disrupting system operation. IC Role / Device Role / Timing Role: Main power FET in hot-swap controller circuit; operates in linear mode during inrush, then fully enhances for low-loss conduction. Use Value: Enhanced SOA prevents thermal failure during 100+ A inrush currents; 0.95 mΩ RDS(on) limits steady-state I²R loss to <5 W at 495 A. |
Use Scenario: Controlled power-up of high-capacitance subsystems (e.g., FPGA banks, memory modules) in enterprise servers. IC Role / Device Role / Timing Role: High-current load switch driven by dedicated controller IC; handles both slow-ramp soft-start and full-conduction phases. Use Value: 495 A continuous rating supports multi-rail sequencing; low QGD ensures clean turn-on/turn-off transitions without shoot-through risk. |
| Soft Start | E-fuse |
|
Use Scenario: Gradual ramp-up of 48 V supply to downstream DC-DC converters to limit input capacitor charging current. IC Role / Device Role / Timing Role: Linear-mode pass element regulated by op-amp feedback loop; dissipates peak power during ramp phase. Use Value: SOA-optimized design sustains 100 A at 20 V for >100 ms (Fig. 3); Rth(j-mb) = 0.075 K/W enables rapid heat extraction to mounting base. |
Use Scenario: Overcurrent protection for 48 V distribution networks in data center power shelves, replacing mechanical fuses. IC Role / Device Role / Timing Role: Current-sensing and interrupting element; triggered by controller upon fault detection; absorbs fault energy via avalanche. Use Value: 1890 mJ EAS rating allows single-pulse fault clearing without destruction; 129 A IAS supports fast trip response below cable damage thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IPP020N08N | 80 V, 2.0 mΩ RDS(on), TO-220FP package; Rth(j-c) = 0.55 K/W; no SOA optimization for linear mode. | Limited to switched-mode use; unsuitable for sustained inrush or soft-start linear operation. | Select only if board space permits through-hole mounting and application remains fully saturated. |
| Vishay SiR872DP | 80 V, 1.1 mΩ RDS(on), PowerPAK® 1212-8 package; Rth(j-a) = 1.2 K/W; SOA not characterized beyond 10 ms. | Acceptable for short-duration hot-swap but lacks validated 100+ ms linear-mode SOA data. | Prefer for cost-sensitive designs where thermal budget allows higher Rth and SOA margin is secondary. |
Compared with IPP020N08N and SiR872DP, PSMN1R0-80CSEJ offers superior thermal performance (Rth(j-mb) 7× lower than TO-220FP), guaranteed SOA for >100 ms linear operation, and JEDEC-standardized CCPAK1212i packaging-making it uniquely suited for mission-critical 48 V hot-swap and e-fuse implementations.
Availability
PSMN1R0-80CSEJ is available at Aetrix Electronics and suitable for 48 V telecom backplane hot-swap, high-current load switching, and solid-state e-fuse applications requiring stable component supply and long-term lifecycle support.
Supply support for PSMN1R0-80CSEJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs.
This part belongs to Nexperia's Application Specific MOSFETs (ASFETs) portfolio, engineered specifically for hot-swap and soft-start systems demanding robust linear-mode SOA, ultra-low RDS(on), and top-side cooling capability.
FAQ
What is the maximum continuous drain current for PSMN1R0-80CSEJ?
The maximum continuous drain current is 495 A at mounting base temperature (Tmb) = 25 °C, as verified in application testing (Fig. 2). Practical current is limited by PCB copper area, thermal interface quality, and ambient conditions-not by the die itself. Derating begins above 25 °C Tmb, reaching ~250 A at Tmb = 100 °C.
Does PSMN1R0-80CSEJ require a heatsink?
Yes-its CCPAK1212i package is designed for top-side cooling via the drain-connected mounting base. To achieve rated 1.55 kW power dissipation and maintain Tj ≤ 175 °C, the mounting base must be thermally coupled to a heatsink or large copper plane. Without external cooling, safe continuous current drops significantly due to Rth(j-mb) dependency.
Can PSMN1R0-80CSEJ be used in avalanche mode?
Yes-every unit undergoes 100% unclamped inductive switching test, guaranteeing EAS = 1890 mJ at 129 A, 80 V, and 282 µs. This makes it suitable for e-fuse and overvoltage protection where controlled avalanche energy absorption replaces external clamping components.
Is the CCPAK1212i package compatible with standard reflow profiles?
Yes-the SOT8005A footprint complies with IPC-7351B and JEDEC standards. Reflow requires peak temperature ≤ 260 °C (per JEDEC J-STD-020), 0.1 mm stencil thickness, and solder land pattern matching Fig. 19. Thermal pad must be fully soldered to ensure Rth(j-mb) performance and mechanical reliability.
PSMN1R0-80CSEJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 12-BESOP (0.370", 9.40mm Width), Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 495A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 0.95Ohm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 3.6V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 504 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 36802 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.55kW (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- CCPAK1212i
PSMN1R0-80CSEJ FAQ
1.How can I place an order for PSMN1R0-80CSEJ through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN1R0-80CSEJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN1R0-80CSEJ reliable?
The price and inventory of PSMN1R0-80CSEJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN1R0-80CSEJ is usually 5 days.
3.What payment methods are accepted for PSMN1R0-80CSEJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN1R0-80CSEJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN1R0-80CSEJ?
PSMN1R0-80CSEJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN1R0-80CSEJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN1R0-80CSEJ?
For technical support, including PSMN1R0-80CSEJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN1R0-80CSEJ requirements.
6.How does Aetrix verify that PSMN1R0-80CSEJ is sourced from the original manufacturer or authorized distributors?
All PSMN1R0-80CSEJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN1R0-80CSEJ meets industry standards.
7.What is the process for return or replacement of PSMN1R0-80CSEJ?
All PSMN1R0-80CSEJ units undergo pre-shipment inspection (PSI). If there is an issue with PSMN1R0-80CSEJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN1R0-80CSEJ part is unused and in its original packaging.
Return procedure for PSMN1R0-80CSEJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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