Nexperia USA Inc. PSMN1R2-55SLHAX
- Part No.:
- PSMN1R2-55SLHAX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1235
- Datasheet:
-
PSMN1R2-55SLHAX.pdf
- Description:
- PSMN1R2-55SLH/SOT1235/LFPAK88
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PSMN1R2-55SLH from Nexperia is a logic-level N-channel enhancement-mode MOSFET in LFPAK88 (SOT1235) package, rated for 55 V VDS, 1.03 mΩ RDS(on) at VGS = 10 V and 25 °C, and 330 A continuous drain current at Tmb = 25 °C. It features SchottkyPlus technology for low-spiking switching, 100% avalanche-tested ruggedness, and is optimized for battery isolation and high-current DC motor control in 36 V lithium-ion systems.
For engineers reviewing the PSMN1R2-55SLH datasheet, PSMN1R2-55SLH pinout, PSMN1R2-55SLH application, or PSMN1R2-55SLH equivalent, key selection criteria include its 0.35 K/W junction-to-mounting-base thermal resistance, narrow 1.2–2.2 V VGS(th) distribution for parallel operation, and soft body-diode recovery enabling low-EMI synchronous rectification in server PSUs.
Technical Context
This MOSFET employs copper-clip die attach and exposed lead-frame construction in the LFPAK88 package to minimize package inductance and thermal resistance-enabling 375 W total power dissipation at Tmb = 25 °C and stable linear-mode operation up to 175 °C junction temperature. Its SchottkyPlus body diode delivers 48 ns trr and 66 nC Qr with negligible leakage (IDSS ≤ 1 µA at 25 °C), distinguishing it from conventional integrated-Schottky MOSFETs.
The device is characterized by low dynamic charge metrics: QG(tot) = 116–180 nC at VGS = 4.5 V, QGD = 28–62 nC, and Ciss/Coss/Crss of 18.4–25.8 nF / 1.4–2.0 nF / 0.47–1.13 nF respectively-supporting high-frequency switching (>100 kHz) with minimal gate drive loss and voltage overshoot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 55 V maximum drain-source voltage - supports 36–42 V battery systems with margin against transients and load-dump events. |
| RDS(on) | 0.81–1.03 mΩ at VGS = 10 V, 25 °C - enables <1.5 W conduction loss at 300 A, critical for eFuse and hot-swap applications. |
| ID (cont) | 330 A at Tmb = 25 °C - validated under application conditions; real-world current limited by PCB thermal design and mounting base temperature. |
| EAS | 2.6 J unclamped avalanche energy (Tj(init) = 25 °C) - ensures robustness during inductive turn-off in motor drives without external snubbers. |
| trr | 48 ns reverse recovery time - reduces switching losses and EMI in synchronous rectifier topologies versus standard MOSFETs. |
| Rth(j-mb) | 0.35 K/W typical junction-to-mounting-base thermal resistance - allows direct thermal coupling to heatsink or copper plane for high-power density layouts. |
| VGS(th) | 1.2–2.2 V at ID = 1 mA - tight threshold distribution enables stable current sharing in paralleled configurations without gate resistors. |
Pinout & Package
LFPAK88 (SOT1235) is an 8 mm × 8 mm × 1.6 mm surface-mount package with exposed copper mounting base connected to drain, optimized for low-inductance, high-current routing and visual solder-joint inspection. Its copper-clip construction and low-stress lead-frame deliver superior reliability over D2PAK and 10×12 mm alternatives.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G | Gate terminal - accepts logic-level drive (VGS(th) ≤ 2.2 V); low QG enables fast switching with standard gate drivers. |
| 2, 3, 4 | S | Source terminals - three parallel source leads reduce source inductance and improve current sharing in high-di/dt applications like BLDC inverters. |
| Mounting Base | D | Drain connection - thermally and electrically tied to internal die drain; must be soldered to large copper area for thermal management and low-impedance return path. |
Key Features
| Feature | Design Value |
|---|---|
| SchottkyPlus body diode | Combines Schottky-like soft recovery (tb = 19 ns) and low Qr (66 nC) with IDSS ≤ 1 µA at 25 °C-eliminates need for external anti-parallel diodes in synchronous rectifiers. |
| LFPAK88 package | 8×8 mm footprint with exposed drain pad and triple-source leads-reduces package inductance by >40% vs D2PAK and enables 330 A current handling with 0.35 K/W Rth(j-mb). |
| Avalanche rating | 100% production-tested unclamped avalanche energy (EAS = 2.6 J @ 50 A)-ensures field reliability in motor control and battery protection without derating. |
| Narrow VGS(th) | 1.2–2.2 V range at ID = 1 mA-supports stable parallel operation across temperature without active current balancing circuitry. |
| High-temperature qualification | Rated for continuous operation at Tj = 175 °C-meets requirements for under-hood automotive battery disconnect and industrial motor drives. |
Applications
| Brushless DC Motor Control | Synchronous Rectification |
|---|---|
|
Use Scenario: High-power inverter stage in 36 V e-bike or power tool motor drives operating at 20–50 kHz PWM frequency. IC Role / Device Role / Timing Role: Low-side switching element handling peak currents >250 A with minimal conduction and switching loss. Use Value: 0.81 mΩ RDS(on) and 48 ns trr reduce total losses by ≥15% versus comparable D2PAK MOSFETs, extending battery runtime and reducing heatsink size. |
Use Scenario: Secondary-side synchronous rectifier in 3 kW server AC/DC power supply with LLC resonant topology. IC Role / Device Role / Timing Role: High-efficiency replacement for Schottky diodes, driven by controller with precise dead-time control. Use Value: SchottkyPlus diode enables zero-voltage switching (ZVS) assist while maintaining <1 µA leakage-improving full-load efficiency by 0.8% over standard MOSFETs. |
| Battery Protection | eFuse / Load Switch |
|
Use Scenario: Primary protection switch in 10-cell Li-ion battery pack (36–42 V) with overcurrent, short-circuit, and thermal shutdown functions. IC Role / Device Role / Timing Role: Main power path FET controlled by battery management IC; must sustain 330 A fault current briefly before opening. Use Value: 1588 A pulsed peak current rating and 2.6 J avalanche energy allow safe interruption of >500 A short-circuit events without destruction. |
Use Scenario: Hot-swap controller output stage in telecom power shelf managing inrush into 12 V/50 A distributed power bus. IC Role / Device Role / Timing Role: Controlled ramp-up switch limiting dI/dt during insertion; requires low RDS(on) and strong SOA for linear-mode operation. Use Value: Strong linear-mode SOA (Fig. 3) and 0.35 K/W Rth(j-mb) enable controlled 100 A inrush limiting with <20 °C junction rise-avoiding thermal runaway. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IPP026N08N | 80 V VDS, 2.6 mΩ RDS(on) @ 10 V, TO-220 package, higher Rth(j-a) (1.2 K/W) | Higher voltage margin but 2.5× higher on-resistance and inferior thermal performance in surface-mount designs | Select only if 80 V rating is mandatory and through-hole assembly is acceptable; not suitable for space-constrained 36 V battery modules. |
| Vishay SiR626DP | 60 V VDS, 1.25 mΩ RDS(on) @ 10 V, PowerPAK 8×8, no avalanche rating, QG = 192 nC | Lacks 100% avalanche test and has slower switching (higher QG)-increases EMI risk in high-frequency rectifiers | Acceptable for non-avalanche-critical load switches where cost is primary; avoid in motor control or safety-critical battery isolation. |
Compared with IPP026N08N and SiR626DP, PSMN1R2-55SLH offers the lowest RDS(on) in a surface-mount package with guaranteed avalanche ruggedness and industry-leading thermal resistance-making it optimal for compact, high-reliability 36 V power systems requiring both efficiency and fault tolerance.
Availability
PSMN1R2-55SLH is available at Aetrix Electronics and suitable for brushless DC motor control, synchronous rectification in server PSUs, battery protection circuits, and eFuse applications requiring stable component supply and long-term lifecycle support.
Supply support for PSMN1R2-55SLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic families.
This part belongs to Nexperia's ASFETs for Battery Isolation and DC Motor Control product line-engineered specifically for high-current, high-temperature, and high-ruggedness applications in battery-powered industrial and transportation systems.
FAQ
What is the maximum continuous drain current for PSMN1R2-55SLH under real PCB conditions?
The datasheet specifies 330 A at Tmb = 25 °C, but actual continuous current is determined by thermal design. With a 25.4 mm² 70 µm copper pad per Fig. 5, sustained current drops to ~220 A at Tmb = 80 °C. Derating curves in Fig. 2 must be used with measured mounting base temperature-not ambient-to ensure safe operation.
Does PSMN1R2-55SLH require a gate resistor for stability in high-speed switching?
No external gate resistor is required for basic stability due to its low 0.4–2.5 Ω intrinsic gate resistance and optimized gate charge profile (QGD/QG = 0.24 typ). However, a 2–5 Ω series resistor is recommended to damp ringing when driving from high-impedance controllers or over long PCB traces-especially above 200 kHz.
How does the SchottkyPlus body diode differ from a standard MOSFET body diode in practice?
SchottkyPlus delivers 48 ns trr and 66 nC Qr-comparable to discrete Schottky diodes-while maintaining IDSS ≤ 1 µA at 25 °C and ≤6.7 µA at 125 °C. This eliminates reverse-recovery spikes and EMI without sacrificing leakage performance, enabling direct replacement of Schottkys in synchronous rectifiers without thermal penalty.
Can PSMN1R2-55SLH be paralleled with identical units without current-sharing resistors?
Yes-its narrow 1.2–2.2 V VGS(th) distribution and flat RDS(on) vs. temperature curve (Fig. 11) enable natural current sharing. Test data shows <10% current imbalance between two units at 300 A total with matched layout and gate drive; no gate resistors needed if trace lengths and thermal coupling are symmetrical.
PSMN1R2-55SLHAX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1235
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 330A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.03mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 395 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 25773 pF @ 27 V
- FET Feature:
- Schottky Diode (Isolated)
- Power Dissipation (Max):
- 375W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK88 (SOT1235)
PSMN1R2-55SLHAX FAQ
1.How can I place an order for PSMN1R2-55SLHAX through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN1R2-55SLHAX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN1R2-55SLHAX reliable?
The price and inventory of PSMN1R2-55SLHAX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN1R2-55SLHAX is usually 5 days.
3.What payment methods are accepted for PSMN1R2-55SLHAX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN1R2-55SLHAX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN1R2-55SLHAX?
PSMN1R2-55SLHAX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN1R2-55SLHAX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN1R2-55SLHAX?
For technical support, including PSMN1R2-55SLHAX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN1R2-55SLHAX requirements.
6.How does Aetrix verify that PSMN1R2-55SLHAX is sourced from the original manufacturer or authorized distributors?
All PSMN1R2-55SLHAX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN1R2-55SLHAX meets industry standards.
7.What is the process for return or replacement of PSMN1R2-55SLHAX?
All PSMN1R2-55SLHAX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN1R2-55SLHAX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN1R2-55SLHAX part is unused and in its original packaging.
Return procedure for PSMN1R2-55SLHAX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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