Nexperia USA Inc. PSMN1R8-30BL,118
- Part No.:
- PSMN1R8-30BL,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PSMN1R8-30BL,118.pdf
- Description:
- MOSFET N-CH 30V 100A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:7
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Product details
Overview
PSMN1R8-30BL from Nexperia is a logic-level N-channel MOSFET in D2PAK (SOT404) package, rated for 30 V VDS, 1.8 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and qualified to 175 °C junction temperature. It serves as a high-current power switch in DC-DC converters, server power supplies, and motor control circuits where low conduction loss and direct 3.3/5 V gate drive compatibility are required.
For engineers reviewing the PSMN1R8-30BL datasheet, PSMN1R8-30BL pinout, PSMN1R8-30BL application, or PSMN1R8-30BL equivalent, key selection criteria include its 100 A continuous drain current capability at Tmb = 25 °C, 0.3 K/W typical junction-to-mounting-base thermal resistance, and verified avalanche energy rating of 1.1 J under unclamped inductive switching conditions.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(on) and fast switching with minimal gate charge (QG(tot) = 83 nC at VGS = 4.5 V). Its gate threshold voltage (VGS(th)) ranges from 1.3 V to 2.15 V at 25 °C, enabling reliable turn-on with standard logic-level drivers.
The device integrates an intrinsic body diode with 64 ns reverse recovery time and 60 nC recovered charge, supporting synchronous rectification and freewheeling in hard-switched topologies. Thermal design leverages the exposed mounting base (connected to drain) for direct heatsink attachment, achieving 0.3 K/W Rth(j-mb) under optimal conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines safe operating range in 24 V systems and 30 V bus applications. |
| RDS(on) | 1.8 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1.8 W conduction loss at 100 A, critical for high-efficiency power stages. |
| ID | 100 A @ Tmb = 25 °C - Continuous current rating limited by D2PAK package thermal capacity, not silicon die. |
| QG(tot) | 83 nC @ VGS = 4.5 V - Low total gate charge reduces driver power requirement and switching losses in high-frequency operation. |
| Rth(j-mb) | 0.3 K/W typical - Junction-to-mounting-base thermal resistance enables efficient heat transfer to external heatsink without PCB copper area dependency. |
| EAS | 1.1 J unclamped avalanche - Confirmed ruggedness against inductive switching transients without external snubbers in load-switch and motor-drive fault conditions. |
| VGS(th) | 1.7 V typical @ 25 °C - Ensures full enhancement with 3.3 V or 5 V microcontroller GPIOs without level-shifting circuitry. |
Pinout & Package
D2PAK (SOT404) plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base is electrically connected to drain and serves as primary thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control terminal; accepts logic-level input (3.3 V/5 V); requires ≤100 nA leakage current at ±16 V bias. |
| 2 | Drain (D) | Main power output terminal; internally bonded to mounting base for thermal and electrical connection to heatsink. |
| 3 | Source (S) | Power return node; referenced to gate drive ground; supports 100 A continuous and 1120 A pulsed source current. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive compatibility | Turns on fully at VGS ≥ 4.5 V, eliminating need for gate driver ICs in 3.3 V/5 V control systems. |
| Low RDS(on) at high temperature | 2.95 mΩ max @ Tj = 175 °C ensures stable conduction loss across full industrial temperature range. |
| High avalanche energy rating | 1.1 J non-repetitive EAS allows robust operation in inductive load switching without external protection. |
| Optimized gate charge profile | QGD/QG(tot) ratio of ~26% supports fast, controllable switching with reduced Miller-induced oscillation risk. |
| Thermally enhanced D2PAK package | Mounting base directly tied to drain enables >90% of heat to exit through heatsink interface, not PCB traces. |
Applications
| DC-DC Converters | Server Power Supplies |
|---|---|
Use Scenario: High-current synchronous buck converter in 12 V input, 1 V/200 A output VRM for CPU/GPU power delivery. IC Role / Device Role / Timing Role: Primary high-side power switch handling continuous 100+ A current with sub-2 mΩ on-resistance to minimize I²R losses. Use Value: Achieves >95% efficiency at full load due to 1.8 mΩ RDS(on) and 83 nC QG(tot), reducing thermal stress on VRM PCB layout. |
Use Scenario: OR-ing FET in redundant 48 V intermediate bus architecture for cloud data center PSUs. IC Role / Device Role / Timing Role: Bidirectional load switch controlling power path between parallel PSUs; body diode conducts during turn-off transition. Use Value: 64 ns trr and 60 nC Qr limit reverse recovery losses during hot-swap events, improving system reliability. |
| Motor Control | Load Switching |
Use Scenario: Half-bridge leg in 24 V BLDC motor driver for industrial automation actuators. IC Role / Device Role / Timing Role: Low-side switching element commutating phase current; operates with PWM frequencies up to 100 kHz. Use Value: 156 ns tr and 69 ns tf enable precise timing control and reduced switching loss at high PWM duty cycles. |
Use Scenario: Hot-swap protection FET in telecom line card power distribution with 100 A inrush current limiting. IC Role / Device Role / Timing Role: Main power path switch activated via microcontroller GPIO; handles steady-state load and transient surges. Use Value: 1120 A peak drain current rating and 175 °C Tj rating support safe operation during repeated inrush events without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF1404PBF | Higher RDS(on) (4.7 mΩ), higher QG(tot) (131 nC), TO-220 package, 175 °C rated. | Limited to lower-current (<60 A) applications due to inferior thermal resistance and higher conduction loss. | Choose only if D2PAK footprint is unavailable and board-level heatsinking is feasible. |
| STL220N3LLH6 | Lower RDS(on) (1.3 mΩ), same VDS, PowerFLAT 5x6 package, no exposed drain pad. | Requires PCB copper area for thermal management; unsuitable for bolt-down heatsink integration. | Select when space-constrained layouts demand smaller footprint and thermal performance via PCB copper is acceptable. |
Compared with IRF1404PBF and STL220N3LLH6, PSMN1R8-30BL uniquely balances ultra-low RDS(on), logic-level gate drive, and D2PAK's bolt-down thermal interface-making it optimal for high-current, thermally demanding industrial power switches where both efficiency and mechanical robustness matter.
Availability
PSMN1R8-30BL is available at Aetrix Electronics and suitable for DC-DC converters, server power supplies, and motor control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial OEM programs.
Supply support for PSMN1R8-30BL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic ICs.
This part belongs to Nexperia's Logic Level TrenchMOS family, engineered specifically for high-efficiency power switching in industrial, communications, and computing infrastructure where low gate drive voltage and thermal resilience are mandatory.
FAQ
What is the maximum continuous drain current for PSMN1R8-30BL at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is derated to approximately 60 A, per Figure 1 in the datasheet. This reflects thermal limitation of the D2PAK package-not silicon capability-and must be validated with actual heatsink thermal resistance and ambient conditions.
Can PSMN1R8-30BL be driven directly from a 3.3 V microcontroller GPIO without a gate driver?
Yes. With VGS(th) as low as 1.3 V and typical 1.7 V, the device achieves full enhancement at 3.3 V. At 25 °C, RDS(on) is 1.82 mΩ @ VGS = 4.5 V, confirming usable conduction even at 3.3 V, though 100% rated current requires VGS ≥ 4.5 V.
Is the mounting base electrically isolated from the drain terminal?
No. The mounting base is internally connected to pin 2 (drain) and forms part of the drain terminal. This configuration enables direct thermal coupling to a heatsink but requires electrical isolation of the heatsink from system ground if drain is not at ground potential.
What is the safe operating area (SOA) limitation at 100 µs pulse width?
At tp = 100 µs, the SOA limits ID to ~300 A at VDS = 10 V (Figure 3), governed by RDS(on) and thermal inertia. This supports short-circuit withstand in motor drives and overload protection in power supplies without immediate failure.
PSMN1R8-30BL,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.8mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 170 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 10180 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 270W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PSMN1R8-30BL,118 FAQ
1.How can I place an order for PSMN1R8-30BL,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN1R8-30BL,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN1R8-30BL,118 reliable?
The price and inventory of PSMN1R8-30BL,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN1R8-30BL,118 is usually 5 days.
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5.How can I obtain technical support or documentation for PSMN1R8-30BL,118?
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6.How does Aetrix verify that PSMN1R8-30BL,118 is sourced from the original manufacturer or authorized distributors?
All PSMN1R8-30BL,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN1R8-30BL,118 meets industry standards.
7.What is the process for return or replacement of PSMN1R8-30BL,118?
All PSMN1R8-30BL,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN1R8-30BL,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN1R8-30BL,118 part is unused and in its original packaging.
Return procedure for PSMN1R8-30BL,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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