Nexperia USA Inc. PSMN2R5-30YL,115
- Part No.:
- PSMN2R5-30YL,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PSMN2R5-30YL,115.pdf
- Description:
- MOSFET N-CH 30V 100A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:2,490
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Product details
Overview
PSMN2R5-30YL from Nexperia is a logic-level N-channel enhancement-mode MOSFET using TrenchMOS technology in LFPAK (SOT669) package, rated for 30 V VDS, 2.4 mΩ RDS(on) at VGS = 10 V and ID = 15 A, 100 A continuous drain current at Tmb = 25 °C, and optimized for high-efficiency switching in industrial and communications power stages.
For engineers reviewing the PSMN2R5-30YL datasheet, PSMN2R5-30YL pinout, PSMN2R5-30YL application, or PSMN2R5-30YL equivalent, this device supports logic-level gate drive (VGS(th) typ. 1.7 V), delivers low conduction loss in DC-DC converters and motor control H-bridges, and provides robust avalanche energy rating (103 mJ) for unclamped inductive switching.
Technical Context
This MOSFET employs TrenchMOS architecture to achieve low RDS(on) and fast switching with QGD = 6.5 nC and QG(tot) = 27 nC at VGS = 4.5 V, enabling efficient operation in synchronous rectification and Class-D amplifier output stages. Its thermal resistance Rth(j-mb) = 1.4 K/W ensures effective heat transfer to the mounting base.
The device features a source-drain diode with VSD = 0.79 V at IS = 25 A and Tj = 25 °C, and operates across -55 °C to +175 °C junction temperature range. Gate threshold voltage ranges from 0.65 V at 150 °C to 2.45 V at -55 °C, supporting stable turn-on under wide thermal conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines safe operating range in 24 V industrial bus and server VRM applications. |
| RDS(on) | 2.4 mΩ max at VGS = 10 V, ID = 15 A, Tj = 25 °C - Enables <1 W conduction loss at 20 A, critical for high-current DC-DC phases. |
| ID (continuous) | 100 A at Tmb = 25 °C - High current capability supported by LFPAK's low thermal resistance and triple-source-pin layout. |
| QGD | 6.5 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency. |
| EAS | 103 mJ non-repetitive avalanche energy - Supports reliable operation during inductive load turn-off without external snubbers. |
| VGS(th) | 1.3–2.15 V - Logic-level threshold enables direct drive from 3.3 V or 5 V microcontrollers without level-shifting. |
| Rth(j-mb) | 1.4 K/W - Junction-to-mounting-base thermal resistance enables high-power dissipation with minimal board copper area. |
Pinout & Package
Package: LFPAK (SOT669), plastic single-ended surface-mounted package with exposed mounting base connected to drain; optimized for high-current, low-inductance PCB layouts and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 - S | Source | Three parallel source terminals reduce package inductance and improve current sharing in high-frequency switching. |
| 4 - G | Gate | Single gate input with RG = 0.67 Ω typical; designed for low-impedance gate driver interface and fast edge control. |
| Mounting Base - D | Drain | Exposed copper drain pad soldered directly to PCB thermal plane; primary heat path and high-current return path. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive compatibility | VGS(th) ≤ 2.15 V ensures full enhancement with 3.3 V or 5 V controllers, eliminating need for gate drivers in low-side configurations. |
| Triple-source-pin configuration | Reduces source inductance and improves switching speed consistency, especially critical in synchronous buck topologies. |
| Low RDS(on) × QG figure of merit | 2.4 mΩ × 27 nC = 64.8 mΩ·nC - Balances conduction and switching losses for high-frequency (>500 kHz) power conversion. |
| Robust avalanche ruggedness | 103 mJ EAS allows safe operation in unclamped inductive switching events common in motor drives and Class-D amplifiers. |
| Wide temperature operation | Junction range -55 °C to +175 °C supports deployment in industrial enclosures and telecom base station power supplies. |
Applications
| Class-D Audio Amplifiers | Server DC-DC Converters |
|---|---|
Use Scenario: Output stage switching in high-fidelity audio amplifiers delivering >100 W into 4 Ω loads. IC Role / Device Role / Timing Role: High-side and low-side power switch in half-bridge topology; handles PWM frequencies up to 500 kHz with minimal dead-time distortion. Use Value: Low RDS(on) and fast QGD reduce THD+N and thermal rise, while triple-source pins suppress parasitic oscillation during zero-crossing transitions. |
Use Scenario: High-current synchronous rectifier in 12 V → 1 V/100 A VRM for CPU/GPU power delivery. IC Role / Device Role / Timing Role: Low-side FET in multiphase buck converter; switched at 600 kHz with 30 ns gate drive edges. Use Value: 2.4 mΩ RDS(on) limits conduction loss to <0.5 W per phase; LFPAK mounting base enables direct thermal coupling to 2 oz copper planes. |
| Industrial Motor Control | Communications Power Supplies |
Use Scenario: Half-bridge driver in 24 V BLDC motor controllers for factory automation actuators. IC Role / Device Role / Timing Role: High-current switching element in three-phase inverter leg; subjected to repetitive inductive flyback stress. Use Value: 103 mJ avalanche energy rating eliminates need for external clamping diodes; VGS(th) stability over -40 °C to +125 °C ensures consistent commutation timing. |
Use Scenario: Primary-side switch in isolated 48 V input telecom rectifier modules delivering 3.3 V/50 A outputs. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in LLC resonant converter; operated with adaptive gate timing. Use Value: Low Coss (710 pF) and Crss (314 pF) minimize capacitive losses at 300–600 kHz resonance; 1.4 K/W Rth(j-mb) sustains 88 W Ptot with forced-air cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PbF | RDS(on) = 3.0 mΩ @ 10 V; TO-220 package; higher Rth(j-c) = 1.5 K/W; no triple-source pins. | Limited to lower-frequency (<200 kHz) designs due to higher QGD (12 nC) and slower tr/tf. | Choose when legacy TO-220 footprint required and thermal budget permits larger heatsink. |
| DMTH3006LPS-13 | RDS(on) = 2.7 mΩ @ 10 V; PowerSO-8 package; QGD = 5.8 nC; Rth(j-mb) = 1.6 K/W. | Lower peak current rating (80 A vs. 100 A); less suitable for >60 A continuous motor phase legs. | Prefer for space-constrained telecom modules where LFPAK footprint is unavailable and 80 A suffices. |
Compared with IRL3803PbF and DMTH3006LPS-13, PSMN2R5-30YL delivers superior current density (100 A in LFPAK), lowest RDS(on), and best thermal resistance-making it optimal for high-power, high-frequency industrial and server applications where board space and thermal headroom are constrained.
Availability
PSMN2R5-30YL is available at Aetrix Electronics and suitable for Class-D amplifiers, server DC-DC converters, and industrial motor control systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for PSMN2R5-30YL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs.
This device belongs to Nexperia's TrenchMOS logic-level power MOSFET product line, engineered for high-efficiency, high-current switching in industrial power conversion, communications infrastructure, and audio amplification.
FAQ
What is the maximum continuous drain current for PSMN2R5-30YL at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is derated to approximately 65 A, as shown in Figure 1 of the datasheet. This value is determined by thermal limits-not electrical saturation-and assumes adequate PCB copper area for heat spreading from the mounting base.
Can PSMN2R5-30YL be driven directly by a 3.3 V microcontroller GPIO without a gate driver?
Yes-its VGS(th) range (1.3–2.15 V at 25 °C) and low gate charge (27 nC at 4.5 V) allow full enhancement with 3.3 V logic. However, for switching frequencies above 200 kHz or high-current loads (>30 A), a dedicated gate driver is recommended to ensure fast, low-loss transitions and prevent shoot-through.
How does the LFPAK package improve thermal performance compared to SO-8 or PowerSO-8?
The LFPAK (SOT669) uses an exposed copper mounting base directly soldered to the PCB, achieving Rth(j-mb) = 1.4 K/W-up to 40% lower than typical PowerSO-8 packages. This enables higher power dissipation without heatsinks and reduces thermal cycling stress on solder joints in high-reliability applications.
Is PSMN2R5-30YL qualified for automotive applications?
No-this part is explicitly designed and qualified for industrial and communications applications only. It is not AEC-Q101 qualified, lacks automotive-specific testing (e.g., HTOL, UHAST), and carries no automotive reliability warranty. For automotive use, select Nexperia's automotive-grade equivalents such as PSMN3R5-30YLC.
PSMN2R5-30YL,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.4mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 57 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3468 pF @ 12 V
- FET Feature:
- -
- Power Dissipation (Max):
- 88W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PSMN2R5-30YL,115 FAQ
1.How can I place an order for PSMN2R5-30YL,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN2R5-30YL,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN2R5-30YL,115 reliable?
The price and inventory of PSMN2R5-30YL,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN2R5-30YL,115 is usually 5 days.
3.What payment methods are accepted for PSMN2R5-30YL,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN2R5-30YL,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN2R5-30YL,115?
PSMN2R5-30YL,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN2R5-30YL,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN2R5-30YL,115?
For technical support, including PSMN2R5-30YL,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN2R5-30YL,115 requirements.
6.How does Aetrix verify that PSMN2R5-30YL,115 is sourced from the original manufacturer or authorized distributors?
All PSMN2R5-30YL,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN2R5-30YL,115 meets industry standards.
7.What is the process for return or replacement of PSMN2R5-30YL,115?
All PSMN2R5-30YL,115 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN2R5-30YL,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN2R5-30YL,115 part is unused and in its original packaging.
Return procedure for PSMN2R5-30YL,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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