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Nexperia USA Inc. PSMN2R6-80YSFX

Part No.:
PSMN2R6-80YSFX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
SOT-1023, 4-LFPAK
Datasheet:
AetrixPSMN2R6-80YSFX.pdf
Description:
PSMN2R6-80YSF/SOT1023/4 LEADS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:57

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Product details

Overview

PSMN2R6-80YSFX from Nexperia is an N-channel NextPower 80 V MOSFET in LFPAK56E (SOT1023) package, rated for 231 A continuous drain current at Tmb = 25 °C, with RDS(on) = 1.9–2.4 mΩ at VGS = 10 V and Tj = 25 °C, qualified to 175 °C junction temperature, and used as a primary-side switch or synchronous rectifier in high-efficiency DC-DC converters.

For engineers reviewing the PSMN2R6-80YSFX datasheet, PSMN2R6-80YSFX pinout, PSMN2R6-80YSFX application, or PSMN2R6-80YSFX equivalent, key selection criteria include its low QG × RDS(on) figure-of-merit (85 nC × 2.4 mΩ), strong unclamped avalanche rating (383 mJ), 0.45 K/W junction-to-mounting-base thermal resistance, and LFPAK56E package compatibility with high-current PCB layouts.

Technical Context

This MOSFET employs a trench-gated superjunction structure optimized for high-current switching with minimized conduction and switching losses. Its gate threshold voltage (VGS(th)) ranges from 2 V to 4 V at Tj = 25 °C, and exhibits -7 mV/K temperature coefficient, enabling stable turn-on behavior across industrial temperature ranges.

The device integrates a robust body diode with Qr = 33 nC and trr = 38 ns under specified conditions, supporting fast-recovery operation in synchronous rectification. Its avalanche ruggedness is 100% production-tested, and it meets Ha-free and RoHS compliance in the LFPAK56E package.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 80 V maximum - supports 48 V input bus designs with 20 % margin for transients in telecom and server power supplies.
RDS(on) @ 10 V / 25 °C 1.9–2.4 mΩ - enables <1.2 W conduction loss at 25 A, critical for high-current synchronous rectifiers.
ID(max) @ Tmb = 25 °C 231 A - validated continuous current rating using mounting base temperature measurement, not ambient.
QG(tot) 42.5–127 nC - low gate charge reduces driver power and enables efficient 100–500 kHz switching in LLC resonant converters.
EAS 383 mJ - non-repetitive avalanche energy at ID = 58 A, Vsup ≤ 80 V, enabling robustness against inductive switching faults.
Rth(j-mb) 0.45–0.51 K/W - allows direct thermal coupling to heatsink via exposed mounting base, supporting >200 W dissipation with minimal ΔT.
Qr (diode) 33 nC - low recovered charge minimizes reverse recovery losses and EMI in hard-switched topologies.

Pinout & Package

PSMN2R6-80YSFX uses the LFPAK56E (SOT1023) package - a 4-lead, single-ended surface-mount plastic package with an exposed copper mounting base electrically connected to the drain, optimized for high-current, low-inductance, and low-thermal-resistance applications.

Pin/Terminal Circuit Role Design Meaning
1 Source Primary source connection; three pins (1, 2, 3) are internally paralleled for low-inductance, high-current return path.
2 Source Redundant source terminal - reduces package inductance and improves current sharing in parallel configurations.
3 Source Third source terminal - enhances thermal spreading and lowers effective RDS(on) in high-frequency PWM operation.
4 Gate Control input; isolated from drain and source; requires 10 V drive for full enhancement and minimal RDS(on).
Mounting Base (mb) Drain Exposed copper pad electrically tied to drain; serves as primary thermal and high-current power path to PCB copper plane.

Key Features

Feature Design Value
Low Qrr 33 nC - reduces voltage spiking and EMI during diode commutation in synchronous rectification.
High ID(max) 231 A continuous - verified at mounting base temperature, enabling single-device replacement of multi-MOSFET paralleled solutions.
Low QG × RDS(on) ~200 pC·Ω - benchmark FoM for high-efficiency switching in 100–300 kHz DC-DC stages.
Avalanche-rated & 100% tested 383 mJ EAS - ensures reliability in flyback and hard-switched converters without external snubbers.
LFPAK56E package 0.45 K/W Rth(j-mb) - delivers 2.5× better thermal performance than standard SO-8 for same footprint.

Applications

AC-DC Synchronous Rectification Primary-Side Switch in Isolated DC-DC

Use Scenario: Secondary-side rectification in 65–200 W USB-PD adapters and laptop power supplies.

IC Role / Device Role / Timing Role: N-channel MOSFET replacing Schottky diode, driven by controller IC with adaptive gate timing.

Use Value: Reduces conduction loss by >40 % vs. 40 V Schottky, enabling >95 % efficiency at full load with lower thermal stress.

Use Scenario: High-current primary switch in 300–600 W LLC resonant converters for datacenter PSUs.

IC Role / Device Role / Timing Role: Main power switch operating at 200–350 kHz with ZVS, requiring low QG and robust dV/dt immunity.

Use Value: Enables ZVS over wider load range due to low QGD (16.5 nC typ) and fast tf (29 ns), reducing switching loss by ~18 %.

BLDC Motor Control (Inverter Leg) Flyback Converter Primary Switch

Use Scenario: High-power 3-phase inverter leg in 500–1000 W cordless power tools and e-bike controllers.

IC Role / Device Role / Timing Role: Low-side switch in 60–100 V battery-fed half-bridge, handling 150+ A peak phase current.

Use Value: Withstands repetitive avalanche events during motor phase commutation; 923 A pulsed IDM supports short-circuit robustness.

Use Scenario: Primary switch in universal-input (90–264 VAC) 30–65 W flyback converters for smart home devices.

IC Role / Device Role / Timing Role: Hard-switched 80 V-rated transistor handling reflected output voltage + leakage spike.

Use Value: 80 V VDS rating plus 383 mJ EAS eliminates need for clamping circuits in cost-sensitive consumer designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 80 V N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
Infineon IPP026N08N RDS(on) = 2.6 mΩ @ 10 V / 25 °C; QG(tot) = 95 nC; TO-220FP package Higher thermal resistance (Rth(j-c) ≈ 1.2 K/W); requires heatsink; no integrated mounting base Prefer when legacy through-hole layout or higher surge current tolerance is required; avoid in space-constrained SMT designs.
Vishay SiR626DP RDS(on) = 2.7 mΩ @ 10 V / 25 °C; QG(tot) = 79 nC; PowerPAK® 8x8 package Larger footprint (8×8 mm); Rth(j-mb) = 0.65 K/W; no 100 % avalanche test Choose when board area permits larger package and lower gate charge is prioritized over absolute RDS(on) minimum.

Compared with IPP026N08N and SiR626DP, PSMN2R6-80YSFX delivers the lowest RDS(on) in a compact LFPAK56E footprint, best-in-class Rth(j-mb), and production-verified avalanche ruggedness-making it optimal for thermally dense, high-efficiency SMT power stages where mounting base thermal coupling is leveraged.

Availability

PSMN2R6-80YSFX is available at Aetrix Electronics and suitable for high-current DC-DC converters, USB-PD adapter designs, and BLDC motor inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for volume production.

Supply support for PSMN2R6-80YSFX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

This device belongs to the NextPower series - engineered specifically for high-efficiency, high-current switching applications demanding low RDS(on), low gate charge, and robust avalanche capability in compact surface-mount packages.

FAQ

What is the maximum continuous drain current rating for PSMN2R6-80YSFX, and under what condition is it specified?

The maximum continuous drain current is 231 A, specified at mounting base temperature (Tmb) = 25 °C with VGS = 10 V. This rating reflects real-world thermal mounting performance-not ambient temperature-and drops to 163 A at Tmb = 100 °C per Figure 2 in the datasheet.

Does PSMN2R6-80YSFX require a negative gate voltage for safe turn-off in high-dV/dt environments?

No. The device has a gate-source voltage rating of ±20 V and is designed for standard 0 V/10 V gate drive. Its VGS(th) (2–4 V) and low Ciss/Crss ratio provide inherent noise immunity; no negative bias is needed for reliable operation in typical 48 V or 60 V bus applications.

How is the mounting base (drain) electrically isolated from the PCB in standard layout practices?

The mounting base is the drain terminal and must be electrically connected to the high-side DC node (e.g., primary rail in flyback). It is not isolated-it is soldered directly to a large copper pour tied to that net. Thermal isolation is achieved only via dielectric layers beneath the copper; electrical connection is mandatory and intentional.

Can PSMN2R6-80YSFX be paralleled with identical units without external gate resistors?

Yes-its matched threshold voltage (±0.5 V typical spread) and low gate resistance (0.4–1.6 Ω) enable stable current sharing. However, individual 5–10 Ω gate resistors are still recommended to damp ringing and ensure simultaneous turn-on/turn-off across paralleled devices in high-di/dt applications.

PSMN2R6-80YSFX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1023, 4-LFPAK
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
80 V
Current - Continuous Drain (Id) @ 25°C:
231A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.4mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
127 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
8191 pF @ 40 V
FET Feature:
-
Power Dissipation (Max):
294W (Ta)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56, Power-SO8

PSMN2R6-80YSFX FAQ

1.How can I place an order for PSMN2R6-80YSFX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN2R6-80YSFX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN2R6-80YSFX reliable?

The price and inventory of PSMN2R6-80YSFX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN2R6-80YSFX is usually 5 days.

3.What payment methods are accepted for PSMN2R6-80YSFX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN2R6-80YSFX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN2R6-80YSFX?

PSMN2R6-80YSFX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN2R6-80YSFX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN2R6-80YSFX?

For technical support, including PSMN2R6-80YSFX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN2R6-80YSFX requirements.

6.How does Aetrix verify that PSMN2R6-80YSFX is sourced from the original manufacturer or authorized distributors?

All PSMN2R6-80YSFX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN2R6-80YSFX meets industry standards.

7.What is the process for return or replacement of PSMN2R6-80YSFX?

All PSMN2R6-80YSFX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN2R6-80YSFX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN2R6-80YSFX part is unused and in its original packaging.

Return procedure for PSMN2R6-80YSFX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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