Nexperia USA Inc. PSMN2R8-80SSFJ
- Part No.:
- PSMN2R8-80SSFJ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1235
- Datasheet:
-
PSMN2R8-80SSFJ.pdf
- Description:
- NEXTPOWER 80/100V MOSFETS
- Quantity:
- Payment:

- Shipping:

Inventory:1,990
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PSMN2R8-80SSF from Nexperia is an N-channel NextPower 80 V MOSFET in LFPAK88 (SOT1235) package, rated for 205 A continuous drain current at Tmb = 25 °C, with RDS(on) = 2.2–2.8 mΩ at VGS = 10 V and Tj = 25 °C, qualified to 175 °C junction temperature, and used as a primary-side switch or synchronous rectifier in high-current DC-DC converters.
For engineers reviewing the PSMN2R8-80SSF datasheet, PSMN2R8-80SSF pinout, PSMN2R8-80SSF application, or PSMN2R8-80SSF equivalent, this page delivers verified electrical parameters, thermal resistance (Rth(j-mb) = 0.36–0.44 K/W), avalanche energy rating (EAS = 482 mJ), gate charge profile (QG(tot) = 47–143 nC), and LFPAK88 mounting-base thermal interface details critical for high-power switching design validation.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low QG × RDS(on) figure-of-merit (FOM), enabling high-efficiency hard-switching in industrial power supplies and motor drives. Its 80 V VDS rating supports 48 V bus architectures with margin, while its 100% tested avalanche ruggedness ensures robustness under unclamped inductive switching.
The device features a source-connected triple-pin configuration (Pins 2–4) and drain-connected mounting base (Pin mb), delivering low-inductance, high-current conduction paths. Its gate threshold voltage (VGS(th) = 2–4 V, typ. 3 V) enables standard 10 V gate drive compatibility without requiring level-shifting circuitry in most half-bridge topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V maximum drain-source voltage - supports 48 V systems with ≥66% overvoltage margin for transient suppression. |
| RDS(on) | 2.2–2.8 mΩ at VGS = 10 V, Tj = 25 °C - enables <1.5 W conduction loss at 205 A, critical for thermally constrained PCB layouts. |
| ID | 205 A continuous drain current at Tmb = 25 °C - validated for sustained operation in high-current synchronous rectification and BLDC phase legs. |
| QG(tot) | 47–143 nC total gate charge - determines driver power requirement and switching speed trade-off in 100–500 kHz SMPS designs. |
| EAS | 482 mJ non-repetitive avalanche energy - provides fault tolerance during short-circuit events without external snubbers in full-bridge inverters. |
| Rth(j-mb) | 0.36–0.44 K/W junction-to-mounting-base thermal resistance - enables direct thermal coupling to heatsinks or copper planes for >300 W dissipation capability. |
| QRR | 42 nC recovered charge - reduces diode reverse recovery losses and EMI in synchronous rectifier applications versus standard MOSFETs. |
Pinout & Package
LFPAK88 (SOT1235) is a 4-lead, single-ended surface-mount package with 8 mm × 8 mm × 1.6 mm body, featuring a large exposed copper mounting base (Pin mb) electrically connected to the drain for low-inductance, high-current thermal and electrical path. The package uses 2 mm pitch leads and is optimized for reflow soldering on 70 µm copper FR4 PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G | Gate terminal - accepts standard 10 V logic-level drive; RG = 0.6–2.4 Ω internal gate resistance limits ringing. |
| 2, 3, 4 | S | Source terminals - parallel connection reduces source inductance and improves current sharing in high-di/dt switching. |
| mb | D | Mounting base (drain) - primary thermal path and high-current drain return; requires soldered thermal pad to PCB copper plane. |
Key Features
| Feature | Design Value |
|---|---|
| Low QRR | 42 nC - cuts reverse recovery losses by >40% vs. legacy MOSFETs, reducing heat generation and EMI in synchronous rectifiers. |
| Avalanche-rated & 100% tested | 482 mJ EAS - eliminates need for external clamping circuits in motor control and UPS inverters subjected to load dump or shoot-through faults. |
| Triple-source pin configuration | Pins 2–4 tied to source - lowers effective source inductance by ~3×, improving gate control stability and dV/dt immunity in fast-switching bridges. |
| LFPAK88 thermal performance | Rth(j-mb) = 0.36 K/W - enables 341 W total power dissipation at Tmb = 25 °C, supporting compact, fanless industrial power modules. |
| High-temperature qualification | 175 °C Tj max - allows operation in sealed enclosures or high-ambient environments (e.g., EV charging stations, solar inverters). |
Applications
| AC-to-DC Synchronous Rectifier | Primary-Side Switch in Isolated DC-DC |
|---|---|
Use Scenario: Secondary-side rectification in 1–3 kW telecom and server PSUs operating at 100–300 kHz. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diodes to reduce conduction loss and improve efficiency above 95%. Use Value: 2.8 mΩ RDS(on) and 42 nC QRR cut rectifier losses by 30–50% versus 40 V Schottky alternatives, enabling higher power density. |
Use Scenario: Primary-side high-side switch in 600–1200 W LLC resonant converters for data center power supplies. IC Role / Device Role / Timing Role: Fast-switching, high-current primary switch handling 205 A peak currents during resonant transitions. Use Value: 143 nC QG(tot) and 0.44 K/W Rth(j-mb) support stable 200 kHz operation with minimal gate drive loss and thermal derating. |
| BLDC Motor Phase Leg | Battery Protection Circuit |
Use Scenario: High-power 3-phase inverter driving 5–10 kW industrial BLDC motors in HVAC compressors or traction systems. IC Role / Device Role / Timing Role: Half-bridge low-side switch with integrated source sensing and fast turn-off for precise PWM commutation. Use Value: Triple-source pins and 940 A pulsed IDM enable 10× overload current handling during motor startup without thermal runaway. |
Use Scenario: Main discharge/charge FET in 48 V Li-ion battery packs for e-bikes and energy storage systems. IC Role / Device Role / Timing Role: Bidirectional current-handling protection switch with avalanche energy absorption during cell imbalance faults. Use Value: 482 mJ EAS and 175 °C Tj rating allow safe operation during 100 ms short-circuit events without fuse activation or thermal shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, 80 V N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IPP026N08N | RDS(on) = 2.6 mΩ (typ.), QG(tot) = 120 nC, TO-220FP package, Rth(j-case) = 1.2 K/W | Larger footprint, higher thermal resistance, no triple-source pins - less suitable for ultra-low-inductance PCB layouts. | Select when legacy through-hole assembly or lower gate charge sensitivity is prioritized over thermal performance. |
| Vishay SiR626DP | RDS(on) = 2.7 mΩ (typ.), QG(tot) = 105 nC, PowerPAK 8x8 package, Rth(j-mb) = 0.55 K/W | Higher thermal resistance than LFPAK88, no 100% avalanche test, lower EAS (320 mJ) | Choose where cost is critical and avalanche stress is mitigated by system-level protection. |
Compared with IPP026N08N and SiR626DP, PSMN2R8-80SSF delivers superior thermal interface (0.36 K/W), lower QRR, and guaranteed avalanche ruggedness - making it optimal for space-constrained, high-reliability industrial switching where board-level thermal management and fault tolerance are design-critical.
Availability
PSMN2R8-80SSF is available at Aetrix Electronics and suitable for high-current DC-DC converters, BLDC motor drives, and battery protection systems requiring stable component supply across extended production lifecycles.
Supply support for PSMN2R8-80SSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.
This part belongs to the NextPower series - engineered specifically for high-efficiency, high-current switching in industrial power conversion, emphasizing low RDS(on), robust avalanche capability, and thermally optimized packaging.
FAQ
What is the maximum continuous drain current for PSMN2R8-80SSF at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is derated to 166 A per the datasheet Fig. 2. This reflects thermal limitations of the PCB copper area and ambient conditions, not device failure - actual current must be validated against measured Tj using Rth(j-mb) = 0.44 K/W and power loss calculations.
Is PSMN2R8-80SSF suitable for use in automotive applications?
No - this device is not AEC-Q101 qualified and is explicitly designated for industrial and consumer applications per the datasheet General Description. It lacks automotive-grade screening, qualification testing, and guaranteed PPAP documentation required for automotive ECUs or powertrain systems.
How does the LFPAK88 package improve thermal performance compared to traditional SO-8 or DPAK?
LFPAK88's exposed drain mounting base (Pin mb) provides a direct, low-resistance thermal path to the PCB, achieving Rth(j-mb) = 0.36 K/W - up to 3× better than DPAK (1.1 K/W) and 5× better than SO-8 (1.8 K/W). This enables higher power density and eliminates need for external heatsinks in many 300–500 W designs.
Can PSMN2R8-80SSF replace a 100 V MOSFET in a 48 V system?
Yes - its 80 V VDS rating provides sufficient margin for 48 V nominal systems with typical transients up to 60–70 V. However, if the system experiences >80 V spikes (e.g., due to long cable inductance or regenerative braking), a 100 V device remains safer; verify worst-case VDS stress with oscilloscope measurements before substitution.
PSMN2R8-80SSFJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1235
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 190A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 7V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.8mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 143 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 10088 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 341W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK88 (SOT1235)
PSMN2R8-80SSFJ FAQ
1.How can I place an order for PSMN2R8-80SSFJ through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN2R8-80SSFJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN2R8-80SSFJ reliable?
The price and inventory of PSMN2R8-80SSFJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN2R8-80SSFJ is usually 5 days.
3.What payment methods are accepted for PSMN2R8-80SSFJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN2R8-80SSFJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN2R8-80SSFJ?
PSMN2R8-80SSFJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN2R8-80SSFJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN2R8-80SSFJ?
For technical support, including PSMN2R8-80SSFJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN2R8-80SSFJ requirements.
6.How does Aetrix verify that PSMN2R8-80SSFJ is sourced from the original manufacturer or authorized distributors?
All PSMN2R8-80SSFJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN2R8-80SSFJ meets industry standards.
7.What is the process for return or replacement of PSMN2R8-80SSFJ?
All PSMN2R8-80SSFJ units undergo pre-shipment inspection (PSI). If there is an issue with PSMN2R8-80SSFJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN2R8-80SSFJ part is unused and in its original packaging.
Return procedure for PSMN2R8-80SSFJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PSMN2R8-80SSFJ Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

