Nexperia USA Inc. PSMN3R2-30YLC,115

Overview

PSMN3R2-30YLC from Nexperia is a logic-level enhancement-mode N-channel MOSFET in LFPAK (SOT669) package, rated for 30 V V_DS, 3.5 mΩ R_DS(on) at V_GS = 10 V and 25 °C, and qualified to 175 °C junction temperature. It delivers 100 A continuous drain current at T_mb = 25 °C and supports high-efficiency DC-DC conversion with ultra-low Q_G (14.2 nC @ 4.5 V) and Q_GD (4.1 nC).

For engineers reviewing the PSMN3R2-30YLC datasheet, PSMN3R2-30YLC pinout, PSMN3R2-30YLC application, or PSMN3R2-30YLC equivalent, this device is selected for high-current load switching, synchronous rectification, and power OR-ing where low gate drive voltage (4.5 V), thermal robustness, and fast switching with minimal switching loss are critical.

Technical Context

This MOSFET employs Nexperia's NextPower Superjunction technology, optimized for 4.5 V gate drive and delivering ultra-low gate charge parameters (Q_G(tot) = 14.2 nC, Q_GD = 4.1 nC) to minimize turn-on/turn-off energy loss. Its LFPAK package provides low parasitic inductance and resistance while enabling direct mounting-base thermal conduction (R_th(j-mb) = 1.46 K/W).

The device features a 1.53 V typical gate threshold voltage (V_GS(th)) at 25 °C and maintains stable R_DS(on) up to 150 °C (7.45 mΩ max @ V_GS = 4.5 V), supporting reliable operation in industrial and server power environments with wide ambient temperature ranges.

Key Specifications

Pinout & Package

Package: LFPAK (SOT669), also known as Power-SO8 - a plastic single-ended surface-mounted package with exposed mounting base connected to drain, optimized for high-current, low-inductance PCB layouts and direct thermal transfer to heatsink or copper plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Compared with IRL3803PBF and STL220N3LLH6, PSMN3R2-30YLC uniquely combines 175 °C qualification, ultra-low 4.5 V R_DS(on), and LFPAK's superior thermal performance-making it the only option validated for mission-critical, high-power-density server and industrial power stages requiring sustained thermal margin.

Availability

PSMN3R2-30YLC is available at Aetrix Electronics and suitable for DC-DC converters, server power supplies, and power OR-ing applications requiring stable component supply, long-lifecycle assurance, and traceable sourcing for production ramp.

Supply support for PSMN3R2-30YLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic ICs.

This device belongs to Nexperia's NextPower Superjunction MOSFET product line, engineered specifically for high-efficiency, high-current power conversion in industrial, communications, and datacenter infrastructure where thermal resilience and low gate-drive dependency are essential.

FAQ

What is the maximum continuous drain current for PSMN3R2-30YLC at 100 °C mounting base temperature?

At T_mb = 100 °C, the continuous drain current is derated to 85 A (per Table 5 limiting values). This reflects thermal constraints of the LFPAK package under real-world heatsink conditions, not silicon limitation. Derating follows the normalized curve in Figure 2, where power dissipation drops to ~65% of its 25 °C value.

Can PSMN3R2-30YLC be used as a replacement for a standard 30 V Schottky diode in synchronous rectification?

Yes-it is explicitly qualified for synchronous rectifier use, with 27 ns reverse recovery time, 19.5 nC recovered charge, and 0.8–1.1 V source-drain forward voltage. Its low R_DS(on) yields lower conduction loss than Schottky diodes above ~5 A, and its controlled turn-off eliminates reverse recovery spikes common in diode-based designs.

Does the mounting base (drain) require electrical isolation from the PCB ground plane?

Yes-the mounting base is internally connected to the drain terminal (per Table 2 pinning), so it must be electrically isolated from any other net unless drain is referenced to system ground. Standard practice uses thermally conductive but electrically isolating pads (e.g., ceramic-filled thermal interface material) when mounting to grounded heatsinks.

Is PSMN3R2-30YLC automotive-qualified?

No-this part is not automotive-qualified. The datasheet explicitly states in Section 10.3 that "non-automotive qualified products" are not tested per AEC-Q101 and lack automotive-specific reliability validation. It is intended for industrial, communications, and domestic equipment per Section 1.1.