Nexperia USA Inc. PSMN4R4-30MLC,115
- Part No.:
- PSMN4R4-30MLC,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
PSMN4R4-30MLC,115.pdf
- Description:
- MOSFET N-CH 30V 70A LFPAK33
- Quantity:
- Payment:

- Shipping:

Inventory:1,495
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Product details
Overview
PSMN4R4-30MLC from Nexperia is a logic-level enhancement-mode N-channel MOSFET in LFPAK33 (SOT1210) package, rated for 30 V VDS, 4.65 mΩ RDS(on) at VGS = 10 V and 25 A, with ultra-low QG (10.6 nC @ 4.5 V) and optimized for 4.5 V gate drive in high-efficiency DC-DC converters and synchronous buck regulators.
For engineers reviewing the PSMN4R4-30MLC datasheet, PSMN4R4-30MLC pinout, PSMN4R4-30MLC application, or PSMN4R4-30MLC equivalent, this device delivers verified low RDS(on) at logic-level gate voltage, robust avalanche energy (28.6 mJ), and thermal resistance of 1.95 K/W (junction-to-mounting base), critical for compact power stage design and thermal management in industrial and communications equipment.
Technical Context
This MOSFET employs Nexperia's NextPower Superjunction technology to achieve ultra-low gate charge (QG(tot) = 10.6 nC @ 4.5 V, QGD = 2.9 nC) and minimized output charge (QOSS = 9.8 nC), enabling fast switching with reduced switching losses in hard-switched topologies. Its 30 V VDS rating and 70 A continuous drain current (Tmb = 25 °C) support high-current load switching applications.
The device features a source-connected triple-pin configuration (Pins 1–3) and drain-connected mounting base (Pin 4 + mb), delivering low parasitic inductance and resistance. Its gate threshold voltage (VGS(th) = 1.45–2.15 V) and stable RDS(on) over temperature (10.2 mΩ @ 150 °C, VGS = 4.5 V) ensure reliable turn-on across wide operating conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines safe operation in ≤30 V bus systems like 24 V industrial rails. |
| RDS(on) | 4.65 mΩ @ VGS = 10 V, ID = 25 A, Tj = 25 °C - Confirmed conduction loss at full gate drive; enables <1 W conduction loss at 50 A. |
| QG(tot) | 10.6 nC @ VGS = 4.5 V - Total gate charge required for full turn-on; directly determines gate driver current demand and switching speed. |
| QGD | 2.9 nC - Gate-drain charge governing Miller plateau duration; critical for dV/dt immunity and shoot-through margin in half-bridge designs. |
| Rth(j-mb) | 1.95 K/W - Thermal resistance from junction to mounting base; enables direct heatsink attachment for high-power dissipation without PCB copper area dependency. |
| EAS | 28.6 mJ - Non-repetitive avalanche energy; supports unclamped inductive switching events in synchronous rectifier or motor drive freewheeling paths. |
| VGS(th) | 1.8 V (typ.) - Gate threshold voltage ensuring full enhancement at ≥4.5 V logic-level drive; eliminates need for level-shifting in microcontroller-driven circuits. |
Pinout & Package
Package: LFPAK33 (SOT1210), plastic single-ended surface-mount package with exposed drain-connected mounting base for enhanced thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 (S) | Source | Three parallel source terminals reduce source inductance and improve current sharing; essential for minimizing ringing in high-dI/dt switching. |
| 4 (G) | Gate | Single gate terminal with 1.8 Ω typical gate resistance; optimized for low-impedance 4.5 V drive without external gate resistor tuning. |
| Mounting Base (mb) | Drain | Exposed copper pad electrically and thermally connected to drain; serves as primary heat path and high-current drain return path. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive compatibility | Full enhancement at VGS = 4.5 V (RDS(on) = 5.2 mΩ typ.), eliminating gate driver ICs in MCU-based power stages. |
| Ultra-low QG and QGD | 10.6 nC total gate charge and 2.9 nC gate-drain charge enable >1 MHz switching in high-efficiency SMPS without excessive gate loss. |
| NextPower Superjunction architecture | Reduces RDS(on) × QG figure-of-merit by >30% vs. planar MOSFETs, improving system efficiency across light and heavy loads. |
| Triple-source pinning | Three dedicated source pins minimize common-source inductance, preserving gate control integrity during fast turn-off transitions. |
| Avalanche-rated design | 28.6 mJ unclamped avalanche energy allows safe operation under inductive load interruption without external snubbers. |
Applications
| DC-DC Converter Primary Switch | Synchronous Buck High-Side Switch |
|---|---|
|
Use Scenario: 12 V input to 3.3 V/20 A output step-down converter in telecom power supply. IC Role / Device Role / Timing Role: High-side main switch in synchronous buck topology, operating at 500 kHz with 4.5 V gate drive from controller. Use Value: 4.65 mΩ RDS(on) and 10.6 nC QG minimize combined conduction and switching losses, achieving >94% peak efficiency at full load. |
Use Scenario: CPU core voltage regulator (VRM) with 1–2 MHz switching frequency and tight transient response requirements. IC Role / Device Role / Timing Role: High-side synchronous rectifier switch, driven by dedicated gate driver with 4.5 V logic-compatible output. Use Value: Triple-source pinning reduces gate loop inductance, enabling clean 10 ns fall time and stable operation under 100 A/µs dI/dt transients. |
| Industrial Load Switch | Hot-Swap Controller Back-End FET |
|
Use Scenario: 24 V PLC I/O module output stage controlling solenoid loads up to 15 A. IC Role / Device Role / Timing Role: Low-side load switch with integrated reverse polarity protection and current limiting via external sense resistor. Use Value: 70 A continuous current rating and 175 °C max junction temperature support sustained 15 A operation with minimal derating on standard FR4 PCB. |
Use Scenario: 48 V intermediate bus hot-swap circuit protecting downstream FPGA and ASIC power domains. IC Role / Device Role / Timing Role: Main pass FET in inrush current-limited hot-swap controller IC reference design. Use Value: 28.6 mJ avalanche energy withstands 50 V line transients and inductive kickback during fault clearing without failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6342TRPBF | 30 V, 4.2 mΩ @ 10 V, but higher QG (15.5 nC @ 4.5 V); SO-8 package with higher Rth(j-a). | Limited to ≤10 A continuous due to SO-8 thermal limits; unsuitable for >15 A board-level power stages. | Select when board space is constrained and gate drive strength exceeds 15.5 nC requirement; avoid for high-current thermal-limited layouts. |
| DMTH3004LPSQ-13 | 30 V, 4.0 mΩ @ 10 V, QG = 12.5 nC @ 4.5 V; PowerSO-10 package with drain-exposed pad. | Higher gate resistance (2.5 Ω typ.) increases switching time; requires larger gate resistor for EMI control. | Prefer where existing PowerSO-10 footprint exists and moderate switching speed suffices; verify gate driver slew rate compatibility. |
Compared with IRLHS6342TRPBF and DMTH3004LPSQ-13, PSMN4R4-30MLC offers superior thermal performance (1.95 K/W vs. >3.5 K/W), lower QGD (2.9 nC vs. ≥4.1 nC), and triple-source layout-making it optimal for high-current, high-frequency synchronous buck and industrial load switching where thermal headroom and switching fidelity are critical.
Availability
PSMN4R4-30MLC is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and 24 V/48 V load switching applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for PSMN4R4-30MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic solutions.
This part belongs to Nexperia's NextPower Superjunction logic-level MOSFET product line, engineered specifically for high-efficiency, high-density power conversion in industrial, communications, and computing infrastructure where low gate charge and thermal performance are decisive.
FAQ
What is the maximum continuous drain current at 100 °C mounting base temperature?
At Tmb = 100 °C and VGS = 10 V, the maximum continuous drain current is 64 A per the Limiting Values table. This reflects thermal derating due to reduced power dissipation capability at elevated temperatures, with the 69 W Ptot limit scaling inversely with mounting base temperature.
Does PSMN4R4-30MLC have an integrated body diode, and what is its reverse recovery performance?
Yes, it includes a monolithic source-drain body diode with VSD = 0.82 V (typ.) at IS = 25 A and Tj = 25 °C. Its reverse recovery time trr is 18.3 ns (typ.) at dIS/dt = −100 A/µs, and recovered charge Qr is 11 nC, enabling efficient synchronous rectification without external Schottky diodes.
Can this MOSFET be used with 3.3 V microcontroller GPIOs without a gate driver?
No-while VGS(th) starts at 1.45 V, full enhancement requires ≥4.5 V for RDS(on) ≤6 mΩ. At 3.3 V, RDS(on) rises significantly (>15 mΩ), increasing conduction loss beyond acceptable levels; a 3.3 V–compatible gate driver or level shifter is required for reliable operation.
What is the significance of the mounting base (mb) being connected to the drain?
The mounting base is electrically tied to the drain and serves as the primary thermal and current path. This design minimizes thermal resistance (1.95 K/W) and reduces package inductance, but mandates isolation of the heatsink from other circuit potentials unless drain-referenced cooling is intentional in the system layout.
PSMN4R4-30MLC,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 70A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.65mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 23 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1515 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 69W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
PSMN4R4-30MLC,115 FAQ
1.How can I place an order for PSMN4R4-30MLC,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN4R4-30MLC,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN4R4-30MLC,115 reliable?
The price and inventory of PSMN4R4-30MLC,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN4R4-30MLC,115 is usually 5 days.
3.What payment methods are accepted for PSMN4R4-30MLC,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN4R4-30MLC,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PSMN4R4-30MLC,115?
PSMN4R4-30MLC,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PSMN4R4-30MLC,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PSMN4R4-30MLC,115?
For technical support, including PSMN4R4-30MLC,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN4R4-30MLC,115 requirements.
6.How does Aetrix verify that PSMN4R4-30MLC,115 is sourced from the original manufacturer or authorized distributors?
All PSMN4R4-30MLC,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN4R4-30MLC,115 meets industry standards.
7.What is the process for return or replacement of PSMN4R4-30MLC,115?
All PSMN4R4-30MLC,115 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN4R4-30MLC,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN4R4-30MLC,115 part is unused and in its original packaging.
Return procedure for PSMN4R4-30MLC,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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