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Nexperia USA Inc. PSMN5R0-30YL,115

Part No.:
PSMN5R0-30YL,115
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
SC-100, SOT-669
Datasheet:
AetrixPSMN5R0-30YL,115.pdf
Description:
MOSFET N-CH 30V 91A LFPAK56
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,460

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Product details

Overview

PSMN5R0-30YL from Nexperia is a logic-level N-channel enhancement-mode MOSFET using TrenchMOS technology in LFPAK (SOT669) package, rated for 30 V VDS, 5 mΩ RDS(on) at VGS = 10 V and 15 A, with 91 A continuous drain current at Tmb = 25 °C and 61 W power dissipation - deployed in industrial DC-DC converters and Class-D audio amplifiers.

For engineers reviewing the PSMN5R0-30YL datasheet, PSMN5R0-30YL pinout, PSMN5R0-30YL application, or PSMN5R0-30YL equivalent, this device supports logic-level gate drive (VGS(th) = 1.3–2.15 V), delivers low conduction loss in high-current switching paths, and features avalanche ruggedness (32 mJ unclamped EDS(AL)S) for robust operation in motor control and server power supplies.

Technical Context

This MOSFET employs TrenchMOS architecture to achieve low RDS(on) and optimized gate charge (QG(tot) = 14.1 nC at VGS = 4.5 V), enabling fast switching with minimal drive requirements. Its thermal resistance Rth(j-mb) = 1.39–2 K/W enables efficient heat transfer to the mounting base.

The integrated source-drain diode exhibits VSD = 0.84–1.2 V at IS = 25 A and Tj = 25 °C, with trr = 30 ns and Qr = 21 nC - supporting synchronous rectification and freewheeling in buck and half-bridge topologies.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V maximum drain-source voltage - defines safe blocking capability in 24 V industrial bus and 12 V server rail applications.
RDS(on)3.63–5 mΩ at VGS = 10 V, ID = 15 A, Tj = 25 °C - enables <100 mW conduction loss at 20 A, critical for high-efficiency DC-DC stages.
ID (continuous)91 A at Tmb = 25 °C - supports high-current output stages in Class-D amplifiers and motor drivers without forced cooling.
QG(tot)14.1 nC at VGS = 4.5 V - allows direct drive from 3.3 V/5 V microcontrollers without gate driver buffering.
EDS(AL)S32 mJ unclamped avalanche energy - sustains single-pulse inductive kickback in relay driving and H-bridge commutation.
Rth(j-mb)1.39–2 K/W - enables >50 W dissipation with ≤100 °C junction-to-mounting-base temperature rise under PCB copper pad heatsinking.
VGS(th)1.3–2.15 V at ID = 1 mA - ensures full enhancement with standard logic-level outputs, eliminating level-shifting circuitry.

Pinout & Package

Package: LFPAK (SOT669), plastic single-ended surface-mounted package with exposed mounting base connected to drain - optimized for low-inductance, high-current PCB layout and thermal performance via soldered copper pad.

Pin/TerminalCircuit RoleDesign Meaning
1SourcePrimary current return path; three parallel pins (1,2,3) reduce source inductance and resistance for high di/dt stability.
2SourceRedundant source connection to minimize loop inductance in switching nodes and improve EMI behavior.
3SourceThird source terminal - enables symmetric PCB routing and balanced current sharing across multiple source paths.
4GateControl input; low gate capacitance (Ciss = 1760 pF) and QGD = 3.8 nC support clean turn-on/turn-off with minimal Miller effect.
Mounting baseDrainExposed metal pad electrically connected to drain - serves as primary thermal path and high-current drain node; requires solder mask-defined thermal pad.

Key Features

FeatureDesign Value
Logic-level gate drive compatibilityVGS(th) range (1.3–2.15 V) ensures full enhancement from 3.3 V and 5 V controllers without external level shifters.
Low RDS(on) × QG figure of merit5 mΩ × 14.1 nC = 70.5 mΩ·nC - balances conduction and switching losses for high-frequency (<1 MHz) SMPS operation.
Integrated avalanche ruggedness32 mJ unclamped EDS(AL)S - eliminates need for external snubbers in inductive load switching like solenoid and BLDC phase control.
Thermally enhanced LFPAK packageRth(j-mb) ≤ 2 K/W - delivers >2× the power density of comparable SO-8 MOSFETs under identical PCB copper area.
Three-source-pin configurationPins 1–3 all tied to source - reduces source inductance by ~50% vs. single-source packages, improving gate control stability during hard switching.

Applications

Class-D Audio AmplifierServer DC-DC Converter

Use Scenario: High-efficiency, low-EMI output stage in 100–500 W audio amplifiers driving 4 Ω or 8 Ω loads.

IC Role / Device Role / Timing Role: Power switch in half-bridge topology operating at 300–500 kHz PWM frequency with synchronous rectification.

Use Value: Low QGD (3.8 nC) and RDS(on) (5 mΩ) minimize switching loss and thermal stress, enabling compact heatsink-free designs.

Use Scenario: Primary-side high-side switch in 48 V to 12 V or 5 V isolated or non-isolated buck-derived server power modules.

IC Role / Device Role / Timing Role: Main switching element in multiphase VRM or single-phase point-of-load converter with 300–1000 kHz switching.

Use Value: 91 A ID rating and 61 W Ptot allow high-current delivery in space-constrained 1U server boards with minimal thermal derating.

Industrial Motor ControlDC Power Distribution Switch

Use Scenario: Half-bridge leg in 24 V brushed DC or 3-phase BLDC motor drivers for factory automation actuators.

IC Role / Device Role / Timing Role: Low-side or high-side switch handling peak currents up to 336 A (pulsed) during startup and stall conditions.

Use Value: Avalanche energy rating (32 mJ) withstands back-EMF transients without clamping diodes, reducing BOM count and board area.

Use Scenario: Hot-swap and inrush current limiting switch in 24 V/48 V industrial PLC backplanes and I/O modules.

IC Role / Device Role / Timing Role: Load switch controlling power delivery to downstream subsystems with controlled turn-on slew rate.

Use Value: Logic-level gate threshold enables direct MCU GPIO control; low RDS(on) minimizes voltage drop (<100 mV at 20 A) during steady-state operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PSMN2R8-30YL,115Lower RDS(on) (2.8 mΩ typ), higher QG(tot) (17.2 nC), same VDS and packageBetter conduction loss but slower switching; suited for <300 kHz applications prioritizing efficiency over speedSelect when thermal budget is tighter than switching loss budget - e.g., high-duty-cycle DC-DC converters.
IRLML6344TRPBFSO-8 package, higher RDS(on) (4.5 mΩ min), lower ID (4.3 A), no avalanche ratingLimited current handling and no avalanche ruggedness - unsuitable for motor or inductive loadsOnly consider for low-power logic-level switching where footprint and cost outweigh reliability and current needs.

Compared with PSMN5R0-30YL, PSMN2R8-30YL trades higher gate charge for lower conduction loss in thermally constrained systems, while IRLML6344TRPBF lacks both current capacity and avalanche robustness - making it inappropriate for industrial motor or power supply use cases requiring sustained high-current or inductive switching.

Availability

PSMN5R0-30YL is available at Aetrix Electronics and suitable for Class-D amplifiers, server power supplies, industrial motor control, and DC power distribution systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for PSMN5R0-30YL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in MOSFETs, diodes, and ESD protection components for industrial and communications markets.

The PSMN5R0-30YL belongs to Nexperia's logic-level TrenchMOS portfolio, engineered for high-current, high-efficiency switching in industrial power conversion and audio applications where gate drive simplicity and thermal performance are critical.

FAQ

What is the maximum continuous drain current for PSMN5R0-30YL at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current is 64 A (per Table 4 Limiting Values). This derating reflects thermal constraints of the LFPAK package and PCB copper area - not device failure, but safe operation within its Rth(j-mb) limit and SOA boundaries.

Does PSMN5R0-30YL have an integrated body diode, and what are its key parameters?

Yes - it features a source-drain diode with forward voltage VSD = 0.84–1.2 V at IS = 25 A and Tj = 25 °C, reverse recovery time trr = 30 ns, and recovered charge Qr = 21 nC. These values enable use in synchronous rectification and freewheeling paths without external diodes in many designs.

Can PSMN5R0-30YL be driven directly from a 3.3 V microcontroller GPIO?

Yes - its VGS(th) range (1.3–2.15 V) and guaranteed RDS(on) at VGS = 4.5 V confirm reliable enhancement at 3.3 V. However, full 5 mΩ performance requires ≥4.5 V; at 3.3 V, RDS(on) rises to ~8–10 mΩ, increasing conduction loss proportionally.

Is the mounting base electrically isolated, and how should it be connected on the PCB?

No - the mounting base is internally connected to the drain terminal. It must be routed to the drain net and soldered to a dedicated copper pour for thermal and electrical integrity. Isolation is not possible; any attempt to float or ground the base violates the internal connection and risks device failure.

PSMN5R0-30YL,115 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SC-100, SOT-669
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
91A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
5mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
29 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1760 pF @ 12 V
FET Feature:
-
Power Dissipation (Max):
61W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56, Power-SO8

PSMN5R0-30YL,115 FAQ

1.How can I place an order for PSMN5R0-30YL,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN5R0-30YL,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN5R0-30YL,115 reliable?

The price and inventory of PSMN5R0-30YL,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN5R0-30YL,115 is usually 5 days.

3.What payment methods are accepted for PSMN5R0-30YL,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN5R0-30YL,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN5R0-30YL,115?

PSMN5R0-30YL,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN5R0-30YL,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN5R0-30YL,115?

For technical support, including PSMN5R0-30YL,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN5R0-30YL,115 requirements.

6.How does Aetrix verify that PSMN5R0-30YL,115 is sourced from the original manufacturer or authorized distributors?

All PSMN5R0-30YL,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN5R0-30YL,115 meets industry standards.

7.What is the process for return or replacement of PSMN5R0-30YL,115?

All PSMN5R0-30YL,115 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN5R0-30YL,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN5R0-30YL,115 part is unused and in its original packaging.

Return procedure for PSMN5R0-30YL,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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