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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. PSMN6R7-40MLD/2X

Name: PSMN6R7-40MLD/2X
Brand: Nexperia USA Inc.
SKU: PSMN6R7-40MLD/2X
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PSMN6R7-40MLD/2X

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SOT-1210, 8-LFPAK33 (5-Lead)

Datasheet:: PSMN6R7-40MLD/2X.pdf

Description:: PSMN6R7-40MLD/SOT1210/MLFPAK

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Product details

Overview

PSMN6R7-40MLD from Nexperia is a logic-level N-channel enhancement-mode MOSFET in LFPAK33 (SOT1210) package, rated for 40 V V_DS, 6.7 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, and 50 A continuous drain current at T_mb = 25 °C. It employs NextPower-S3 TrenchMOS Superjunction technology for high-efficiency synchronous rectification in DC–DC converters.

For engineers reviewing the PSMN6R7-40MLD datasheet, PSMN6R7-40MLD pinout, PSMN6R7-40MLD application, or PSMN6R7-40MLD equivalent, key selection criteria include its 2.09 K/W junction-to-mounting-base thermal resistance, 2.5 nC typical Q_GD, soft body-diode recovery (t_rr = 23 ns), and 175 °C qualified operation - critical for high-frequency, thermally constrained power stages.

Technical Context

This MOSFET uses advanced TrenchMOS Superjunction architecture with clip-bond die attach and solder die attach - eliminating wire bonds and glue to achieve low parasitic inductance and high reliability at 175 °C. Its gate threshold voltage (V_GS(th)) is 1.77 V typ at 25 °C with -4.3 mV/K temperature coefficient, enabling robust turn-on with 4.5 V logic-level drive.

The device features low dynamic losses: Q_G(tot) = 22 nC typ, Q_GD = 2.5 nC typ, and Crss = 60 pF max at V_DS = 20 V, supporting fast switching with minimal ringing. Its avalanche-rated design (E_AS = 58 mJ) and 100% tested ruggedness ensure survivability in unclamped inductive switching events.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	40 V - Maximum blocking voltage for 12 V/24 V input DC–DC and motor drive rails
R_DS(on) @ V_GS = 10 V	6.7 mΩ - Low conduction loss enabling >95% efficiency in 50 A synchronous rectifiers
I_D continuous	50 A @ T_mb = 25 °C - Validated current capability under real PCB thermal conditions
Q_GD	2.5 nC typ - Minimizes Miller-induced switching delay and improves hard-switching EMI
t_rr	23 ns - Fast, soft reverse recovery reduces diode commutation loss and voltage overshoot
R_th(j-mb)	2.09 K/W - Enables direct thermal coupling to heatsink or copper plane without thermal pad compromise
V_GS(th)	1.77 V typ - Ensures full enhancement with standard 3.3 V or 5 V microcontroller GPIO

Pinout & Package

LFPAK33 (SOT1210) package: surface-mount, 8-lead, 0.65 mm pitch, exposed mounting base connected to drain; qualified to 175 °C with clip-bond construction and no wire bonds or adhesive.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel source terminals reduce bond-wire inductance and improve current sharing
4	Gate (G)	Single gate input with low RG (0.8 Ω typ) for stable high-speed drive
Mounting Base (mb)	Drain (D)	Exposed copper base electrically and thermally connected to drain; enables wave soldering and visual solder inspection

Key Features

Feature	Design Value
Avalanche rating	100% tested to 58 mJ E_AS - eliminates need for external snubbers in flyback or buck-boost topologies
NextPower-S3 switching	Soft body-diode recovery (t_a/t_b = 14/8.5 ns) - suppresses voltage spikes during ZVS/ZCS transitions
Low-Q_GD/Q_G	2.5 nC / 22 nC typ - enables <100 ns turn-off with 5 Ω gate resistor, reducing switching loss at 1 MHz
175 °C qualification	Rated for continuous operation up to junction temperature of 175 °C - supports compact, sealed industrial power supplies
Wave-solderable leads	Exposed source and gate leads allow visual solder joint inspection and high-reliability reflow or wave assembly

Applications

Secondary Side Synchronous Rectification

DC–DC Converters

Use Scenario: High-current output stage of isolated 48 V–12 V buck-derived converters in telecom and server PSUs.

IC Role / Device Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction loss.

Use Value: 6.7 mΩ R_DS(on) cuts rectifier loss by >60% vs. 40 V/50 A Schottky, improving full-load efficiency by 1.2%.

Use Scenario: Primary-side high-side switch or secondary-side low-side switch in multiphase POL converters.

IC Role / Device Role: Power switch in 300 kHz–1 MHz buck or interleaved buck stages.

Use Value: 2.5 nC Q_GD and 23 ns t_rr enable clean 1 MHz switching with <50 mV ringing, easing EMI filter design.

Brushless DC Motor Drive

LED Lighting

Use Scenario: Half-bridge low-side switch in 24 V/48 V BLDC inverters for fans, pumps, and HVAC actuators.

IC Role / Device Role: PWM-controlled power switch handling 30–50 A peak phase current.

Use Value: 175 °C rating and 2.09 K/W R_th(j-mb) sustain 50 A pulses in compact motor driver PCBs without forced air.

Use Scenario: Constant-current switch in high-power LED drivers for streetlights and industrial lighting.

IC Role / Device Role: Dimming FET or PWM modulator in 40 V-input, 3 A–10 A constant-current outputs.

Use Value: Logic-level 1.77 V V_GS(th) ensures full turn-on with MCU PWM signals, eliminating level-shifter circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Infineon IPP040N04L	40 V, 4.0 mΩ R_DS(on), TO-252 package, higher Q_G (33 nC)	Larger footprint, higher gate drive power required; less suitable for ultra-thin designs	Choose when lower R_DS(on) outweighs thermal and layout constraints
Vishay SI7157DP	40 V, 7.5 mΩ R_DS(on), PowerPAK SO-8, 150 °C rating, higher Q_GD (3.8 nC)	Lower thermal performance (R_th(j-mb) ≈ 3.5 K/W), not 175 °C qualified	Choose for cost-sensitive consumer applications where 150 °C suffices

Compared with PSMN6R7-40MLD, IPP040N04L offers lower conduction loss but sacrifices switching speed and thermal density; SI7157DP trades off ruggedness and high-temperature capability for lower unit cost - making PSMN6R7-40MLD optimal for space-constrained, high-reliability 175 °C industrial power stages.

Availability

PSMN6R7-40MLD is available at Aetrix Electronics and suitable for secondary side synchronous rectification, DC–DC converters, and brushless DC motor drives requiring stable component supply across extended temperature and high-reliability production cycles.

Supply support for PSMN6R7-40MLD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions with focus on efficiency, miniaturization, and automotive-grade quality.

This device belongs to Nexperia's NextPower-S3 logic-level MOSFET product line, engineered specifically for high-frequency, high-efficiency power conversion in industrial, computing, and lighting systems demanding 175 °C operation and soft-switching capability.

FAQ

What is the maximum continuous drain current for PSMN6R7-40MLD at 100 °C mounting base temperature?

At T_mb = 100 °C, the continuous drain current remains 50 A per Figure 2 of the datasheet. This is enabled by the LFPAK33 package's low R_th(j-mb) (2.09 K/W) and robust clip-bond construction, allowing sustained high current even under elevated thermal conditions without derating.

Does PSMN6R7-40MLD support 3.3 V logic-level gate drive?

Yes - with V_GS(th) = 1.77 V typ and R_DS(on) = 8.6 mΩ at V_GS = 4.5 V and T_j = 25 °C, the device fully enhances using standard 3.3 V MCU outputs. Its low threshold and flat transfer curve (Figure 9) ensure stable conduction without gate boosting.

How does the LFPAK33 package improve thermal performance over traditional SO-8?

The LFPAK33 (SOT1210) replaces wire bonds with copper clip bonding and solder die attach, reducing thermal resistance from junction to mounting base to 2.09 K/W - ~40% lower than typical SO-8 MOSFETs. Its exposed drain base also allows direct thermal interface to heatsinks or inner-layer copper planes.

Is PSMN6R7-40MLD suitable for automotive applications?

No - this part is not AEC-Q101 qualified and lacks automotive-specific stress testing or PPAP documentation. While rated for 175 °C operation, it is intended for industrial, computing, and lighting applications. For automotive use, Nexperia offers the pin-compatible PSMN6R7-40MLH variant with full AEC-Q101 qualification.

PSMN6R7-40MLD/2X Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: SOT-1210, 8-LFPAK33 (5-Lead)

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 40 V

Current - Continuous Drain (Id) @ 25°C:: 50A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 6.7mOhm @ 20A, 10V

Vgs(th) (Max) @ Id:: 2.15V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 31 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 2071 pF @ 20 V

FET Feature:: -

Power Dissipation (Max):: 65W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK33

PSMN6R7-40MLD/2X FAQ

1.How can I place an order for PSMN6R7-40MLD/2X through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN6R7-40MLD/2X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN6R7-40MLD/2X reliable?

The price and inventory of PSMN6R7-40MLD/2X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN6R7-40MLD/2X is usually 5 days.

3.What payment methods are accepted for PSMN6R7-40MLD/2X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN6R7-40MLD/2X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN6R7-40MLD/2X?

PSMN6R7-40MLD/2X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN6R7-40MLD/2X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN6R7-40MLD/2X?

For technical support, including PSMN6R7-40MLD/2X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN6R7-40MLD/2X requirements.

6.How does Aetrix verify that PSMN6R7-40MLD/2X is sourced from the original manufacturer or authorized distributors?

All PSMN6R7-40MLD/2X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN6R7-40MLD/2X meets industry standards.

7.What is the process for return or replacement of PSMN6R7-40MLD/2X?

All PSMN6R7-40MLD/2X units undergo pre-shipment inspection (PSI). If there is an issue with PSMN6R7-40MLD/2X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN6R7-40MLD/2X part is unused and in its original packaging.

Return procedure for PSMN6R7-40MLD/2X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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