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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. PSMN6R7-40MSDX

Name: PSMN6R7-40MSDX
Brand: Nexperia USA Inc.
SKU: PSMN6R7-40MSDX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PSMN6R7-40MSDX

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SOT-1210, 8-LFPAK33 (5-Lead)

Datasheet:: PSMN6R7-40MSDX.pdf

Description:: MOSFET N-CH 40V 50A LFPAK33

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Product details

Overview

PSMN6R7-40MSDX from Nexperia is a standard-level N-channel enhancement-mode MOSFET in LFPAK33 (SOT1210) package, rated for 40 V V_DS, 6.7 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, and 50 A continuous drain current at T_mb = 25 °C. It employs NextPower-S3 TrenchMOS Superjunction technology and is qualified to 175 °C junction temperature, targeting high-efficiency, high-frequency DC-to-DC converters and synchronous rectification.

For engineers reviewing the PSMN6R7-40MSDX datasheet, PSMN6R7-40MSDX pinout, PSMN6R7-40MSDX application, or PSMN6R7-40MSDX equivalent, key selection criteria include its low Q_G (16 nC typ), soft-recovery body diode (t_rr = 23 ns, Q_r = 17 nC), avalanche ruggedness (74 mJ), and clip-bonded LFPAK33 thermal performance (R_th(j-mb) = 2.09 K/W).

Technical Context

This MOSFET uses advanced TrenchMOS Superjunction architecture with optimized charge distribution to achieve ultra-low gate charge (Q_G(tot) = 16 nC typ) and gate-drain charge (Q_GD = 2.4 nC typ), enabling fast switching with minimal voltage overshoot and ringing. Its body diode exhibits soft reverse recovery (t_a = 14 ns, t_b = 9 ns), reducing EMI in hard-switched topologies.

The LFPAK33 package features a copper-clip bonded die, exposed mounting base connected to drain, and solderable source/gate leads - eliminating wire bonds and adhesive, delivering low parasitic inductance (< 1.5 nH) and resistance while supporting wave soldering and visual joint inspection.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	40 V maximum - supports 36 V nominal bus systems with 10 % margin for transients
R_DS(on)	6.7 mΩ at V_GS = 10 V, T_j = 25 °C - enables <1.3 W conduction loss at 20 A
I_D	50 A continuous at T_mb = 25 °C - validated under application conditions, PCB-limited in practice
Q_G(tot)	16 nC typical - reduces gate drive power and enables >1 MHz switching in resonant converters
t_rr	23 ns typical - soft recovery minimizes voltage spikes and EMI during freewheeling
R_th(j-mb)	2.09 K/W typical - allows >30 W power dissipation with 65 °C ΔT to mounting base
E_AS	74 mJ non-repetitive avalanche energy - withstands unclamped inductive turn-off stress without failure

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount, clip-bonded, single-ended package with 8 leads and 0.65 mm pitch. It features an exposed copper mounting base (drain-connected), three parallel source terminals, one gate terminal, and no wire bonds or die attach adhesive - enabling high thermal conductivity and mechanical reliability up to 175 °C junction temperature.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel low-inductance source connections - reduce loop inductance and improve current sharing
4	Gate (G)	Single gate input with low RG (0.8 Ω typ) - ensures fast, controlled turn-on/turn-off with minimal external gate resistance
Mounting Base	Drain (D)	Exposed copper pad electrically and thermally connected to drain - provides primary heat path and low-inductance high-current return

Key Features

Feature	Design Value
Avalanche rating	100% tested to 74 mJ - eliminates need for external snubbers in inductive load switching
NextPower-S3 switching	Soft body-diode recovery (Q_r = 17 nC, t_rr = 23 ns) - reduces EMI and voltage overshoot in synchronous rectifiers
Low dynamic charge	Q_GD = 2.4 nC typ, Q_G(tot) = 16 nC typ - enables high-frequency operation (>500 kHz) with low gate drive loss
Thermal robustness	R_th(j-mb) = 2.09 K/W, T_j(max) = 175 °C - supports compact thermal design in space-constrained DC/DC modules
Manufacturing reliability	Clip-bonded die, solder die attach, no glue/wire bonds - achieves automotive-grade mechanical stability without qualification

Applications

Secondary Side Synchronous Rectification

High-Frequency DC-to-DC Converters

Use Scenario: Used as secondary-side switch in isolated flyback or LLC resonant converters operating at 300–1000 kHz.

IC Role / Device Role / Timing Role: Replaces Schottky diode to reduce conduction loss and improve efficiency at light-to-full load.

Use Value: 6.7 mΩ R_DS(on) and soft-recovery diode cut conduction losses by >40 % vs. 40 V Schottky, while minimizing EMI-induced gate oscillation.

Use Scenario: Primary or secondary switch in 12 V–48 V input POL converters with >500 kHz switching frequency.

IC Role / Device Role / Timing Role: High-speed power switch leveraging low Q_G and Q_GD for minimal dead-time loss and precise PWM control.

Use Value: 16 nC total gate charge and 7.6 ns turn-on delay enable stable operation at 1 MHz with <5 ns timing jitter and <100 mV V_DS spike.

Brushless DC Motor Drive

High-Efficiency LED Lighting Drivers

Use Scenario: Low-side switch in 24–48 V BLDC inverter half-bridges driving fans, pumps, or drones.

IC Role / Device Role / Timing Role: Fast-switching, avalanche-rugged N-channel MOSFET handling PWM commutation and regenerative braking currents.

Use Value: 282 A peak drain current and 74 mJ avalanche energy tolerate motor phase reversal and inductive kickback without derating.

Use Scenario: Primary switch in constant-current buck or buck-boost LED drivers for commercial lighting (30–150 W).

IC Role / Device Role / Timing Role: High-efficiency main switch managing thermal stress across wide dimming ranges and ambient temperatures.

Use Value: 175 °C rated junction and 2.09 K/W R_th(j-mb) sustain >94 % efficiency at full load while maintaining <105 °C case temperature on 25 mm × 25 mm copper area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 40 V power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Infineon IPP040N04L	R_DS(on) = 4.0 mΩ @ 10 V, Q_G = 24 nC, TO-252 package	Higher conduction loss margin but larger package footprint and higher gate charge	Prefer when lowest R_DS(on) dominates over switching loss and board space is not constrained
Vishay SI7850DP-T1-GE3	R_DS(on) = 6.5 mΩ @ 10 V, Q_G = 19 nC, PowerPAK SO-8	Slightly lower R_DS(on) but higher Q_G and no avalanche rating	Prefer when cost sensitivity outweighs avalanche ruggedness and thermal performance requirements

Compared with IPP040N04L and SI7850DP-T1-GE3, PSMN6R7-40MSDX delivers superior thermal resistance (2.09 K/W vs. ≥3.5 K/W), guaranteed avalanche capability, and lower Q_GD - making it optimal for compact, high-frequency, high-reliability DC/DC and motor drive designs where thermal headroom and EMI control are critical.

Availability

PSMN6R7-40MSDX is available at Aetrix Electronics and suitable for high-frequency DC-to-DC converters, secondary-side synchronous rectification, and brushless DC motor drives requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for PSMN6R7-40MSDX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with leadership in automotive-qualified and industrial-grade power components.

This device belongs to Nexperia's NextPower-S3 MOSFET product line, engineered specifically for high-efficiency, high-frequency power conversion in server, telecom, and industrial applications - emphasizing low switching loss, soft recovery, and robust thermal packaging.

FAQ

What is the maximum continuous drain current rating for PSMN6R7-40MSDX?

The datasheet specifies 50 A continuous drain current at mounting base temperature (T_mb) = 25 °C, validated under application test conditions. In practice, this value is limited by PCB copper area, thermal interface, and ambient temperature - typical designs achieve 30–40 A with 25 mm × 25 mm 70 µm copper on FR4.

Does PSMN6R7-40MSDX have avalanche capability, and is it tested?

Yes - it is fully avalanche-rated with 74 mJ non-repetitive drain-source avalanche energy (E_AS) at T_j = 25 °C and 100 % production-tested per datasheet Section 8. This enables reliable operation in inductive switching circuits without external protection components.

How does the LFPAK33 package improve thermal performance versus SO-8 or TO-252?

LFPAK33 achieves R_th(j-mb) = 2.09 K/W (typ) via direct copper clip bonding and an exposed drain-connected mounting base - offering ~40 % lower thermal resistance than comparable SO-8 packages and ~25 % better than TO-252, enabling higher power density and reduced heatsink dependency.

Can PSMN6R7-40MSDX be used in automotive applications?

No - this part is not automotive-qualified. The datasheet explicitly states "Non-automotive qualified products" and excludes AEC-Q101 qualification. It is intended for industrial, computing, and consumer power applications where 175 °C junction rating suffices but automotive-grade reliability testing is not required.

PSMN6R7-40MSDX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: SOT-1210, 8-LFPAK33 (5-Lead)

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 40 V

Current - Continuous Drain (Id) @ 25°C:: 50A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 6.7mOhm @ 20A, 10V

Vgs(th) (Max) @ Id:: 3.6V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 22 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 1642 pF @ 20 V

FET Feature:: -

Power Dissipation (Max):: 65W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK33

PSMN6R7-40MSDX FAQ

1.How can I place an order for PSMN6R7-40MSDX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN6R7-40MSDX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN6R7-40MSDX reliable?

The price and inventory of PSMN6R7-40MSDX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN6R7-40MSDX is usually 5 days.

3.What payment methods are accepted for PSMN6R7-40MSDX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN6R7-40MSDX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN6R7-40MSDX?

PSMN6R7-40MSDX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN6R7-40MSDX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN6R7-40MSDX?

For technical support, including PSMN6R7-40MSDX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN6R7-40MSDX requirements.

6.How does Aetrix verify that PSMN6R7-40MSDX is sourced from the original manufacturer or authorized distributors?

All PSMN6R7-40MSDX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN6R7-40MSDX meets industry standards.

7.What is the process for return or replacement of PSMN6R7-40MSDX?

All PSMN6R7-40MSDX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN6R7-40MSDX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN6R7-40MSDX part is unused and in its original packaging.

Return procedure for PSMN6R7-40MSDX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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