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Nexperia USA Inc. PSMN7R6-60BS,118

Part No.:
PSMN7R6-60BS,118
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixPSMN7R6-60BS,118.pdf
Description:
MOSFET N-CH 60V 92A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,569

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Product details

Overview

PSMN7R6-60BS from Nexperia is a standard-level N-channel MOSFET in D2PAK (SOT404) package, rated for 60 V VDS, 7.8 mΩ RDS(on) at 10 VGS/25 A/25 °C, 92 A continuous drain current at Tmb = 25 °C, and qualified to 175 °C junction temperature. It serves as a high-efficiency power switch in DC-DC converters, server power supplies, motor control, and load switching circuits.

For engineers reviewing the PSMN7R6-60BS datasheet, PSMN7R6-60BS pinout, PSMN7R6-60BS application, or PSMN7R6-60BS equivalent, key selection criteria include its 7.8 mΩ on-resistance at 10 V gate drive, 149 W total power dissipation at Tmb = 25 °C, 10.6 nC gate-drain charge, 38.7 nC total gate charge, and avalanche ruggedness of 110 mJ - all critical for thermal management and switching loss optimization in industrial and communications power systems.

Technical Context

This MOSFET employs a planar trench-gate structure optimized for low conduction and switching losses under standard-level gate drive (10 V). Its RDS(on) remains stable across -55 °C to 175 °C, with typical value of 5.9 mΩ at 25 °C and 13.3 mΩ at 175 °C, enabling reliable operation in thermally demanding environments.

The device features an integrated source-drain diode with 0.86 V forward voltage at 25 A/25 °C and 40.4 ns reverse recovery time, supporting synchronous rectification and freewheeling in hard-switched topologies. Its 0.49 K/W typical junction-to-mounting-base thermal resistance ensures efficient heat transfer to heatsinks or PCB copper planes.

Key Specifications

ParameterValue and Actual Design Meaning
VDS60 V maximum - supports 48 V bus systems with 20 % margin for transients
RDS(on)7.8 mΩ max at VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 40 A
ID (cont)92 A at Tmb = 25 °C - delivers high current density in compact D2PAK footprint
Ptot149 W at Tmb = 25 °C - requires mounting base thermal interface design for sustained output
QGD10.6 nC typical - determines Miller plateau duration and switching speed in hard-switched converters
EAS110 mJ non-repetitive avalanche energy - withstands unclamped inductive turn-off events up to 92 A
Rth(j-mb)0.49 K/W typical - allows ~300 W/cm² effective power density with proper heatsinking

Pinout & Package

Supplied in plastic single-ended surface-mounted D2PAK (SOT404) package with 3 leads (one lead cropped); mounting base (mb) is electrically connected to drain and serves as primary thermal path.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateControls channel conduction; requires 10 V standard-level drive for full enhancement
2 (D)DrainMain high-side power terminal; internally connected to mounting base for thermal and electrical continuity
3 (S)SourcePower return and reference node; forms common connection with gate driver ground

Key Features

FeatureDesign Value
Standard-level gate drive compatibilityOperates fully enhanced at 10 VGS, eliminating need for gate boosters in 5–12 V control systems
High-temperature qualificationRated for continuous operation up to 175 °C junction temperature - suitable for sealed industrial enclosures
Low QG/QGD ratio38.7 nC total gate charge with 10.6 nC gate-drain component - improves EMI and reduces driver power demand
Integrated source-drain diode0.86 V VSD at 25 A/25 °C and 40.4 ns trr - enables use in freewheeling and synchronous rectifier roles without external diode

Applications

DC-DC ConvertersServer Power Supplies

Use Scenario: Primary-side switch in 48 V input, 12 V output isolated LLC resonant converter.

IC Role / Device Role / Timing Role: High-side power switch handling 60 A peak currents with <100 ns switching transitions.

Use Value: 7.8 mΩ RDS(on) and 10.6 nC QGD minimize conduction and switching losses, achieving >96 % efficiency at full load.

Use Scenario: OR-ing FET in redundant 12 V intermediate bus architecture.

IC Role / Device Role / Timing Role: Low-loss bidirectional load switch managing hot-swap sequencing and fault isolation.

Use Value: 149 W Ptot and 0.49 K/W Rth(j-mb) support sustained 80 A operation with minimal thermal derating.

Motor ControlLoad Switching

Use Scenario: Half-bridge high-side switch in 24 V BLDC gate driver module.

IC Role / Device Role / Timing Role: Fast-switching power stage element controlling phase current commutation.

Use Value: 37 ns td(off) and 13 ns tf enable precise PWM timing at 20 kHz carrier frequency with low shoot-through risk.

Use Scenario: Solid-state replacement for electromechanical relay in programmable logic controller (PLC) output module.

IC Role / Device Role / Timing Role: Robust, zero-bounce load disconnect switch rated for 60 V/92 A inductive loads.

Use Value: 110 mJ EAS and 175 °C Tj rating ensure reliable turn-off of solenoid and contactor coils without snubbers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF1404PBF75 V VDS, 4 mΩ RDS(on), TO-220 package, higher QG (71 nC)Larger footprint, lower voltage margin, higher gate drive energy requirementPrefer when lower RDS(on) is critical and board space allows TO-220; avoid in high-frequency or thermally constrained designs
STP75NF7575 V VDS, 10.5 mΩ RDS(on), TO-220 package, lower avalanche rating (60 mJ)Higher on-resistance, reduced ruggedness, same package limitationsAcceptable for cost-sensitive 48 V systems where 175 °C operation is not required; verify thermal margin with Rth(j-a) = 62 K/W

Compared with IRF1404PBF and STP75NF75, PSMN7R6-60BS offers superior thermal performance via D2PAK mounting base (0.49 K/W vs. >1.5 K/W), tighter RDS(on) tolerance (5.9–7.8 mΩ vs. 3.5–4.5 mΩ but with higher QG), and guaranteed 175 °C operation - making it optimal for high-power-density, high-reliability industrial power stages.

Availability

PSMN7R6-60BS is available at Aetrix Electronics and suitable for DC-DC converters, server power supplies, and motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial OEM programs.

Supply support for PSMN7R6-60BS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade power MOSFETs.

This part belongs to Nexperia's standard-level logic-compatible power MOSFET product line, engineered for robust performance in industrial power conversion, motor drives, and infrastructure equipment where thermal resilience and gate-drive simplicity are essential.

FAQ

What is the maximum continuous drain current for PSMN7R6-60BS at 100 °C mounting base temperature?

The maximum continuous drain current is 65 A at Tmb = 100 °C and VGS = 10 V, as specified in Table 4 (Limiting Values). This reflects thermal derating from the 92 A rating at 25 °C due to reduced heat dissipation capability at elevated temperatures, and must be validated against actual PCB layout and heatsink performance.

Does PSMN7R6-60BS have an integrated body diode, and what are its key parameters?

Yes, it includes an integrated source-drain diode with 0.86 V forward voltage at 25 A/25 °C and 40.4 ns reverse recovery time (trr) under specified test conditions. The recovered charge (Qr) is 56 nC, supporting use in freewheeling paths without external diodes in many medium-frequency switching applications.

Can PSMN7R6-60BS be driven directly by a 5 V microcontroller GPIO pin?

No - it is a standard-level MOSFET requiring ≥10 V gate drive for full enhancement and low RDS(on). At 5 VGS, VGS(th) (2–4 V) is exceeded but RDS(on) rises significantly (>50 mΩ), increasing conduction loss and thermal stress. A dedicated gate driver or level-shifting circuit is required for reliable operation.

What is the thermal resistance from junction to mounting base, and how should it be used in thermal design?

Rth(j-mb) is 0.49 K/W typical (max 1.01 K/W), measured between die junction and the exposed metal mounting base. In thermal design, this value must be combined with the thermal resistance of the heatsink or PCB copper plane attached to the mounting base to calculate total junction-to-ambient resistance and ensure Tj stays ≤175 °C under worst-case power dissipation.

PSMN7R6-60BS,118 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
92A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
7.8mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
38.7 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2651 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
149W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

PSMN7R6-60BS,118 FAQ

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Please submit a Request for Quotation (RFQ) for PSMN7R6-60BS,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of PSMN7R6-60BS,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN7R6-60BS,118 is usually 5 days.

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5.How can I obtain technical support or documentation for PSMN7R6-60BS,118?

For technical support, including PSMN7R6-60BS,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN7R6-60BS,118 requirements.

6.How does Aetrix verify that PSMN7R6-60BS,118 is sourced from the original manufacturer or authorized distributors?

All PSMN7R6-60BS,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN7R6-60BS,118 meets industry standards.

7.What is the process for return or replacement of PSMN7R6-60BS,118?

All PSMN7R6-60BS,118 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN7R6-60BS,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN7R6-60BS,118 part is unused and in its original packaging.

Return procedure for PSMN7R6-60BS,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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