Nexperia USA Inc. PSMN8R3-40YS,115
- Part No.:
- PSMN8R3-40YS,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PSMN8R3-40YS,115.pdf
- Description:
- MOSFET N-CH 40V 70A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:6,505
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Product details
Overview
PSMN8R3-40YS from Nexperia is a standard-level N-channel MOSFET in LFPAK (SOT669) package, rated for 40 V drain-source voltage, 8.6 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 70 A continuous drain current at Tmb = 25 °C, and qualified to 175 °C junction temperature. It serves as a high-efficiency power switch in DC-DC converters, lithium-ion battery protection circuits, and motor control stages.
For engineers reviewing the PSMN8R3-40YS datasheet, PSMN8R3-40YS pinout, PSMN8R3-40YS application, or PSMN8R3-40YS equivalent, key selection criteria include its 1.39 K/W junction-to-mounting-base thermal resistance, 4.5 nC gate-drain charge, 20 nC total gate charge, and LFPAK's mechanical robustness for high-power density board layouts.
Technical Context
This MOSFET employs Nexperia's Advanced TrenchMOS technology to achieve low on-resistance and low gate charge simultaneously, enabling high efficiency in hard-switched and synchronous rectifier topologies. Its LFPAK package delivers superior thermal performance over SO-8 with reduced parasitic inductance and enhanced mechanical reliability under thermal cycling.
The device features a gate threshold voltage of 2–4 V at 25 °C and maintains stable operation across -55 °C to +175 °C junction temperature range. Its unclamped avalanche energy rating of 33 mJ supports ruggedness in inductive switching applications without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum - defines safe operating voltage ceiling in 12 V/24 V industrial and server power rails |
| RDS(on) | 8.6 mΩ typical at VGS = 10 V, Tj = 25 °C - enables <1 W conduction loss at 30 A, critical for thermally constrained PCBs |
| ID | 70 A continuous at Tmb = 25 °C - supports high-current load switching without forced air cooling |
| QG(tot) | 20 nC typical - determines gate drive power and switching speed in 100–500 kHz SMPS designs |
| Rth(j-mb) | 1.39 K/W typical - allows direct mounting to copper pour or heatsink for efficient heat extraction |
| EAS | 33 mJ non-repetitive avalanche energy - provides margin against inductive kickback in motor drive and relay control |
| Ciss | 1215 pF typical at VDS = 20 V - influences EMI behavior and gate driver sizing in high-frequency converters |
Pinout & Package
PSMN8R3-40YS uses the LFPAK (SOT669) plastic single-ended surface-mounted package - a 4-lead, power-optimized variant of Power SO8 with exposed drain pad for thermal and electrical performance. The package measures 4.1 × 3.8 mm footprint with 1.2 mm height and features solderable mounting base for low-impedance thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 - S | Source | Three parallel source terminals reduce package inductance and improve current sharing in high-di/dt switching |
| 4 - G | Gate | Single gate input with 0.63 Ω internal AC gate resistance - simplifies gate driver layout and damping design |
| Drain (mb) | Drain (mounting base) | Exposed copper drain pad on underside - primary thermal path to PCB and mechanical anchor point |
Key Features
| Feature | Design Value |
|---|---|
| Advanced TrenchMOS structure | Enables 8.6 mΩ RDS(on) with only 20 nC QG(tot), balancing conduction and switching losses |
| LFPAK package (SOT669) | Delivers 30 % lower Rth(j-mb) vs. standard SO-8, supporting higher power density in space-constrained boards |
| 175 °C junction rating | Permits operation in harsh environments (e.g., server PSU hot zones, automotive under-hood) without derating |
| Unclamped avalanche capability | 33 mJ EAS allows reliable operation in inductive loads without added clamping components |
| Low gate-drain charge (QGD) | 4.5 nC minimizes Miller-induced shoot-through risk and improves controllability in half-bridge configurations |
Applications
| DC-DC Converters | Lithium-ion Battery Protection |
|---|---|
|
Use Scenario: High-efficiency synchronous buck converter in telecom power modules delivering 12 V @ 40 A. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch handling continuous 40 A current with minimal conduction loss. Use Value: 8.6 mΩ RDS(on) reduces conduction loss to ~13.8 W, enabling >95 % efficiency at full load without heatsink. |
Use Scenario: Overcurrent and short-circuit protection circuit in 3-cell Li-ion battery pack (12.6 V max). IC Role / Device Role / Timing Role: Primary discharge FET controlled by protection IC to interrupt fault currents within microseconds. Use Value: 274 A peak drain current rating ensures survival during 10 µs short-circuit events without bond-wire fusing. |
| Load Switching | Motor Control |
|
Use Scenario: Hot-swap power distribution in industrial PLC backplane with 24 V supply rail. IC Role / Device Role / Timing Role: High-side load switch enabling inrush current limiting and controlled power-up sequencing. Use Value: 40 V VDS rating accommodates 24 V systems with 50 % transient margin; 1.39 K/W Rth(j-mb) prevents thermal runaway during sustained 50 A loads. |
Use Scenario: H-bridge leg in 24 V brushed DC motor driver for automated warehouse conveyors. IC Role / Device Role / Timing Role: Low-side switching element commutating bidirectional motor current up to 60 A peak. Use Value: 33 mJ avalanche energy absorbs inductive flyback during PWM turn-off, eliminating need for external freewheeling diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PSMN2R0-30YL,115 | 30 V VDS, 2.0 mΩ RDS(on), same LFPAK package | Better suited for ≤12 V systems requiring ultra-low RDS(on); not rated for 40 V transients | Select when system bus voltage is ≤15 V and lowest possible conduction loss is prioritized over voltage headroom |
| IPB080N04LGATMA1 | 40 V VDS, 8.0 mΩ RDS(on), TO-263 package, 3.5 nC QGD | Lower QGD improves hard-switching EMI but TO-263 requires larger PCB area and has higher Rth(j-mb) | Prefer when minimizing gate-drive-induced oscillation is critical and thermal interface to heatsink is available |
Compared with PSMN2R0-30YL,115, this part trades 10 V voltage headroom for 4× higher RDS(on); compared with IPB080N04LGATMA1, it sacrifices 0.5 mΩ RDS(on) and 1 nC QGD for 30 % smaller footprint and 40 % lower thermal resistance via LFPAK mounting base.
Availability
PSMN8R3-40YS is available at Aetrix Electronics and suitable for DC-DC converters, lithium-ion battery protection circuits, and motor control systems requiring stable component supply across extended production lifecycles.
Supply support for PSMN8R3-40YS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors - discrete devices, logic ICs, and MOSFETs - with leadership in efficiency, reliability, and miniaturization for high-volume applications.
This device belongs to Nexperia's LFPAK MOSFET product line, engineered for high-power-density switching in industrial power supplies, battery management, and motor drives where thermal performance and package robustness are critical.
FAQ
What is the maximum continuous drain current for PSMN8R3-40YS at 100 °C mounting base temperature?
The maximum continuous drain current is 50 A at Tmb = 100 °C, as specified in Table 4 (Limiting values). This reflects thermal derating due to reduced heat dissipation capability at elevated ambient or board temperatures, and must be verified against actual PCB copper area and airflow conditions.
Does PSMN8R3-40YS have integrated gate protection diodes?
No, PSMN8R3-40YS does not include integrated gate protection diodes. Its absolute maximum VGS rating is ±20 V, and external Zener clamping (e.g., 12 V TVS) is recommended in noisy environments or when driving with high-impedance sources to prevent gate oxide damage.
Can PSMN8R3-40YS be used in linear (analog) mode operation?
While not optimized for linear mode, the device supports limited linear operation with strict adherence to Safe Operating Area (SOA) limits shown in Figure 3. At VDS = 10 V, maximum DC current is ~25 A; pulsed operation up to 100 µs allows higher currents, but thermal runaway risk increases rapidly above 100 °C junction temperature.
What is the typical source-drain diode forward voltage at 25 A and 25 °C junction temperature?
The typical source-drain diode forward voltage is 0.84 V at IS = 25 A and Tj = 25 °C, per Table 6. This value rises to ~1.2 V at Tj = 175 °C, indicating moderate temperature coefficient - relevant for body-diode conduction during dead-time in half-bridge topologies.
PSMN8R3-40YS,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 70A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 8.6mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 20 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1215 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 74W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PSMN8R3-40YS,115 FAQ
1.How can I place an order for PSMN8R3-40YS,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PSMN8R3-40YS,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PSMN8R3-40YS,115 reliable?
The price and inventory of PSMN8R3-40YS,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN8R3-40YS,115 is usually 5 days.
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5.How can I obtain technical support or documentation for PSMN8R3-40YS,115?
For technical support, including PSMN8R3-40YS,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN8R3-40YS,115 requirements.
6.How does Aetrix verify that PSMN8R3-40YS,115 is sourced from the original manufacturer or authorized distributors?
All PSMN8R3-40YS,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN8R3-40YS,115 meets industry standards.
7.What is the process for return or replacement of PSMN8R3-40YS,115?
All PSMN8R3-40YS,115 units undergo pre-shipment inspection (PSI). If there is an issue with PSMN8R3-40YS,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PSMN8R3-40YS,115 part is unused and in its original packaging.
Return procedure for PSMN8R3-40YS,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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