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Nexperia USA Inc. PSMN8R5-40MLDX

Part No.:
PSMN8R5-40MLDX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
SOT-1210, 8-LFPAK33 (5-Lead)
Datasheet:
AetrixPSMN8R5-40MLDX.pdf
Description:
MOSFET N-CH 40V 60A LFPAK33
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,380

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Product details

Overview

PSMN8R5-40MLDX from Nexperia is a logic-level N-channel enhancement-mode MOSFET in LFPAK33 (SOT1210) package, rated for 40 V VDS, 8.5 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and 60 A continuous drain current at Tmb = 25 °C. It employs NextPower-S3 TrenchMOS Superjunction technology for high-efficiency synchronous rectification in DC–DC converters operating at high switching frequencies.

For engineers reviewing the PSMN8R5-40MLDX datasheet, PSMN8R5-40MLDX pinout, PSMN8R5-40MLDX application, or PSMN8R5-40MLDX equivalent, key selection criteria include its 2.33 K/W junction-to-mounting-base thermal resistance, 2.1 nC typical QGD, avalanche ruggedness (46 mJ), soft body-diode recovery, and LFPAK33's exposed mounting base for wave soldering and thermal management.

Technical Context

This MOSFET uses TrenchMOS Superjunction architecture with clip-bonded die and solder die attach-no wire bonds or adhesive-enabling 175 °C operation and high reliability. Its gate threshold voltage (1.45–2.15 V) and low 4.5 V RDS(on) (9–11 mΩ) ensure robust turn-on with standard logic drivers.

The device delivers superfast switching with low QG(tot) (12–27 nC), QGD (0.6–4.2 nC), and Crss (15–108 pF), minimizing switching losses and EMI. Its source-drain diode exhibits 22 ns trr and 15 nC Qr, supporting ZVS and resonant topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V maximum drain-source voltage - supports 36 V nominal bus systems with 10 % margin
RDS(on) @ VGS = 10 V 7.2–8.5 mΩ at 25 °C - enables <1 W conduction loss at 30 A in compact layouts
RDS(on) @ VGS = 4.5 V 9–11 mΩ at 25 °C - ensures full enhancement with 3.3 V or 5 V microcontroller GPIOs
QGD 0.6–4.2 nC - reduces Miller-induced shoot-through risk and improves hard-switching robustness
Rth(j-mb) 2.33–2.56 K/W - allows >50 W power dissipation with moderate heatsinking on PCB copper
trr / Qr 22 ns / 15 nC - minimizes reverse recovery loss in synchronous rectifiers and LLC secondaries
Avalanche energy EAS 46 mJ (unclamped, 80 µs) - withstands transient overvoltage without external snubbers

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount, clip-bonded, lead-frame package with an exposed copper mounting base electrically connected to the drain. It features no wire bonds or epoxy, enabling 175 °C operation, visual solder-joint inspection, and low parasitic inductance/resistance.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3 Source Three parallel source terminals reduce source inductance and improve current sharing in high-dI/dt paths
4 Gate Single gate input with low 0.3–2 Ω internal gate resistance - compatible with standard gate drivers
Mounting base Drain Exposed copper pad tied directly to drain - serves as primary thermal path and high-current drain connection

Key Features

Feature Design Value
NextPower-S3 Superjunction technology Enables simultaneous low RDS(on), low QG, and soft body-diode recovery for >1 MHz operation
100 % avalanche tested Guarantees single-pulse ruggedness up to 46 mJ without derating or external protection
Clip-bonded die + solder die attach Eliminates wire bonds and glue - improves thermal cycling reliability and power-cycle lifetime at 175 °C
Wave-solderable mounting base Enables automated assembly and provides direct thermal interface to heatsink or copper pour
Low Crss (15–108 pF) Reduces gate-drive power and dV/dt-induced false turn-on in half-bridge configurations

Applications

Secondary Side Synchronous Rectification High-Frequency DC–DC Converters

Use Scenario: Used as secondary-side switch in isolated 48 V–12 V buck-derived converters operating at 500 kHz–1 MHz.

IC Role / Device Role / Timing Role: Replaces Schottky diode to reduce forward voltage drop and conduction loss during synchronous rectification phase.

Use Value: Achieves >95 % efficiency at 40 A output by cutting conduction loss by 65 % versus 40 V/40 A Schottky diode.

Use Scenario: Integrated into multiphase VRMs for server CPUs and AI accelerators requiring fast transient response.

IC Role / Device Role / Timing Role: High-side or low-side power switch in interleaved buck stages with gate drive synchronized to PWM controller.

Use Value: Low QGD and fast tr/tf (<12 ns) enable clean switching edges and minimal dead-time loss at 1 MHz.

Brushless DC Motor Drive LED Constant-Current Drivers

Use Scenario: Low-side switch in 24 V BLDC inverter stages driving fans or pumps with 10–30 A peak phase current.

IC Role / Device Role / Timing Role: Commutation switch handling PWM-modulated motor phase current with body-diode freewheeling.

Use Value: Soft reverse recovery (22 ns trr) suppresses voltage spikes and EMI during commutation transitions.

Use Scenario: Primary-side switch in high-power LED drivers (e.g., street lighting) using buck or buck-boost topology.

IC Role / Device Role / Timing Role: Main power switch regulating constant current through LED strings up to 100 W.

Use Value: 175 °C rating and low RDS(on) sustain stable current regulation under ambient temperatures up to 85 °C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
Infineon IPP040N04L 40 V, 4.0 mΩ RDS(on) @ 10 V, but higher QG(tot) (32 nC) and no avalanche rating Better conduction loss at high current, but less suitable for high-frequency or unclamped inductive loads Prefer when thermal headroom exists and avalanche stress is absent; avoid in flyback or motor phase-legs
Vishay SiR872DP 40 V, 7.0 mΩ RDS(on) @ 10 V, 175 °C rated, but larger PowerPAK SO-8 package (higher Rth(j-a)) Similar performance envelope but requires more PCB area and offers inferior thermal resistance to board Select only if existing layout accommodates SO-8 footprint and mounting base cooling is impractical

Compared with IPP040N04L and SiR872DP, PSMN8R5-40MLDX uniquely combines 100 % avalanche testing, LFPAK33's 2.33 K/W Rth(j-mb), and sub-3 nC QGD-making it optimal for space-constrained, high-reliability, high-frequency synchronous rectifiers where thermal and switching integrity are critical.

Availability

PSMN8R5-40MLDX is available at Aetrix Electronics and suitable for secondary-side synchronous rectification, high-frequency DC–DC converters, and brushless DC motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for PSMN8R5-40MLDX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade MOSFETs, ESD protection, and logic ICs.

This device belongs to Nexperia's NextPower-S3 logic-level MOSFET product line, engineered specifically for high-efficiency, high-frequency power conversion in server, telecom, and industrial power supplies.

FAQ

What is the maximum continuous drain current for PSMN8R5-40MLDX at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current is 42 A per the datasheet Fig. 2. This reflects thermal derating due to reduced heat transfer from junction to board; actual current capability depends on PCB copper area, airflow, and heatsink integration.

Does PSMN8R5-40MLDX support 3.3 V logic-level gate drive?

Yes - with VGS(th) of 1.45–2.15 V and RDS(on) = 9–11 mΩ at VGS = 4.5 V, it fully enhances using 3.3 V microcontroller outputs when paired with appropriate gate driver buffering for slew rate control.

How is the mounting base electrically connected, and what is its role in circuit layout?

The mounting base is internally connected to the drain terminal. It must be routed to the drain net on the PCB and may serve as both the primary thermal path and high-current drain conductor - eliminating need for additional drain traces and reducing loop inductance.

Is PSMN8R5-40MLDX qualified for automotive applications?

No - this part is not AEC-Q101 qualified and is intended for industrial, computing, and consumer power applications. Nexperia explicitly states non-automotive qualification in the legal disclaimers; automotive use requires explicit AEC-qualified variants like PSMN8R5-40MLH.

PSMN8R5-40MLDX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1210, 8-LFPAK33 (5-Lead)
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
60A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
8.5mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
27 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1814 pF @ 20 V
FET Feature:
-
Power Dissipation (Max):
59W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK33

PSMN8R5-40MLDX FAQ

1.How can I place an order for PSMN8R5-40MLDX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMN8R5-40MLDX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMN8R5-40MLDX reliable?

The price and inventory of PSMN8R5-40MLDX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMN8R5-40MLDX is usually 5 days.

3.What payment methods are accepted for PSMN8R5-40MLDX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMN8R5-40MLDX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMN8R5-40MLDX?

PSMN8R5-40MLDX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMN8R5-40MLDX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMN8R5-40MLDX?

For technical support, including PSMN8R5-40MLDX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMN8R5-40MLDX requirements.

6.How does Aetrix verify that PSMN8R5-40MLDX is sourced from the original manufacturer or authorized distributors?

All PSMN8R5-40MLDX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMN8R5-40MLDX meets industry standards.

7.What is the process for return or replacement of PSMN8R5-40MLDX?

All PSMN8R5-40MLDX units undergo pre-shipment inspection (PSI). If there is an issue with PSMN8R5-40MLDX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMN8R5-40MLDX part is unused and in its original packaging.

Return procedure for PSMN8R5-40MLDX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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