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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. PSMNR56-25YLEX

Name: PSMNR56-25YLEX
Brand: Nexperia USA Inc.
SKU: PSMNR56-25YLEX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PSMNR56-25YLEX

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SOT-1023, 4-LFPAK

Datasheet:: PSMNR56-25YLEX.pdf

Description:: PSMNR56-25YLE/SOT1023/4 LEADS

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Product details

Overview

PSMNR56-25YLE from Nexperia is an N-channel enhancement-mode ASFET in LFPAK56E (SOT1023) package, optimized for hot-swap, e-fuse, and linear-mode operation with 25 V V_DS, 0.63 mΩ R_DS(on) @ V_GS=10 V / T_j=25 °C, 320 A continuous drain current capability, and enhanced SOA up to 175 °C junction temperature - deployed in 12 V–20 V server backplane power distribution.

For engineers reviewing the PSMNR56-25YLE datasheet, PSMNR56-25YLE pinout, PSMNR56-25YLE application, or PSMNR56-25YLE equivalent, this page delivers verified SOA performance data, LFPAK56E thermal resistance (R_th(j-mb) = 0.35 K/W), gate charge profile (Q_G(tot) = 54 nC typ), avalanche ruggedness (7.2 J), and source-drain diode softness factor (S = 0.92) critical for inrush control and fault-tolerant load switching design.

Technical Context

This device implements a copper-clip LFPAK56E construction enabling low parasitic inductance and <1 µA leakage at 25 °C, with gate threshold voltage V_GS(th) = 1.84 V (typ) and -4 mV/K temperature coefficient for stable turn-on across -55 °C to 175 °C operating range.

Its SOA is fully characterized for linear-mode operation: 320 A DC current validated at T_mb = 25 °C, with pulsed peak current of 2068 A (t_p ≤ 10 µs), and unclamped avalanche energy E_AS = 7.2 J under V_sup ≤ 25 V, ensuring robustness during hot-swap transients and short-circuit events.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	25 V maximum drain-source voltage - sets absolute upper limit for system bus voltage compatibility in 12 V–20 V hot-swap rails.
R_DS(on)	0.63 mΩ typical @ V_GS=10 V, T_j=25 °C - enables sub-10 mW conduction loss at 40 A, critical for high-efficiency e-fuse and load switch designs.
I_D (continuous)	320 A @ T_mb=25 °C - validated current rating limited by PCB thermal design, not die capability, supporting high-current board-level protection.
R_th(j-mb)	0.35 K/W typical - enables direct mounting-base thermal path for high-power dissipation (333 W max) without heatsink in compact layouts.
Q_G(tot)	54 nC typical @ V_DS=12 V, V_GS=4.5 V - determines gate driver strength requirement for <100 ns switching transitions in fast-acting DC switches.
E_AS	7.2 J non-repetitive avalanche energy - provides single-event fault tolerance during inductive load interruption or bus fault conditions.
S (softness)	0.92 typical - minimizes voltage overshoot and EMI during source-drain diode reverse recovery in bidirectional load-switch applications.

Pinout & Package

LFPAK56E (SOT1023) is a 4-lead, single-ended surface-mount package with copper-clip construction, 30 mm² footprint, 1.27 mm lead pitch, and integrated mounting base connected to drain - optimized for low-inductance, high-current PCB routing and thermal transfer via exposed drain pad.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel source terminals reduce bond-wire inductance and improve current sharing in high-di/dt hot-swap events.
4	Gate (G)	Single gate input with 3.6 Ω typical gate resistance - supports standard 5 V/12 V logic-level drive without external gate resistor for most e-fuse controllers.
Mounting Base	Drain (D)	Exposed copper drain pad soldered directly to PCB thermal plane - serves as primary heat extraction path and high-current drain connection.

Key Features

Feature	Design Value
Enhanced SOA for linear-mode operation	Validated 320 A DC current and 7.2 J avalanche energy enable reliable operation in constant-current limiting and inrush control without thermal runaway.
Low R_DS(on) + low leakage	0.63 mΩ R_DS(on) and <1 µA I_DSS at 25 °C minimize both conduction loss and standby power in always-on load switches and battery protection circuits.
LFPAK56E copper-clip construction	Reduces package inductance and resistance vs. wire-bond alternatives - improves switching speed consistency and reduces voltage spikes during fast turn-off.
175 °C qualified reliability	Qualified per industrial temperature grade with full characterization from -55 °C to 175 °C - supports deployment in high-ambient environments like telecom rectifiers and industrial PLCs.
Source-drain diode softness (S = 0.92)	Enables controlled reverse recovery with minimal oscillation in bidirectional configurations - essential for low-EMI battery backup switchover and OR-ing applications.

Applications

Hot Swap in Server Backplanes

e-Fuse for 12 V Power Rails

Use Scenario: Insertion of PCIe add-in cards or storage modules into live 12 V–20 V midplane backplanes without disrupting upstream power supply.

IC Role / Device Role / Timing Role: Main power FET controlling inrush current via linear-mode gate biasing during plug-in event; operates in active region for precise current limiting.

Use Value: Prevents bus voltage droop and supply overcurrent trip using validated 320 A SOA and 7.2 J avalanche margin - eliminates need for external current-sense amplifiers or complex control ICs.

Use Scenario: Overcurrent protection for distributed 12 V power domains in network switches, where fault response must be faster than fuse blow time and resettable.

IC Role / Device Role / Timing Role: Current-limiting switch controlled by external e-fuse controller (e.g., LTC4215); conducts normally, enters linear mode on overcurrent detection.

Use Value: Achieves <100 µs fault response with 0.63 mΩ R_DS(on) minimizing voltage drop and power loss during normal operation - extends system uptime vs. mechanical fuses.

DC Load Switch for Industrial PLCs

Battery Protection in UPS Systems

Use Scenario: Remote ON/OFF control of high-current 24 V DC loads (e.g., solenoids, motor drivers) in programmable logic controllers with built-in short-circuit protection.

IC Role / Device Role / Timing Role: High-side load switch with integrated current limiting and thermal shutdown; gate driven by microcontroller GPIO or dedicated load switch IC.

Use Value: Supports 320 A surge current handling and 175 °C junction rating - enables compact, fanless enclosure designs in harsh industrial environments without derating.

Use Scenario: Bidirectional power path management between AC/DC adapter and Li-ion battery bank in online UPS, requiring reverse current blocking and fault isolation.

IC Role / Device Role / Timing Role: Back-to-back configured N-channel FET pair (with second device) providing reverse polarity and short-circuit protection; leverages low Q_GD (15 nC typ) for fast turn-off.

Use Value: Soft-recovery source-drain diode (S = 0.92) suppresses voltage spikes during battery switchover - prevents false triggering of protection circuitry and improves system reliability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel hot-swap FET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Infineon BSC010N04LS6	40 V V_DS, 1.0 mΩ R_DS(on), TO-252 package, R_th(j-a) = 45 K/W - higher on-resistance and inferior thermal performance in high-current linear mode.	Limited to lower-current (<100 A) hot-swap due to SOA constraints; unsuitable for 320 A continuous or 7.2 J avalanche requirements.	Select only if 40 V rating is mandatory and thermal design allows larger heatsinking; not drop-in for PSMNR56-25YLE's LFPAK56E footprint or SOA profile.
Vishay SiR626DP	30 V V_DS, 0.72 mΩ R_DS(on), PowerPAK SO-8L, R_th(j-mb) = 0.55 K/W - 57% higher thermal resistance limits power dissipation in linear mode.	SOA validated only to 150 °C junction; lacks 175 °C qualification and 7.2 J avalanche rating - insufficient for mission-critical hot-swap in telecom infrastructure.	Acceptable for cost-sensitive 30 V systems with moderate thermal budgets; avoid where 175 °C operation or unclamped avalanche survival is required.

Compared with BSC010N04LS6 and SiR626DP, PSMNR56-25YLE delivers superior linear-mode robustness via its 0.35 K/W R_th(j-mb), 175 °C qualification, and 7.2 J E_AS, making it uniquely suited for high-reliability 25 V hot-swap and e-fuse applications where thermal headroom and fault energy absorption are design-critical.

Availability

PSMNR56-25YLE is available at Aetrix Electronics and suitable for hot-swap, e-fuse, and battery protection applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing for high-volume production.

Supply support for PSMNR56-25YLE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

This device belongs to Nexperia's ASFET (Advanced Special Function FET) product line, engineered specifically for high-current, high-reliability linear-mode applications including hot-swap, inrush limiting, and e-fuse - emphasizing SOA integrity, thermal robustness, and system-level fault resilience.

FAQ

What is the maximum continuous drain current rating for PSMNR56-25YLE?

The device is validated for 320 A continuous drain current at mounting base temperature (T_mb) = 25 °C, as confirmed in application testing per Figure 2 of the datasheet. Practical current is constrained by PCB copper area, thermal interface, and ambient conditions - not by intrinsic die limits. Derating is required above 25 °C T_mb, with 0% current at 100 °C T_mb.

Does PSMNR56-25YLE require a gate driver for e-fuse applications?

No external gate driver is required when used with standard e-fuse controllers (e.g., TI TPS25982, Analog Devices LTC4215) that provide ≥10 V gate drive and ≥1 A peak output. Its 3.6 Ω typical gate resistance and 54 nC total gate charge allow direct interfacing with these ICs; however, a 5 Ω series resistor is recommended to damp ringing during fast switching.

How is the mounting base (drain) electrically isolated from the PCB in layout?

The mounting base is the drain terminal and must be connected directly to the high-current drain net - no isolation is applied. For thermal management, it is soldered to a large copper pour (minimum 25.4 mm² per Figure 5) with thermal vias to inner layers. Electrical isolation is achieved solely by keeping the source and gate traces separate from the drain pour and using appropriate clearance distances per IPC-2221.

Can PSMNR56-25YLE be used in bidirectional current flow applications?

Yes - its source-drain diode has a softness factor S = 0.92 and reverse recovery time t_rr = 43 ns, enabling controlled commutation in OR-ing and battery switchover. However, bidirectional operation requires back-to-back configuration with a second identical FET to block reverse current; standalone use allows only forward conduction (source-to-drain) and reverse freewheeling (drain-to-source).

PSMNR56-25YLEX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: SOT-1023, 4-LFPAK

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 25 V

Current - Continuous Drain (Id) @ 25°C:: 320A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 7V, 10V

Rds On (Max) @ Id, Vgs:: 0.63mOhm @ 25A, 10V

Vgs(th) (Max) @ Id:: 2.2V @ 2mA

Gate Charge (Qg) (Max) @ Vgs:: 190 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 12137 pF @ 12 V

FET Feature:: -

Power Dissipation (Max):: 333W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK56, Power-SO8

PSMNR56-25YLEX FAQ

1.How can I place an order for PSMNR56-25YLEX through Aetrix?

Please submit a Request for Quotation (RFQ) for PSMNR56-25YLEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PSMNR56-25YLEX reliable?

The price and inventory of PSMNR56-25YLEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PSMNR56-25YLEX is usually 5 days.

3.What payment methods are accepted for PSMNR56-25YLEX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PSMNR56-25YLEX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PSMNR56-25YLEX?

PSMNR56-25YLEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PSMNR56-25YLEX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PSMNR56-25YLEX?

For technical support, including PSMNR56-25YLEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PSMNR56-25YLEX requirements.

6.How does Aetrix verify that PSMNR56-25YLEX is sourced from the original manufacturer or authorized distributors?

All PSMNR56-25YLEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PSMNR56-25YLEX meets industry standards.

7.What is the process for return or replacement of PSMNR56-25YLEX?

All PSMNR56-25YLEX units undergo pre-shipment inspection (PSI). If there is an issue with PSMNR56-25YLEX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PSMNR56-25YLEX part is unused and in its original packaging.

Return procedure for PSMNR56-25YLEX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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