My Inquiry
My Account
Renesas RBA300N10EANS-3UA02#GB0
- Part No.:
- RBA300N10EANS-3UA02#GB0
- Manufacturer:
- Renesas
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
RBA300N10EANS-3UA02#GB0.pdf
- Description:
- 100V-300A-N-CHANNEL MOSFET FOR H
- Quantity:
- Payment:
- Shipping:
Inventory:1,955
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
RBA300N10EANS-3UA02 from Renesas is an AEC-Q101 qualified 100 V, 340 A N-channel MOSFET using REXFET Split-Gate technology in TOLL package, delivering 1.5 mΩ max RDS(on) and 170 nC typical gate charge for high-efficiency motor drive and 48 V DC-DC conversion in electric vehicles and industrial robotics.
For engineers reviewing the RBA300N10EANS-3UA02 datasheet, RBA300N10EANS-3UA02 pinout, RBA300N10EANS-3UA02 application, or RBA300N10EANS-3UA02 equivalent, this device supports drop-in replacement in space-constrained automotive power stages requiring low conduction loss, high current capability, and optical inspection compatibility via wettable flanks.
Technical Context
The RBA300N10EANS-3UA02 implements Renesas' REXFET Split-Gate (Shielded Gate) architecture with narrow pitch design to reduce gate-drain capacitance (Cgd) and gate resistance (Rg), directly enabling faster switching and lower switching losses in hard-switched topologies.
It is rated for 100 V drain-source breakdown voltage and supports continuous drain current up to 340 A at Tc = 25 °C, with standard-level gate threshold (VGS(th) = 2–4 V) compatible with common 3.3 V/5 V logic drivers and automotive MCU outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - Withstands 100 V DC bus in 48 V systems with margin for transients and ringing |
| ID (continuous) | 340 A @ Tc = 25 °C - Enables high-power motor phase legs without parallel devices |
| RDS(on) (max) | 1.5 mΩ - Minimizes conduction loss below 1.5 W at 30 A RMS in typical 48 V traction inverter leg |
| Qg (typ) | 170 nC - Determines gate driver power requirement and switching speed trade-off |
| VGS(th) | 2–4 V - Ensures reliable turn-on with standard logic-level gate drivers |
| Package | TOLL - 3×3 mm footprint with wettable flank for automated optical inspection (AOI) |
| AEC-Q101 | Qualified - Validated for automotive use including temperature cycling, HTRB, and UHAST |
Pinout & Package
TOLL (Thin Outline Leadless) package: 8-pin, dual-side cooling capable, copper clip bonded, wettable flank on source terminals for solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6 | Source (S) | Low-inductance, paralleled internal connections for high-current return path and thermal spreading |
| 7 | Gate (G) | Control input with shielded-gate structure reducing Miller feedback and improving dV/dt immunity |
| 8 | Drain (D) | High-current output tied to exposed copper pad - primary heat transfer path to PCB thermal pad |
Key Features
| Feature | Design Value |
|---|---|
| Split-Gate (Shielded Gate) structure | Reduces Cgd by >50% vs conventional trench MOSFETs, lowering switching loss and EMI |
| Wettable flank on source pins | Enables 100% automated optical inspection (AOI) of solder joints without X-ray |
| Copper clip bonding | Improves current handling and thermal resistance (RθJC ≈ 0.25 °C/W) over wire-bonded alternatives |
| Standard pinout & footprint | Drop-in replacement for legacy D2PAK-7 devices with 60% smaller board area |
| AEC-Q101 qualification | Validated for automotive under-hood environments including -40 °C to +175 °C operation |
Applications
| Electric Power Steering (EPS) | 48 V On-Board Charger (OBC) DC-DC Stage |
|---|---|
Use Scenario: High-reliability, high-current H-bridge driving brushed or BLDC steering motors in passenger vehicles. IC Role / Device Role / Timing Role: Main power switch in low-side or high-side configuration, operating at 10–20 kHz PWM frequency. Use Value: 1.5 mΩ RDS(on) reduces conduction loss by >40% vs comparable 100 V SO8-FL parts, lowering heatsink requirements. | Use Scenario: Primary-side synchronous rectification or secondary-side high-current switch in isolated bidirectional DC-DC converters. IC Role / Device Role / Timing Role: Low-side switch in phase-shifted full-bridge topology, handling peak currents >250 A. Use Value: TOLL package's copper clip construction enables 340 A continuous current with <0.3 °C/W junction-to-case thermal resistance. |
| Industrial Robotic Joint Actuator | E-Bike Mid-Drive Motor Controller |
Use Scenario: Compact, high-torque servo drive for collaborative robot arms requiring rapid acceleration/deceleration. IC Role / Device Role / Timing Role: Half-bridge high- and low-side switch in 3-phase inverter, driven by isolated gate drivers. Use Value: 170 nC Qg allows efficient switching at 30 kHz while maintaining <1.2 W gate drive loss at 5 V drive. | Use Scenario: Torque-dense mid-drive controller supporting 250–1000 W continuous output in Class 1/3 e-bikes. IC Role / Device Role / Timing Role: Phase-leg switch in field-oriented control (FOC) inverter, operating at 16–25 kHz. Use Value: AEC-Q101 qualification ensures robustness against vibration, thermal cycling, and load dump events in mobile applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RBA300N10EHPF-5UA02 | Same VDSS, ID, RDS(on), Qg; TOLG package instead of TOLL | TOLG offers higher creepage distance and enhanced thermal performance for high-voltage isolation zones | Select when board layout requires greater clearance between drain and source or top-side cooling is prioritized |
| RBE015N10R1SZQ4 | Identical electrical specs; industrial-grade qualification (JEDEC JESD47) instead of AEC-Q101 | Not validated for automotive PPAP or temperature cycling per AEC spec; suitable for non-automotive industrial use | Choose for cost-sensitive industrial motor drives where automotive qualification is unnecessary |
Compared with RBA300N10EANS-3UA02, the TOLG variant improves creepage and thermal dissipation in constrained layouts, while the industrial RBE015N10R1SZQ4 provides identical performance at lower qualification cost-neither is pin-compatible due to differing package footprints (TOLL vs TOLG vs QFN).
Availability
RBA300N10EANS-3UA02 is available at Aetrix Electronics and suitable for electric power steering, 48 V OBC DC-DC conversion, and industrial robotic actuation requiring stable component supply across automotive production and industrial OEM programs.
Supply support for RBA300N10EANS-3UA02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted, high-reliability power solutions for automotive, industrial, and infrastructure markets.
The RBA300N10EANS-3UA02 belongs to the REXFET-1 family, engineered specifically for high-power-density motor control and 48 V power delivery systems where efficiency, ruggedness, and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum junction temperature rating for RBA300N10EANS-3UA02?
The RBA300N10EANS-3UA02 is rated for a maximum junction temperature (TJ) of 175 °C, validated under AEC-Q101 stress testing including high-temperature reverse bias (HTRB) and temperature cycling. This rating enables operation in under-hood automotive environments and high-ambient industrial enclosures when mounted on thermally optimized PCBs with adequate copper area.
Does RBA300N10EANS-3UA02 support gate drive with 3.3 V logic-level signals?
Yes, RBA300N10EANS-3UA02 has a standard-level gate threshold voltage (VGS(th)) of 2–4 V, allowing full enhancement with 3.3 V or 5 V gate drivers. However, for optimal RDS(on) and switching performance, Renesas recommends driving the RBA300N10EANS-3UA02 with ≥10 V gate voltage to ensure complete saturation and minimize conduction loss.
Is RBA300N10EANS-3UA02 pin-compatible with D2PAK-7 packaged MOSFETs?
No, RBA300N10EANS-3UA02 uses the TOLL package (8-pin, 3×3 mm), which is not pin-compatible with D2PAK-7. However, its standardized pinout and footprint allow drop-in replacement in new designs targeting 60% board area reduction - migration requires PCB layout revision but no circuit redesign due to identical electrical interface and gate drive requirements.
What thermal performance can be expected from RBA300N10EANS-3UA02 in a typical 4-layer PCB layout?
In a standard 4-layer PCB with 2 oz copper, 100 mm² thermal pad connected to inner ground planes, the RBA300N10EANS-3UA02 achieves approximately 1.2 °C/W junction-to-ambient thermal resistance. This enables 340 A continuous operation only at Tc = 25 °C; for sustained 200 A loads at 85 °C ambient, derating to ~150 A is recommended unless forced air or heatsinking is applied.
How does the Split-Gate technology in RBA300N10EANS-3UA02 improve EMI performance?
The Split-Gate (Shielded Gate) structure in RBA300N10EANS-3UA02 reduces gate-drain capacitance (Cgd) by over 50% versus conventional trench MOSFETs, suppressing Miller-induced voltage spikes and dV/dt coupling during switching transitions. This results in lower high-frequency ringing amplitude and reduced radiated emissions - particularly beneficial in EPS and OBC applications where EMI compliance (CISPR 25 Class 5) is critical.
RBA300N10EANS-3UA02#GB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
RBA300N10EANS-3UA02#GB0 FAQ
1.How can I place an order for RBA300N10EANS-3UA02#GB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for RBA300N10EANS-3UA02#GB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for RBA300N10EANS-3UA02#GB0 reliable?
The price and inventory of RBA300N10EANS-3UA02#GB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RBA300N10EANS-3UA02#GB0 is usually 5 days.
3.What payment methods are accepted for RBA300N10EANS-3UA02#GB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RBA300N10EANS-3UA02#GB0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for RBA300N10EANS-3UA02#GB0?
RBA300N10EANS-3UA02#GB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your RBA300N10EANS-3UA02#GB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for RBA300N10EANS-3UA02#GB0?
For technical support, including RBA300N10EANS-3UA02#GB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RBA300N10EANS-3UA02#GB0 requirements.
6.How does Aetrix verify that RBA300N10EANS-3UA02#GB0 is sourced from the original manufacturer or authorized distributors?
All RBA300N10EANS-3UA02#GB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RBA300N10EANS-3UA02#GB0 meets industry standards.
7.What is the process for return or replacement of RBA300N10EANS-3UA02#GB0?
All RBA300N10EANS-3UA02#GB0 units undergo pre-shipment inspection (PSI). If there is an issue with RBA300N10EANS-3UA02#GB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The RBA300N10EANS-3UA02#GB0 part is unused and in its original packaging.
Return procedure for RBA300N10EANS-3UA02#GB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
RBA300N10EANS-3UA02#GB0 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
