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STMicroelectronics SCT011HU75G3AG

Part No.:
SCT011HU75G3AG
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
-
Datasheet:
AetrixSCT011HU75G3AG.pdf
Description:
AUTOMOTIVE-GRADE SILICON CARBIDE
Quantity:
Payment:
Payment
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Inventory:50

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Product details

Overview

SCT011HU75G3AG from STMicroelectronics is an AEC-Q101-qualified silicon carbide (SiC) N-channel Power MOSFET designed for high-voltage, high-current traction and power conversion systems. It delivers 750 V drain-source breakdown voltage, 11.4 mΩ typical RDS(on) at 18 VGS, 110 A continuous drain current at TC = 25 °C, and features a robust intrinsic body diode with 22 ns reverse recovery time - enabling use in EV main inverters and on-board chargers.

For engineers reviewing the SCT011HU75G3AG datasheet, SCT011HU75G3AG pinout, SCT011HU75G3AG application, or SCT011HU75G3AG equivalent, key selection criteria include its HU3PAK package thermal resistance (RthJC = 0.23 °C/W), low gate charge (Qg = 154 nC), and stable RDS(on) over temperature - critical for high-frequency, high-efficiency SiC-based traction inverters.

Technical Context

This device implements ST's third-generation SiC MOSFET technology, optimized for automotive-grade reliability and high-speed switching in 400–800 V DC bus systems. Its gate threshold voltage (1.8–4.2 V) and ±100 nA gate leakage support robust drive margin under harsh conditions, while low Ciss (3860 pF) and Crss (31 pF) enable fast, low-loss transitions.

The integrated source-sensing pin (Pin 2) enables Kelvin-source connection to eliminate source inductance effects during high-di/dt operation. The device operates up to TJ = 175 °C and maintains <2× RDS(on) drift across -55 to 175 °C, supporting compact thermal design in space-constrained traction modules.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 750 V - Supports 800 V nominal DC-link systems with 15% margin for transients in EV traction inverters.
RDS(on) typ. 11.4 mΩ @ VGS = 18 V, ID = 80 A - Enables <1.5 W conduction loss at 110 A, reducing heatsink size.
ID cont. 110 A @ TC = 25 °C - Sustains full rated current without derating at moderate case temperatures.
Qg 154 nC - Low gate charge reduces driver power and enables >100 kHz switching with standard gate drivers.
tr/tf 11 ns / 9 ns - Fast edge rates minimize switching transition losses in hard-switched topologies.
VSD 2.6 V @ ISD = 50 A - Low forward drop of intrinsic body diode improves efficiency in bidirectional OBC and regenerative braking.
RthJC 0.23 °C/W - Enables direct mounting to cold plates with minimal thermal interface resistance for high-power density.

Pinout & Package

HU3PAK is a top-side cooled, 7-terminal surface-mount power package with exposed drain tab (Pin 1/TAB) for low-inductance, high-current routing and thermal path optimization. The package measures 11.8 mm × 14.0 mm × 3.5 mm (L × W × H) and supports tape-and-reel automated assembly.

Pin/Terminal Circuit Role Design Meaning
TAB (Drain) Power Drain Terminal Exposed copper pad - primary current path and thermal interface to heatsink/cold plate.
1 (Gate) Control Gate Input Standard gate drive input; requires negative turn-off bias (-5 V) for robust noise immunity.
2 (Driver Source) Kelvin Source Sense Provides dedicated low-noise return path for gate driver to eliminate source inductance impact on switching.
3–7 (Power Source) Main Source Current Return Parallel source terminals reduce current density and resistive loss; essential for 110 A continuous operation.

Key Features

Feature Design Value
AEC-Q101 qualification Validated for automotive powertrain applications including EV traction inverters and OBCs per stress test requirements.
Source sensing pin (Kelvin source) Enables accurate gate control under high di/dt, eliminating false turn-on due to source inductance-induced voltage spikes.
Low RDS(on) over full temperature range RDS(on) increases only ~1.5× from 25 °C to 175 °C - ensures predictable conduction loss and thermal stability.
Fast, robust intrinsic body diode 22 ns trr, 14 A IRRM, 186 nC Qrr - supports ZVS operation and reduces snubber losses in bidirectional converters.
High-speed switching capability 154 nC Qg, 31 pF Crss, and 23 ns td(on) enable efficient operation above 100 kHz in resonant and hard-switched topologies.

Applications

DC/DC Converter for EV/HEV Main Inverter (Electric Traction)

Use Scenario: High-efficiency 800 V to 400 V bi-directional DC/DC converter in 800 V architecture EVs.

IC Role / Device Role / Timing Role: Primary high-side SiC MOSFET switch operating at 100–200 kHz with synchronous rectification.

Use Value: 11.4 mΩ RDS(on) and 0.23 °C/W RthJC enable >98% peak efficiency and 30% smaller magnetics vs. Si-based solutions.

Use Scenario: Traction inverter phase-leg switch in battery electric vehicles with 400–800 V battery packs.

IC Role / Device Role / Timing Role: High-current, high-voltage switching element in 6-pack inverter module handling motor phase currents up to 110 A RMS.

Use Value: AEC-Q101 qualification and 175 °C junction rating ensure long-term reliability under repeated thermal cycling in under-hood environments.

On-Board Charger (OBC) Industrial Motor Drive

Use Scenario: AC/DC PFC stage and DC/DC isolation stage in 11 kW bi-directional OBC for V2G applications.

IC Role / Device Role / Timing Role: Boost switch in totem-pole PFC and active clamp switch in isolated LLC resonant converter.

Use Value: Low Qgd/Qgs ratio (38/53.5 nC) and fast tr/tf reduce switching loss and EMI generation during high-frequency operation.

Use Scenario: High-power servo drive for industrial automation requiring high dynamic response and thermal resilience.

IC Role / Device Role / Timing Role: Output stage switch in three-phase inverter delivering 100+ A output current with precise PWM timing control.

Use Value: Stable VGS(th) (1.8–4.2 V) and low gate leakage (±100 nA) ensure consistent turn-on behavior across wide ambient temperature ranges (-40 to 125 °C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
WOLFSPEED C3M0065070D 700 V VDS, 6.5 mΩ RDS(on), TO-247-4L package, no Kelvin source pin. Limited to 700 V systems; higher RDS(on) at elevated temperature; lacks dedicated driver source terminal. Preferred where lower conduction loss at 700 V is prioritized over automotive qualification and Kelvin-source precision.
ROHM SCT3022KL 650 V VDS, 22 mΩ RDS(on), TO-247N package, AEC-Q101 qualified, no Kelvin source. Lower voltage rating and higher on-resistance limit use to 400 V systems; no source sensing for high-di/dt control. Selected when cost sensitivity outweighs need for 750 V headroom and ultra-low RDS(on) in compact packages.

Compared with C3M0065070D and SCT3022KL, SCT011HU75G3AG uniquely combines 750 V rating, 11.4 mΩ on-resistance, AEC-Q101 compliance, and Kelvin-source capability - making it optimal for next-gen 800 V EV traction inverters demanding both performance and functional safety.

Availability

SCT011HU75G3AG is available at Aetrix Electronics and suitable for EV traction inverters, on-board chargers, and high-efficiency DC/DC converters requiring stable component supply, automotive-grade traceability, and long-lifecycle support.

Supply support for SCT011HU75G3AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with R&D and manufacturing operations across Europe, Asia, and the Americas.

This device belongs to ST's STPOWER SiC MOSFET product line, engineered specifically for high-efficiency, high-power-density automotive and industrial power conversion systems operating above 600 V.

FAQ

What is the maximum recommended gate-source voltage for reliable operation?

The absolute maximum VGS is -10 V to +22 V, but the recommended operating range is -5 V to +18 V. Operating within this window ensures robust noise immunity during turn-off (with -5 V gate drive) and avoids oxide stress during turn-on. Exceeding +18 V risks long-term gate oxide degradation, especially at elevated junction temperatures.

How does the Kelvin source pin (Pin 2) improve switching performance?

Pin 2 provides a dedicated low-inductance return path for the gate driver, decoupling gate loop current from high di/dt source current paths. This eliminates voltage spikes across source inductance that could cause unintended turn-on, enabling stable operation at >100 kHz with reduced gate drive complexity and lower EMI.

Can SCT011HU75G3AG replace silicon IGBTs in existing 750 V inverter designs?

Yes - with gate drive redesign. Its lower VGS(th) (1.8–4.2 V), faster switching, and absence of tail current allow direct substitution in many 750 V IGBT-based inverters. However, gate driver must support negative turn-off bias (-5 V), and layout must minimize gate loop inductance to exploit full SiC benefits.

What thermal interface material is recommended for the HU3PAK drain tab?

ST recommends thermally conductive, electrically insulating pastes or pads with thermal conductivity ≥3.0 W/m·K and bond line thickness ≤0.1 mm. For automotive applications, silicone-free, halogen-free materials meeting ISO/TS 16949 process controls are required to ensure long-term reliability under thermal cycling.

SCT011HU75G3AG Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
*
Package/Case:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
-
Technology:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
-
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
-
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

SCT011HU75G3AG FAQ

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Please submit a Request for Quotation (RFQ) for SCT011HU75G3AG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SCT011HU75G3AG reliable?

The price and inventory of SCT011HU75G3AG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SCT011HU75G3AG is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SCT011HU75G3AG?

For technical support, including SCT011HU75G3AG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SCT011HU75G3AG requirements.

6.How does Aetrix verify that SCT011HU75G3AG is sourced from the original manufacturer or authorized distributors?

All SCT011HU75G3AG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SCT011HU75G3AG meets industry standards.

7.What is the process for return or replacement of SCT011HU75G3AG?

All SCT011HU75G3AG units undergo pre-shipment inspection (PSI). If there is an issue with SCT011HU75G3AG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SCT011HU75G3AG part is unused and in its original packaging.

Return procedure for SCT011HU75G3AG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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