STMicroelectronics SCTWA35N65G2V-4
- Part No.:
- SCTWA35N65G2V-4
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-247-4
- Datasheet:
-
SCTWA35N65G2V-4.pdf
- Description:
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Product details
Overview
SCTWA35N65G2V-4 from STMicroelectronics is a silicon carbide (SiC) Power MOSFET rated for 650 V drain-source voltage, 67 mΩ maximum RDS(on) at 20 VGS, and 45 A continuous drain current at TC = 25 °C. It features a source-sensing pin for enhanced efficiency in high-frequency switching topologies and operates up to 200 °C junction temperature. It is deployed in high-efficiency 650 V PFC stages and LLC resonant converters.
For engineers reviewing the SCTWA35N65G2V-4 datasheet, SCTWA35N65G2V-4 pinout, SCTWA35N65G2V-4 application, or SCTWA35N65G2V-4 equivalent, key selection criteria include its 73 nC total gate charge, 18 ns reverse recovery time, 1370 pF input capacitance, low thermal resistance (0.72 °C/W), and HiP247-4 package with dedicated driver source terminal.
Technical Context
This SiC MOSFET uses ST's second-generation trench-gate technology to deliver stable RDS(on) across temperature - only 2× increase from 25 °C to 200 °C - and near-temperature-invariant switching loss. Its intrinsic body diode exhibits fast, soft reverse recovery (Qrr = 85 nC, trr = 18 ns) without requiring external anti-parallel diodes in bridge configurations.
The HiP247-4 package integrates four terminals: Drain (Tab), Gate (Pin 4), Driver Source (Pin 3), and Power Source (Pin 2), enabling Kelvin-source sensing to eliminate source inductance impact on gate drive loop stability and switching waveform fidelity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 650 V - Supports 400 V AC input PFC and 600 V DC bus systems with 20% margin. |
| RDS(on) max | 67 mΩ @ VGS = 20 V, ID = 20 A - Enables <1.3 W conduction loss at 45 A in hard-switched operation. |
| ID cont. | 45 A @ TC = 25 °C - Sustains full load in compact heatsink designs when paired with low-RthJC. |
| Qg | 73 nC - Requires ~1.5 W gate driver power at 100 kHz, compatible with standard SiC drivers (e.g., STGAP2S). |
| trr | 18 ns - Eliminates voltage spikes and shoot-through risk in synchronous rectification and half-bridge ZVS circuits. |
| TJ max | 200 °C - Allows derating-free operation in sealed industrial enclosures up to 90 °C ambient. |
| Ciss | 1370 pF - Reduces Miller-induced turn-on risk compared to first-gen SiC MOSFETs with similar RDS(on). |
Pinout & Package
Supplied in the HiP247-4 surface-mount-compatible through-hole package with isolated tab (Drain), optimized for high-current, high-thermal-demand applications. The 4-pin configuration separates driver and power return paths to suppress common-source inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main high-side current path | Electrically connected to metal tab; must be mounted to heatsink with insulated thermal interface. |
| Gate (Pin 4) | Control electrode | Receives gate drive signal; requires low-inductance routing due to high dV/dt capability (>50 V/ns). |
| Driver Source (Pin 3) | Kelvin source for gate loop | Provides dedicated low-noise reference for gate driver IC feedback, decoupling gate loop from power loop. |
| Power Source (Pin 2) | Main source return path | Carries full load current; connects to PCB ground plane or busbar with minimal impedance. |
Key Features
| Feature | Design Value |
|---|---|
| Source sensing pin | Enables Kelvin-source gate drive to maintain clean switching waveforms under >100 A/µs di/dt conditions. |
| Robust intrinsic body diode | Soft reverse recovery (trr = 18 ns, Qrr = 85 nC) allows reliable synchronous rectification without external diode. |
| Low capacitances | Ciss = 1370 pF, Coss = 125 pF - reduces capacitive losses and improves EMI profile in >100 kHz designs. |
| High TJ capability | Rated for continuous operation up to 200 °C junction temperature - enables smaller heatsinks and higher power density. |
| Temperature-stable RDS(on) | Only 1.3× increase from 25 °C to 175 °C - simplifies thermal design and improves system efficiency consistency. |
Applications
| Industrial Motor Drives | Server & Telecom PSU |
|---|---|
Use Scenario: 15–30 kW three-phase inverter stage using six-pack topology with active gate driving. IC Role / Device Role / Timing Role: High-side and low-side switching element in IGBT/SiC hybrid or full-SiC inverter leg. Use Value: 200 °C TJ rating permits operation in fanless enclosures; low Qg enables 50–100 kHz PWM without excessive gate loss. | Use Scenario: Primary-side switch in 3.3 kW server CRPS (Common Redundant Power Supply) with Totem-Pole PFC + LLC. IC Role / Device Role / Timing Role: Fast-switching PFC switch handling 12 A RMS input current at 65 kHz. Use Value: 18 ns trr eliminates need for snubbers; 67 mΩ RDS(on) achieves >98.5% PFC efficiency at full load. |
| Renewable Energy Inverters | EV Onboard Chargers |
Use Scenario: DC-AC stage of 10 kW solar string inverter operating at 80 kHz with unipolar modulation. IC Role / Device Role / Timing Role: High-voltage bridge arm switch with integrated body diode conducting freewheeling current. Use Value: Soft-recovery body diode prevents voltage overshoot during zero-crossing commutation; 0.72 °C/W RthJC supports forced-air cooling only. | Use Scenario: Secondary-side synchronous rectifier in 11 kW OBC LLC transformer output stage. IC Role / Device Role / Timing Role: Low-loss, high-speed rectifying switch replacing Schottky diodes in 400–800 V output rails. Use Value: 3.3 V VSD forward drop at 20 A yields lower conduction loss than 120 V Si Schottky at same current density. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3M0065065K (Wolfspeed) | 650 V, 65 mΩ typ., 44 A, TO-247-4L package; slightly lower Qg (62 nC) but higher Coss (145 pF) | Limited to ≤175 °C TJ; no dedicated driver source pin - requires external Kelvin layout | Preferred where gate drive simplicity outweighs need for ultra-low EMI; verify layout for source inductance. |
| IXFH40N65X2 (IXYS) | 650 V, 70 mΩ max., 40 A, TO-247-4L; higher RDS(on), lower trr (12 ns), but only 150 °C TJ rating | Not suitable for 200 °C ambient environments; lower peak current capability limits overload robustness | Cost-sensitive designs with moderate thermal constraints; avoid in sealed or high-ambient deployments. |
Compared with C3M0065065K and IXFH40N65X2, SCTWA35N65G2V-4 uniquely combines 200 °C operation, integrated Kelvin source, and balanced switching/conduction trade-offs - making it optimal for thermally constrained, high-reliability industrial and EV infrastructure applications.
Availability
SCTWA35N65G2V-4 is available at Aetrix Electronics and suitable for switching mode power supplies, DC-DC converters, and industrial motor control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from STMicroelectronics' qualified production line.
Supply support for SCTWA35N65G2V-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
This device belongs to ST's STPOWER SiC MOSFET product line, engineered specifically for high-efficiency, high-power-density power conversion systems operating above 100 kHz and demanding >99% efficiency at 650 V class.
FAQ
What is the purpose of the Driver Source (Pin 3) terminal?
The Driver Source (Pin 3) provides a dedicated Kelvin connection for the gate driver's source reference, isolating the high-current power source path (Pin 2) from the gate control loop. This eliminates voltage drop across source inductance during fast switching, preventing false turn-on and improving waveform fidelity - critical for stable operation above 50 kHz.
Can SCTWA35N65G2V-4 replace silicon IGBTs directly in existing designs?
No direct replacement is guaranteed. While it matches IGBT voltage/current ratings, its gate drive requirements differ: it needs −5 V to +20 V gate swing, lower gate charge (73 nC vs. typical IGBT >200 nC), and faster layout practices. Existing gate drivers must be validated for SiC compatibility, especially negative turn-off bias and dV/dt immunity.
What is the maximum recommended gate resistor value for hard-switched 65 kHz operation?
For hard-switched operation at 65 kHz with VDD = 400 V and ID = 20 A, ST recommends RG = 4.7 Ω (as tested in datasheet). Increasing beyond 6.8 Ω raises Eon/Eoff disproportionately; below 3.3 Ω risks gate oscillation due to layout parasitics - verified via double-pulse testing with 50 ns rise/fall times.
Does this device require a negative gate voltage for reliable turn-off?
Yes. The datasheet specifies VGS = −5 V as the recommended turn-off bias to ensure robust immunity against Miller-induced false turn-on during high dV/dt transitions. Operating with 0 V turn-off increases risk of spurious conduction in bridge configurations, especially above 100 V/ns slew rates observed in LLC and Totem-Pole PFC topologies.
SCTWA35N65G2V-4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-247-4
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 45A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 18V, 20V
- Rds On (Max) @ Id, Vgs:
- 67mOhm @ 20A, 20V
- Vgs(th) (Max) @ Id:
- 5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 73 nC @ 20 V
- Vgs (Max):
- +18V, -5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1370 pF @ 400 V
- FET Feature:
- -
- Power Dissipation (Max):
- 240W (Tc)
- Operating Temperature:
- -55°C ~ 200°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247-4
SCTWA35N65G2V-4 FAQ
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7.What is the process for return or replacement of SCTWA35N65G2V-4?
All SCTWA35N65G2V-4 units undergo pre-shipment inspection (PSI). If there is an issue with SCTWA35N65G2V-4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SCTWA35N65G2V-4 part is unused and in its original packaging.
Return procedure for SCTWA35N65G2V-4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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