STMicroelectronics SCTWA40N120G2V
- Part No.:
- SCTWA40N120G2V
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
SCTWA40N120G2V.pdf
- Description:
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Product details
Overview
SCTWA40N120G2V from STMicroelectronics is a silicon carbide (SiC) Power MOSFET rated for 1200 V drain-source voltage, 100 mΩ maximum RDS(on) at 20 A/18 V, and 36 A continuous drain current at TC = 25 °C. It features an ultra-fast intrinsic body diode (trr = 15 ns), low gate charge (Qg = 61 nC), and operation up to 200 °C junction temperature - enabling high-efficiency, high-frequency switching in high-voltage power conversion stages.
For engineers reviewing the SCTWA40N120G2V datasheet, SCTWA40N120G2V pinout, SCTWA40N120G2V application, or SCTWA40N120G2V equivalent, key selection criteria include its 1200 V blocking capability, SiC-specific thermal stability (RDS(on) variation <2.2× from −75 °C to 175 °C), low Ciss/Coss ratio (1233 pF / 56 pF), and robust SOA up to 108 A pulsed current.
Technical Context
This 2nd-generation ST SiC MOSFET uses trench-gate planar architecture optimized for minimal switching loss temperature dependence - Eon and Eoff vary less than ±15% across TJ = 25–200 °C. Its gate threshold voltage (1.9–4.9 V) and negative VGS rating (−10 V) support robust gate drive design with standard isolated drivers.
The device integrates a monolithic SiC Schottky-like body diode with low VSD (3.3 V @ 20 A) and negligible reverse recovery charge (Qrr = 77 nC), eliminating external anti-parallel diodes in hard-switched topologies. Thermal resistance RthJC = 0.63 °C/W enables high-power density designs when mounted on copper baseplates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 1200 V - supports 1000 V DC bus systems with 20% safety margin for industrial and traction inverters. |
| RDS(on) max | 100 mΩ @ 20 A, 18 V, 25 °C - delivers <1.2 W conduction loss at 36 A, enabling >99% efficiency in 10 kW+ converters. |
| ID cont. | 36 A @ TC = 25 °C - derates to 27 A at TC = 100 °C, supporting sustained high-current operation with active cooling. |
| Qg | 61 nC - reduces gate driver power demand and enables fast turn-on/off with low RG (e.g., 4.7 Ω yields td(on) = 13.4 ns). |
| trr | 15 ns - eliminates reverse recovery spikes and associated EMI in phase-shifted full-bridge and LLC resonant converters. |
| TJ max | 200 °C - allows compact heatsink design and extended lifetime under transient overload conditions without thermal shutdown. |
| Eoff | 48 µJ @ 800 V, 20 A - contributes to <100 µJ total switching energy, enabling >200 kHz operation with minimal loss penalty. |
Pinout & Package
Supplied in HiP247 long leads package (TO-247 variant with extended leads for improved creepage and thermal relief). Package outline complies with ECOPACK2 environmental standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Drain) | Main high-side power terminal | Connected to tab (exposed metal base); electrically tied to source of internal body diode - requires insulated mounting or direct heatsink connection. |
| G (Gate) | Control input | Low-impedance MOS gate (RG = 1 Ω typ.) requiring −5 V to +18 V drive; sensitive to dV/dt-induced false turn-on. |
| S (Source) | Reference node for gate drive and current sensing | Common return path for load current and gate loop; must be routed with low inductance to minimize switching oscillation. |
Key Features
| Feature | Design Value |
|---|---|
| Very fast intrinsic body diode | trr = 15 ns, Qrr = 77 nC - enables zero-voltage switching (ZVS) in half-bridge configurations without external diode. |
| Extremely low gate charge | Qg = 61 nC, Qgd/Qgs = 1.92 - improves Miller immunity and reduces gate driver stress during high-dV/dt transitions. |
| High-temperature operation | TJ = 200 °C rated, RDS(on) normalized drift <2.2× over −75 to +175 °C - ensures stable performance in oil-cooled or enclosed environments. |
| Low output capacitance | Coss = 56 pF @ 800 V - minimizes capacitive turn-off loss and improves light-load efficiency in resonant topologies. |
Applications
| Industrial Motor Drives | High-Voltage DC-DC Converters |
|---|---|
|
Use Scenario: 3-phase inverter stage in 15–50 kW servo drives operating at 400–800 V DC bus. IC Role / Device Role / Timing Role: High-side switching element in IGBT/SiC hybrid or all-SiC six-pack module configuration. Use Value: Enables 200 kHz PWM with <0.5% conduction loss increase at 150 °C case temperature, reducing heatsink mass by 35% vs. 1st-gen SiC. |
Use Scenario: Primary-side switch in isolated bidirectional DC-DC for EV charging stations (1000 V input, 400–800 V output). IC Role / Device Role / Timing Role: Hard-switched primary FET in dual-active-bridge (DAB) topology with synchronous rectification. Use Value: Delivers 98.2% peak efficiency at 25 kW due to low Eoff (48 µJ) and stable RDS(on) across temperature. |
| Photovoltaic String Inverters | Switched-Mode Power Supplies |
|
Use Scenario: DC optimizer and microinverter stage handling 1500 V PV string inputs with rapid MPPT transients. IC Role / Device Role / Timing Role: Boost switch in interleaved two-phase topology with 100–150 kHz switching frequency. Use Value: Maintains <1.8% efficiency drop from 25 °C to 100 °C ambient due to flat Eon/Eoff vs. TJ curve. |
Use Scenario: Primary switch in telecom rectifier (−48 V output, 380 V DC input) with strict 150 W/in³ power density target. IC Role / Device Role / Timing Role: High-frequency ZVS-assisted forward converter switch operating at 300 kHz. Use Value: Achieves 95.7% efficiency at full load with 0.63 °C/W RthJC, allowing direct baseplate mounting without thermal interface material. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3M0065120K (Wolfspeed) | 1200 V, 65 mΩ typ., 42 A - lower RDS(on) but higher Qg (82 nC) and larger Ciss (1520 pF). | Better conduction loss at high current; less suitable for >250 kHz due to higher gate drive loss and slower switching. | Select when system prioritizes conduction efficiency over switching frequency and gate drive simplicity. |
| IXFH40N120X2 (IXYS) | 1200 V, 110 mΩ max., 40 A - higher RDS(on), no specified trr or Qrr; rated only to 175 °C TJ. | Limited high-frequency capability; requires external anti-parallel diode and more conservative thermal design. | Select when cost sensitivity outweighs efficiency targets and thermal margin is abundant. |
Compared with C3M0065120K and IXFH40N120X2, SCTWA40N120G2V offers optimal balance of switching speed (15 ns trr, 61 nC Qg) and thermal resilience (200 °C), making it preferred for compact, high-frequency, high-reliability industrial power stages where gate drive complexity and thermal management are constrained.
Availability
SCTWA40N120G2V is available at Aetrix Electronics and suitable for industrial motor control, high-voltage DC-DC converters, and photovoltaic string inverters requiring stable component supply and long-term production continuity.
Supply support for SCTWA40N120G2V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, automotive ICs, and wide-bandgap devices with vertical manufacturing capabilities.
This device belongs to ST's second-generation SiC Power MOSFET product line, engineered specifically for high-efficiency, high-reliability 1200 V power conversion in industrial, renewable energy, and EV infrastructure applications.
FAQ
What gate drive voltage range is recommended for reliable operation?
The SCTWA40N120G2V specifies a recommended operational gate-source voltage range of −5 V to +18 V. A minimum −5 V turn-off bias prevents spurious conduction during high dV/dt events, while +18 V ensures full enhancement and lowest RDS(on). Exceeding +18 V risks gate oxide degradation; staying within this window guarantees stable threshold voltage (1.9–4.9 V) and long-term reliability per DS13752 Rev 2.
How does the body diode performance compare to discrete SiC Schottky diodes?
The integrated SiC body diode achieves VSD = 3.3 V at 20 A and trr = 15 ns - matching typical 3.2–3.5 V / 12–18 ns discrete 1200 V SiC Schottkys. Unlike silicon diodes, it exhibits no reverse recovery tail, eliminating snubber requirements. However, its forward voltage is ~0.3 V higher than optimized discrete Schottkys, making it ideal for synchronous rectification but less optimal as a freewheeling diode in ultra-low-loss designs.
Can this MOSFET replace a 1200 V IGBT in existing designs?
Yes - with gate drive and layout adaptations. The SCTWA40N120G2V supports identical 1200 V blocking and higher peak current (108 A pulsed vs. typical 60–80 A for IGBTs), but requires faster gate drivers (due to 61 nC Qg vs. IGBT Qg > 200 nC) and stricter layout for dV/dt immunity. Its zero-current turn-off eliminates tail current loss, improving efficiency by 2–4% in 10–20 kHz motor drives.
What is the safe operating area (SOA) limitation at 100 °C case temperature?
At TC = 100 °C, the SOA is limited by RDS(on) to ~27 A continuous (per datasheet Table 1), with single-pulse capability up to 108 A for tp ≤ 1 µs. For tp = 100 µs, maximum VDS drops to ~600 V at 27 A. Derating curves in Figure 1 confirm linear power limit down to 150 W at TC = 100 °C, consistent with RthJC = 0.63 °C/W and TJ = 200 °C max.
SCTWA40N120G2V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 1200 V
- Current - Continuous Drain (Id) @ 25°C:
- 36A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 18V
- Rds On (Max) @ Id, Vgs:
- 100mOhm @ 20A, 18V
- Vgs(th) (Max) @ Id:
- 4.9V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 61 nC @ 18 V
- Vgs (Max):
- +18V, -5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1233 pF @ 800 V
- FET Feature:
- -
- Power Dissipation (Max):
- 278W (Tc)
- Operating Temperature:
- -55°C ~ 200°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247 Long Leads
SCTWA40N120G2V FAQ
1.How can I place an order for SCTWA40N120G2V through Aetrix?
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6.How does Aetrix verify that SCTWA40N120G2V is sourced from the original manufacturer or authorized distributors?
All SCTWA40N120G2V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SCTWA40N120G2V meets industry standards.
7.What is the process for return or replacement of SCTWA40N120G2V?
All SCTWA40N120G2V units undergo pre-shipment inspection (PSI). If there is an issue with SCTWA40N120G2V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SCTWA40N120G2V part is unused and in its original packaging.
Return procedure for SCTWA40N120G2V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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