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Vishay Siliconix SI1300BDL-T1-GE3

Part No.:
SI1300BDL-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
SC-70, SOT-323
Datasheet:
AetrixSI1300BDL-T1-GE3.pdf
Description:
MOSFET N-CH 20V 400MA SC70-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,140

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Product details

Overview

SI1300BDL-T1-GE3 from Vishay Siliconix is an N-channel 20 V TrenchFET® power MOSFET in SC-70 package, rated for 0.4 A continuous drain current at TC = 25 °C, with RDS(on) = 0.85 Ω at VGS = 4.5 V and 0.335 nC total gate charge. It serves as a low-side load switch in space-constrained portable electronics.

For engineers reviewing the SI1300BDL-T1-GE3 datasheet, SI1300BDL-T1-GE3 pinout, SI1300BDL-T1-GE3 application, or SI1300BDL-T1-GE3 equivalent, key selection criteria include its halogen-free and RoHS-compliant construction, low gate charge for fast switching in battery-powered systems, and thermal resistance profile suitable for FR4 PCB mounting without heatsinking.

Technical Context

This MOSFET uses trench-based silicon architecture to achieve low on-resistance and fast switching performance in a 3-pin surface-mount package. Its gate threshold voltage (0.4–1.0 V) enables direct drive from 1.8 V and 2.5 V logic, while the 0.335 nC Qg at VGS = 2.5 V supports efficient operation in high-frequency PWM control.

The device features 100 % Rg tested units and integrates a body diode with VSD = 0.7–1.2 V at IS = 0.05 A. Absolute maximum ratings include ±8 V gate-source voltage and -55 to +150 °C operating junction temperature, supporting industrial and extended-temperature portable designs.

Key Specifications

ParameterValue and Actual Design Meaning
VDS20 V - Maximum drain-source blocking voltage for low-voltage DC/DC and load-switch applications
RDS(on)0.85 Ω at VGS = 4.5 V - Enables <100 mW conduction loss at 0.4 A, suitable for compact battery management
ID (cont.)0.4 A at TC = 25 °C - Continuous current rating for thermally limited SC-70 footprint
Qg0.335 nC at VGS = 2.5 V - Low gate charge minimizes driver power and switching losses in 1–5 MHz PWM
PD0.19 W at TA = 25 °C - Power dissipation limit on standard FR4 board, defining thermal derating envelope
RthJA670 °C/W max - High junction-to-ambient resistance confirms need for layout-aware thermal design

Pinout & Package

SC-70 (3-lead) surface-mount package with exposed drain pad for thermal conduction. Pin 1 = Gate, Pin 2 = Source, Pin 3 = Drain (top view).

Pin/TerminalCircuit RoleDesign Meaning
GGateControl terminal accepting 0.4–1.0 V threshold logic; requires <12 Ω series gate resistor for EMI control
SSourceReference node for gate drive and current return path; tied to system ground in low-side configuration
DDrainHigh-side connection to load; electrically and thermally coupled to package backside for heat sinking

Key Features

FeatureDesign Value
TrenchFET® technologyEnables sub-1 Ω RDS(on) in SC-70, reducing conduction loss vs. planar MOSFETs of same size
Halogen-free constructionMeets IEC 61249-2-21, eliminating brominated flame retardants for safer end-of-life processing
100 % Rg testedGuarantees gate resistance between 1.5–12 Ω, ensuring consistent turn-on timing across production lots
RoHS complianceFully compliant with Directive 2002/95/EC, enabling use in EU consumer and industrial markets

Applications

Battery Protection CircuitUSB Port Power Switch

Use Scenario: Isolates Li-ion cell during overvoltage or overtemperature fault conditions in single-cell packs.

IC Role / Device Role / Timing Role: Low-side protection switch controlled by battery management IC; operates in static on/off mode with <1 µs response.

Use Value: 0.85 Ω RDS(on) limits voltage drop to <340 mV at 0.4 A, preserving pack efficiency and runtime.

Use Scenario: Enables/disables 5 V power delivery to downstream USB peripherals in portable hubs and dongles.

IC Role / Device Role / Timing Role: Load switch driven by microcontroller GPIO; toggled at <1 Hz during plug/unplug detection.

Use Value: 0.335 nC Qg allows full turn-on with <1 mA peak gate current from 3.3 V MCU, avoiding external driver.

LED Backlight DimmingIoT Sensor Node Power Gating

Use Scenario: PWM-controlled current sink for white LED strings in compact displays.

IC Role / Device Role / Timing Role: Synchronous low-side switch in constant-current LED driver; switched at 1–5 kHz.

Use Value: Fast 7–12 ns turn-on delay and 10–15 ns rise time support clean PWM edges without overshoot.

Use Scenario: Powers down non-critical sensors (e.g., humidity, ambient light) between wake cycles in battery-operated nodes.

IC Role / Device Role / Timing Role: Standby power switch controlled by ultra-low-power MCU; activated every 10–60 s.

Use Value: 100 nA IDSS at 20 V ensures <2 nW leakage per switch, extending multi-year battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2004LK-7RDS(on) = 0.65 Ω at VGS = 4.5 V; higher ID = 0.55 A; SOT-23 packageHigher current capacity suits 500 mA loads but requires larger PCB areaSelect when >0.4 A continuous current or lower on-resistance is required, accepting SOT-23 footprint
AO3400RDS(on) = 0.042 Ω at VGS = 10 V; not specified at 2.5 V; SOT-23 packageRequires ≥4.5 V gate drive; unsuitable for 1.8 V/2.5 V logic interfacesChoose only if system provides ≥4.5 V gate voltage and needs sub-50 mΩ RDS(on)

Compared with DMN2004LK-7 and AO3400, SI1300BDL-T1-GE3 uniquely balances ultra-low gate charge (0.335 nC), 2.5 V logic compatibility, and halogen-free compliance in SC-70-making it optimal for miniaturized, low-power, and environmentally regulated designs where gate drive voltage and footprint are constrained.

Availability

SI1300BDL-T1-GE3 is available at Aetrix Electronics and suitable for battery protection circuits, USB power switches, LED backlight dimming, and IoT sensor node power gating requiring stable component supply and long-term lifecycle assurance.

Supply support for SI1300BDL-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, optoelectronics, and passive components with emphasis on reliability and power efficiency.

The Si1300BDL product line delivers ultra-small-signal N-channel MOSFETs optimized for space-constrained, low-voltage, low-power switching in portable and wearable electronics.

FAQ

What is the maximum gate-source voltage rating for SI1300BDL-T1-GE3?

The SI1300BDL-T1-GE3 has a maximum gate-source voltage rating of ±8 V, as specified in its absolute maximum ratings table. Exceeding this voltage risks permanent gate oxide damage. This rating supports compatibility with 3.3 V, 2.5 V, and 1.8 V logic families when using appropriate gate drive limiting resistors or clamping circuits. The SI1300BDL-T1-GE3 must never be subjected to transient spikes beyond ±8 V, even briefly.

Does SI1300BDL-T1-GE3 support direct drive from a 1.8 V microcontroller GPIO?

Yes, SI1300BDL-T1-GE3 supports direct drive from a 1.8 V microcontroller GPIO due to its guaranteed gate threshold voltage range of 0.4–1.0 V at ID = 250 µA. At VGS = 1.8 V, the device achieves sufficient enhancement for low-current switching, though RDS(on) increases to ~1.3 Ω. For robust 0.4 A operation, VGS ≥ 2.5 V is recommended. The SI1300BDL-T1-GE3 datasheet confirms functionality down to 2.5 V, with characterization data provided at that level.

What is the thermal resistance from junction to ambient for SI1300BDL-T1-GE3 on a standard PCB?

The maximum junction-to-ambient thermal resistance (RthJA) for SI1300BDL-T1-GE3 is 670 °C/W when mounted on a 1" × 1" FR4 board, per the datasheet's thermal resistance ratings table. This value reflects worst-case convection-only cooling and confirms the device's suitability for low-duty-cycle or intermittent operation. The SI1300BDL-T1-GE3 achieves this rating without copper pour or thermal vias, but adding them reduces effective RthJA significantly.

Is SI1300BDL-T1-GE3 suitable for reverse polarity protection?

No, SI1300BDL-T1-GE3 is not suitable for reverse polarity protection because it is an N-channel MOSFET intended for low-side switching. In that configuration, its body diode conducts during reverse input, causing failure. Reverse polarity protection requires a P-channel device in high-side configuration or an N-channel with external gate charge pump. The SI1300BDL-T1-GE3 datasheet does not specify body diode forward voltage under reverse bias stress, confirming its unsuitability for this topology.

What marking code appears on the top of the SI1300BDL-T1-GE3 package?

The SI1300BDL-T1-GE3 is marked with "KE" followed by two alphanumeric characters (e.g., KEAB) representing lot traceability and date code, as shown in the package outline diagram on page 1 of the Vishay datasheet (Document Number: 73557). The "KE" prefix is unique to the Si1300BDL family and distinguishes it from other SC-70 MOSFETs. No additional part number or manufacturer logo is printed on the device surface.

SI1300BDL-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
SC-70, SOT-323
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
400mA (Tc)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
850mOhm @ 250mA, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.84 nC @ 4.5 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
35 pF @ 10 V
FET Feature:
-
Power Dissipation (Max):
190mW (Ta), 200mW (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SC-70-3

SI1300BDL-T1-GE3 FAQ

1.How can I place an order for SI1300BDL-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI1300BDL-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI1300BDL-T1-GE3 reliable?

The price and inventory of SI1300BDL-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI1300BDL-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SI1300BDL-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI1300BDL-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI1300BDL-T1-GE3?

SI1300BDL-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI1300BDL-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI1300BDL-T1-GE3?

For technical support, including SI1300BDL-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI1300BDL-T1-GE3 requirements.

6.How does Aetrix verify that SI1300BDL-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SI1300BDL-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI1300BDL-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SI1300BDL-T1-GE3?

All SI1300BDL-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI1300BDL-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI1300BDL-T1-GE3 part is unused and in its original packaging.

Return procedure for SI1300BDL-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SI1300BDL-T1-GE3 Tags

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