Vishay Siliconix SI2337DS-T1-GE3
- Part No.:
- SI2337DS-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
SI2337DS-T1-GE3.pdf
- Description:
- MOSFET P-CH 80V 2.2A SOT23-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,261
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI2337DS-T1-GE3 from Vishay Siliconix is a P-channel enhancement-mode MOSFET in SOT-23 package, rated for -80 V drain-source voltage, 0.270 Ω RDS(on) at VGS = -10 V, and -2.2 A continuous drain current at TC = 25 °C. It serves as a high-side load switch or reverse-polarity protection device in compact DC power rails.
For engineers reviewing the SI2337DS-T1-GE3 datasheet, SI2337DS-T1-GE3 pinout, SI2337DS-T1-GE3 application, or SI2337DS-T1-GE3 equivalent, key selection criteria include verified -80 V blocking capability, gate threshold voltage range (-2 to -4 V), thermal resistance (RthJA ≤ 166 °C/W), body diode forward voltage (-0.8 to -1.2 V), and total gate charge (7–17 nC at VGS = -6 V to -10 V).
Technical Context
This device uses Vishay's TrenchFET® process to achieve low on-resistance and fast switching with controlled Qg and Ciss (500 pF typical). Its negative VGS(th) enables simple gate drive from logic-level sources in high-side configurations where source is tied to positive rail.
The integrated body diode supports synchronous rectification or freewheeling in buck converters and reverse-current blocking in battery-powered systems. Avalanche-rated (EAS = 6 mJ) and qualified for operation from -55 °C to +150 °C, it meets industrial reliability requirements without derating below 125 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -80 V - Supports input rails up to 80 V with margin for transients in industrial power supplies. |
| RDS(on) max @ VGS = -10 V | 0.270 Ω - Limits conduction loss to <0.73 W at -1.2 A, enabling thermally constrained PCB layouts. |
| ID continuous @ TC = 25 °C | -2.2 A - Sustains full-load current in compact SOT-23 without external heatsink under case-cooled conditions. |
| Qg typ. @ VGS = -6 V | 7 nC - Enables efficient 100 kHz–500 kHz switching with <1 Ω gate driver impedance. |
| VGS(th) | -2 to -4 V - Ensures reliable turn-on with standard 3.3 V or 5 V microcontroller GPIOs in high-side configuration. |
| RthJA max | 166 °C/W - Defines worst-case thermal rise on 1" × 1" FR4 board; requires layout attention for >0.5 W dissipation. |
| VSD @ IS = 0.63 A | -0.8 to -1.2 V - Determines forward drop in reverse-battery protection or freewheeling paths. |
Pinout & Package
SOT-23 (TO-236) surface-mount package, 3-pin, lead (Pb)-free and halogen-free per JEDEC J-STD-020. Dimensions: 2.80–3.04 mm × 2.10–2.64 mm × 0.89–1.12 mm height. Seating plane defined per Vishay drawing 71196.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Controls channel conduction; requires negative bias relative to source to turn on; sensitive to ESD (±20 V absolute max). |
| 2 (S) | Source | Reference node for gate drive; connected to positive rail in high-side switch; carries full load current and body diode return path. |
| 3 (D) | Drain | Switched output node; connects to load or ground; handles avalanche energy during inductive turn-off. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® technology | Delivers 0.216 Ω typical RDS(on) in SOT-23, reducing conduction loss vs. planar MOSFETs of same size. |
| Avalanche-rated (EAS = 6 mJ) | Withstands single-pulse inductive energy without failure-critical for relay/snubberless solenoid drivers. |
| Low Qgd/Qg ratio (≈29 %) | Minimizes Miller effect, improving noise immunity and enabling stable switching with moderate gate resistors. |
| Specified RDS(on) at VGS = -6 V | Guarantees performance with 3.3 V logic-level drive, eliminating need for level-shifting in many embedded systems. |
| Body diode trr = 30–45 ns | Enables use in synchronous rectifier topologies up to ~500 kHz without excessive switching loss. |
Applications
| Battery Reverse-Polarity Protection | High-Side Load Switch |
|---|---|
Use Scenario: Prevents damage when Li-ion or lead-acid battery is inserted backward into portable medical or test equipment. IC Role / Device Role / Timing Role: P-channel MOSFET configured as ideal diode replacement with near-zero forward drop. Use Value: Eliminates 0.3–0.7 V diode drop, preserving 3–5 % system runtime and reducing heat generation in sealed enclosures. | Use Scenario: Enables/disables 12 V or 24 V subsystems (e.g., sensors, actuators) under MCU control in automotive body electronics. IC Role / Device Role / Timing Role: High-side power switch with logic-compatible gate drive and fast turn-on/turn-off (<30 ns). Use Value: Provides clean power sequencing, prevents backfeed between domains, and supports hot-swap compliance. |
| DC-DC Converter Synchronous Rectifier | Industrial Sensor Power Management |
Use Scenario: Replaces Schottky diode in non-isolated buck converter for 5 V or 3.3 V output in PLC I/O modules. IC Role / Device Role / Timing Role: Low-side synchronous rectifier operating in continuous conduction mode with 100–300 kHz PWM. Use Value: Reduces rectifier loss by >40 % vs. 0.5 V Schottky, improving efficiency from 88 % to ≥91 % at 1 A load. | Use Scenario: Powers isolated analog sensor front-ends (e.g., 4–20 mA transmitters) requiring low quiescent current and transient robustness. IC Role / Device Role / Timing Role: Input protection and enable switch with -80 V rating and <1 μA IDSS leakage. Use Value: Blocks line surges up to ±60 V while adding <0.1 % gain error via RDS(on) drift over temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2053LW-7 | RDS(on) = 0.22 Ω @ -4.5 V; lower VDS (-20 V); SOT-23 package. | Not suitable for >20 V rails; better for 3.3 V logic-driven low-voltage loads. | Select when supply voltage ≤5 V and gate drive is limited to 3.3 V. |
| IRLML6344TRPBF | RDS(on) = 0.13 Ω @ -4.5 V; VDS = -20 V; higher ID (-4.3 A); same SOT-23. | Lacks -80 V rating; unsuitable for 24 V+ industrial inputs or surge-prone environments. | Choose only for cost-sensitive, low-voltage consumer applications where 20 V rating suffices. |
Compared with DMN2053LW-7 and IRLML6344TRPBF, SI2337DS-T1-GE3 uniquely balances -80 V ruggedness, logic-level compatibility down to -6 V, and SOT-23 footprint-making it the only option among the three qualified for 24 V–48 V industrial power switching with minimal gate drive overhead.
Availability
SI2337DS-T1-GE3 is available at Aetrix Electronics and suitable for battery management systems, industrial sensor interfaces, DC-DC converter synchronous rectification, and high-side load switching requiring stable component supply across extended temperature ranges.
Supply support for SI2337DS-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, optoelectronics, and passive components with emphasis on power efficiency and reliability.
The Si2337DS belongs to Vishay's TrenchFET® P-channel MOSFET family, engineered for high-voltage industrial and automotive power control where compact size, avalanche tolerance, and gate-drive simplicity are critical.
FAQ
What is the maximum continuous drain current for SI2337DS-T1-GE3 at 70 °C case temperature?
The maximum continuous drain current for SI2337DS-T1-GE3 is -1.75 A at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This reflects thermal derating due to reduced heat dissipation capability at elevated case temperatures, and must be applied in designs where ambient or PCB heating raises the SOT-23 package temperature above 25 °C. SI2337DS-T1-GE3 maintains safe operation within its 150 °C junction limit under these conditions when used with appropriate copper area.
Does SI2337DS-T1-GE3 support gate drive from a 3.3 V microcontroller?
Yes, SI2337DS-T1-GE3 is fully compatible with 3.3 V logic-level gate drive. Its gate threshold voltage range of -2 V to -4 V ensures strong turn-on at VGS = -3.3 V, and its RDS(on) is guaranteed at VGS = -6 V (0.303 Ω max), well within reach of buffered 3.3 V outputs. SI2337DS-T1-GE3 delivers predictable performance without requiring level shifters or charge pumps in most embedded applications.
What is the body diode forward voltage of SI2337DS-T1-GE3 at 0.63 A?
The body diode forward voltage (VSD) of SI2337DS-T1-GE3 is specified as -0.8 V to -1.2 V at IS = 0.63 A and TJ = 25 °C. This low forward drop enables efficient freewheeling in buck converters and reverse-current blocking in battery circuits. SI2337DS-T1-GE3 exhibits minimal temperature coefficient in this parameter, maintaining consistent behavior across its -55 °C to +150 °C operating range.
Can SI2337DS-T1-GE3 be used in avalanche mode repeatedly?
No, SI2337DS-T1-GE3 is rated for single-pulse avalanche only (EAS = 6 mJ, IAS = 11 A). Repetitive avalanche operation is not characterized or guaranteed, and repeated exposure may degrade reliability or cause parametric shift. SI2337DS-T1-GE3 should be used with snubbers, clamps, or layout techniques that prevent repetitive inductive energy dumping into the device. For repetitive avalanche applications, a dedicated avalanche-rated MOSFET is required.
What is the thermal resistance from junction to ambient for SI2337DS-T1-GE3 on a standard PCB?
The maximum junction-to-ambient thermal resistance (RthJA) for SI2337DS-T1-GE3 is 166 °C/W when mounted on a 1" × 1" FR4 board with 1 oz copper, per the datasheet note. The typical value is 120 °C/W under the same conditions. SI2337DS-T1-GE3 requires careful thermal design: for example, at 0.76 W dissipation (its PD rating at TA = 25 °C), junction temperature rise could reach 126 °C-well within its 150 °C limit but demanding adequate copper pour.
SI2337DS-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.2A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 270mOhm @ 1.2A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 500 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 760mW (Ta), 2.5W (Tc)
- Operating Temperature:
- -50°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-3 (TO-236)
SI2337DS-T1-GE3 FAQ
1.How can I place an order for SI2337DS-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI2337DS-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI2337DS-T1-GE3 reliable?
The price and inventory of SI2337DS-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI2337DS-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI2337DS-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI2337DS-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI2337DS-T1-GE3?
SI2337DS-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI2337DS-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI2337DS-T1-GE3?
For technical support, including SI2337DS-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI2337DS-T1-GE3 requirements.
6.How does Aetrix verify that SI2337DS-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI2337DS-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI2337DS-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI2337DS-T1-GE3?
All SI2337DS-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI2337DS-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI2337DS-T1-GE3 part is unused and in its original packaging.
Return procedure for SI2337DS-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI2337DS-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

