Vishay Siliconix SI4190BDY-T1-GE3
- Part No.:
- SI4190BDY-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI4190BDY-T1-GE3.pdf
- Description:
- N-CHANNEL 100 V (D-S) MOSFET SO-
- Quantity:
- Payment:

- Shipping:

Inventory:8,858
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI4190BDY-T1-GE3 from Vishay Siliconix is an N-channel 100 V (D-S) TrenchFET® Gen IV power MOSFET in SO-8 package, rated for 17 A continuous drain current at TC = 25 °C, with RDS(on) of 7.7 mΩ at VGS = 10 V and 8.4 mΩ at VGS = 4.5 V, optimized for synchronous rectification and DC/DC converter primary-side switching.
For engineers reviewing the SI4190BDY-T1-GE3 datasheet, SI4190BDY-T1-GE3 pinout, SI4190BDY-T1-GE3 application, or SI4190BDY-T1-GE3 equivalent, key selection criteria include logic-level gate drive capability, low RDS(on) × Qg and RDS(on) × Qoss figures-of-merit, 100 % Rg and UIS testing, and thermal performance under high-frequency switching in compact power stages.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve enhanced conduction efficiency and fast switching dynamics. Its gate threshold voltage (1–2.5 V) enables direct interfacing with 3.3 V and 5 V logic controllers, while its low output charge (Qoss = 39.5 pF) and reverse transfer capacitance (Crss = 14 pF) reduce switching losses in hard-switched topologies.
The device features a single N-channel configuration with integrated body diode (VSD = 0.74–1.1 V at IS = 5 A), reverse recovery time trr = 39–78 ns, and avalanche-rated ruggedness (EAS = 45 mJ, IAS = 30 A), supporting reliable operation in inductive load switching and energy-recycling circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 100 V - supports input rails up to 48 V nominal DC/DC converters with margin for transients |
| RDS(on) @ 10 V | 7.7 mΩ typ - enables <1 W conduction loss at 10 A, critical for high-efficiency 12–48 V systems |
| RDS(on) @ 4.5 V | 8.4 mΩ typ - ensures full enhancement with standard logic-level drivers without level-shifting |
| Qg @ 10 V | 62 nC typ - balances gate drive strength and switching speed for 100–500 kHz operation |
| Qoss | 39.5 pF - minimizes capacitive turn-off loss and improves light-load efficiency in resonant topologies |
| PD @ TC = 25 °C | 8.4 W - allows >15 A pulsed current handling with external heatsinking on FR4 PCB |
| RthJC | 16 °C/W max - enables thermal coupling to copper pour or heatsink for sustained 10–12 A operation |
Pinout & Package
SO-8 (narrow-body, JEDEC MS-012), surface-mount package with exposed drain paddle for thermal and electrical connection. Dimensions: 4.9 mm × 6.0 mm × 1.55 mm (D × H × A), lead pitch 1.27 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, S | Source | Common source node; pins 1–3 internally bonded to source metallization and drain paddle ground plane |
| 4 | Gate | Control terminal; requires ≤20 V gate-source swing; logic-level compatible down to 4.5 V |
| 5, 6, 7, 8, D | Drain | High-side switch node; pins 5–8 and exposed bottom paddle form low-inductance drain path |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen IV architecture | Delivers industry-leading RDS(on) × Qg FOM for reduced total switching + conduction loss in high-frequency SMPS |
| 100 % Rg tested | Ensures consistent gate resistance (0.3–1.5 Ω) across production lots, critical for predictable turn-on timing |
| 100 % UIS tested | Guarantees unclamped inductive switching robustness up to 30 A and 45 mJ, eliminating need for external snubbers |
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V, enabling direct drive from microcontrollers and PWM ICs without gate drivers |
| Lead (Pb)-free and halogen-free | Complies with RoHS 2011/65/EU and Vishay's Green Standard (Doc. #99912) |
Applications
| Synchronous Rectifier | Primary-Side Switch |
|---|---|
Use Scenario: Secondary-side synchronous rectification in isolated 12 V/48 V DC/DC converters for telecom and server PSUs. IC Role / Device Role / Timing Role: Low-side N-channel switch replacing Schottky diode; driven by transformer-coupled or controller-synchronized gate signal. Use Value: Reduces forward voltage drop from ~0.5 V to <0.01 V at 10 A, improving conversion efficiency by 2–4 % over wide load range. | Use Scenario: High-side main switch in non-isolated buck converters for industrial motor drives and LED lighting. IC Role / Device Role / Timing Role: Primary power switch controlled by PWM controller; handles full input voltage and load current. Use Value: Low RDS(on) and Qoss enable >95 % peak efficiency at 200 kHz, with minimal thermal derating on 1" × 1" FR4 board. |
| DC/DC Converter | Motor Drive Switch |
Use Scenario: Input-stage high-side switch in 48 V automotive DC/DC modules powering ADAS ECUs and infotainment systems. IC Role / Device Role / Timing Role: Main switching element in buck or half-bridge topology; subjected to repetitive 100 V transients and high di/dt. Use Value: Avalanche rating (IAS = 30 A, EAS = 45 mJ) prevents failure during load dump or short-circuit events without added protection. | Use Scenario: H-bridge low-side switch in 24 V brushed DC motor control for HVAC actuators and power seats. IC Role / Device Role / Timing Role: PWM-controlled current sink; commutates motor winding current with fast fall time (tf = 5–10 ns). Use Value: Fast switching (td(off) = 35–72 ns) and low Qgd (5.5 nC) minimize shoot-through risk and dead-time losses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7470PBF | RDS(on) = 10.5 mΩ @ 10 V; Qg = 42 nC; SO-8 package; no UIS rating specified | Lacks avalanche ruggedness verification; higher conduction loss at same current | Acceptable where transient stress is low and layout allows higher RDS(on) trade-off |
| STL100N10F7 | RDS(on) = 7.5 mΩ @ 10 V; Qg = 52 nC; TO-220FP package; 100 V rating | Larger through-hole package; higher thermal resistance (RthJC = 2.5 °C/W) but higher PD (60 W) | Preferred for higher-power, lower-frequency designs requiring greater heatsinking headroom |
Compared with IRF7470PBF and STL100N10F7, SI4190BDY-T1-GE3 offers superior RDS(on) × Qoss optimization and factory-verified UIS performance in a compact SO-8 footprint-making it ideal for space-constrained, high-reliability 100 V switching applications demanding both efficiency and ruggedness.
Availability
SI4190BDY-T1-GE3 is available at Aetrix Electronics and suitable for synchronous rectification, primary-side switching, and motor drive applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and automotive-grade programs.
Supply support for SI4190BDY-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, efficiency, and miniaturization.
The SI4190BDY-T1-GE3 belongs to Vishay's TrenchFET® Gen IV power MOSFET family, engineered specifically for high-frequency, high-efficiency DC/DC conversion and motor control in space- and thermally-constrained environments.
FAQ
What is the maximum continuous drain current rating for SI4190BDY-T1-GE3 at TC = 70 °C?
The SI4190BDY-T1-GE3 has a maximum continuous drain current ID of 13.6 A at case temperature TC = 70 °C, per its Absolute Maximum Ratings table. This value reflects thermal derating from the 17 A rating at TC = 25 °C and must be validated against actual board layout, copper area, and airflow conditions in the final design using the provided RthJC and RthJA data.
Does SI4190BDY-T1-GE3 support logic-level gate drive, and what is its VGS(th) range?
Yes, SI4190BDY-T1-GE3 supports logic-level gate drive with a gate-source threshold voltage VGS(th) ranging from 1.0 V to 2.5 V at TJ = 25 °C and ID = 250 μA. This allows full enhancement at VGS = 4.5 V, making it compatible with standard 3.3 V and 5 V microcontroller outputs without external level-shifting circuitry.
Is SI4190BDY-T1-GE3 qualified for avalanche energy handling, and what are the rated values?
Yes, SI4190BDY-T1-GE3 is 100 % UIS tested and rated for single-pulse avalanche energy EAS = 45 mJ and single-pulse avalanche current IAS = 30 A (L = 0.1 mH). These values are measured under standardized test conditions and confirm ruggedness against inductive switching stress in real-world motor and converter applications.
What is the thermal resistance from junction to case (RthJC) for SI4190BDY-T1-GE3, and how does it impact heatsinking?
The maximum junction-to-case thermal resistance RthJC for SI4190BDY-T1-GE3 is 21 °C/W, with a typical value of 16 °C/W. This low value enables effective heat transfer from the die to the PCB copper pour or external heatsink via the exposed drain paddle, supporting sustained operation at >10 A when mounted on ≥1" × 1" FR4 with 2 oz copper and thermal vias.
How does the body diode performance of SI4190BDY-T1-GE3 compare to standard Schottky diodes in synchronous rectification?
The SI4190BDY-T1-GE3 body diode has a forward voltage VSD = 0.74–1.1 V at IS = 5 A and reverse recovery time trr = 39–78 ns. While higher VSD than Schottky diodes, its fast trr and low Qrr (68–136 nC) minimize reverse recovery loss-especially when actively commutated-and its integration eliminates discrete component count and layout parasitics in synchronous rectifier designs.
SI4190BDY-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta), 17A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 9.3mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 95 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4150 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 8.4W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
SI4190BDY-T1-GE3 FAQ
1.How can I place an order for SI4190BDY-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI4190BDY-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI4190BDY-T1-GE3 reliable?
The price and inventory of SI4190BDY-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4190BDY-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI4190BDY-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4190BDY-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI4190BDY-T1-GE3?
SI4190BDY-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI4190BDY-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI4190BDY-T1-GE3?
For technical support, including SI4190BDY-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4190BDY-T1-GE3 requirements.
6.How does Aetrix verify that SI4190BDY-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI4190BDY-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4190BDY-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI4190BDY-T1-GE3?
All SI4190BDY-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4190BDY-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI4190BDY-T1-GE3 part is unused and in its original packaging.
Return procedure for SI4190BDY-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI4190BDY-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

