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Vishay Siliconix SI4190BDY-T1-GE3

Part No.:
SI4190BDY-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSI4190BDY-T1-GE3.pdf
Description:
N-CHANNEL 100 V (D-S) MOSFET SO-
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,858

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Product details

Overview

SI4190BDY-T1-GE3 from Vishay Siliconix is an N-channel 100 V (D-S) TrenchFET® Gen IV power MOSFET in SO-8 package, rated for 17 A continuous drain current at TC = 25 °C, with RDS(on) of 7.7 mΩ at VGS = 10 V and 8.4 mΩ at VGS = 4.5 V, optimized for synchronous rectification and DC/DC converter primary-side switching.

For engineers reviewing the SI4190BDY-T1-GE3 datasheet, SI4190BDY-T1-GE3 pinout, SI4190BDY-T1-GE3 application, or SI4190BDY-T1-GE3 equivalent, key selection criteria include logic-level gate drive capability, low RDS(on) × Qg and RDS(on) × Qoss figures-of-merit, 100 % Rg and UIS testing, and thermal performance under high-frequency switching in compact power stages.

Technical Context

This MOSFET employs trench-gate silicon technology to achieve enhanced conduction efficiency and fast switching dynamics. Its gate threshold voltage (1–2.5 V) enables direct interfacing with 3.3 V and 5 V logic controllers, while its low output charge (Qoss = 39.5 pF) and reverse transfer capacitance (Crss = 14 pF) reduce switching losses in hard-switched topologies.

The device features a single N-channel configuration with integrated body diode (VSD = 0.74–1.1 V at IS = 5 A), reverse recovery time trr = 39–78 ns, and avalanche-rated ruggedness (EAS = 45 mJ, IAS = 30 A), supporting reliable operation in inductive load switching and energy-recycling circuits.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max100 V - supports input rails up to 48 V nominal DC/DC converters with margin for transients
RDS(on) @ 10 V7.7 mΩ typ - enables <1 W conduction loss at 10 A, critical for high-efficiency 12–48 V systems
RDS(on) @ 4.5 V8.4 mΩ typ - ensures full enhancement with standard logic-level drivers without level-shifting
Qg @ 10 V62 nC typ - balances gate drive strength and switching speed for 100–500 kHz operation
Qoss39.5 pF - minimizes capacitive turn-off loss and improves light-load efficiency in resonant topologies
PD @ TC = 25 °C8.4 W - allows >15 A pulsed current handling with external heatsinking on FR4 PCB
RthJC16 °C/W max - enables thermal coupling to copper pour or heatsink for sustained 10–12 A operation

Pinout & Package

SO-8 (narrow-body, JEDEC MS-012), surface-mount package with exposed drain paddle for thermal and electrical connection. Dimensions: 4.9 mm × 6.0 mm × 1.55 mm (D × H × A), lead pitch 1.27 mm.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, SSourceCommon source node; pins 1–3 internally bonded to source metallization and drain paddle ground plane
4GateControl terminal; requires ≤20 V gate-source swing; logic-level compatible down to 4.5 V
5, 6, 7, 8, DDrainHigh-side switch node; pins 5–8 and exposed bottom paddle form low-inductance drain path

Key Features

FeatureDesign Value
TrenchFET® Gen IV architectureDelivers industry-leading RDS(on) × Qg FOM for reduced total switching + conduction loss in high-frequency SMPS
100 % Rg testedEnsures consistent gate resistance (0.3–1.5 Ω) across production lots, critical for predictable turn-on timing
100 % UIS testedGuarantees unclamped inductive switching robustness up to 30 A and 45 mJ, eliminating need for external snubbers
Logic-level gate driveOperates fully enhanced at VGS ≥ 4.5 V, enabling direct drive from microcontrollers and PWM ICs without gate drivers
Lead (Pb)-free and halogen-freeComplies with RoHS 2011/65/EU and Vishay's Green Standard (Doc. #99912)

Applications

Synchronous RectifierPrimary-Side Switch

Use Scenario: Secondary-side synchronous rectification in isolated 12 V/48 V DC/DC converters for telecom and server PSUs.

IC Role / Device Role / Timing Role: Low-side N-channel switch replacing Schottky diode; driven by transformer-coupled or controller-synchronized gate signal.

Use Value: Reduces forward voltage drop from ~0.5 V to <0.01 V at 10 A, improving conversion efficiency by 2–4 % over wide load range.

Use Scenario: High-side main switch in non-isolated buck converters for industrial motor drives and LED lighting.

IC Role / Device Role / Timing Role: Primary power switch controlled by PWM controller; handles full input voltage and load current.

Use Value: Low RDS(on) and Qoss enable >95 % peak efficiency at 200 kHz, with minimal thermal derating on 1" × 1" FR4 board.

DC/DC ConverterMotor Drive Switch

Use Scenario: Input-stage high-side switch in 48 V automotive DC/DC modules powering ADAS ECUs and infotainment systems.

IC Role / Device Role / Timing Role: Main switching element in buck or half-bridge topology; subjected to repetitive 100 V transients and high di/dt.

Use Value: Avalanche rating (IAS = 30 A, EAS = 45 mJ) prevents failure during load dump or short-circuit events without added protection.

Use Scenario: H-bridge low-side switch in 24 V brushed DC motor control for HVAC actuators and power seats.

IC Role / Device Role / Timing Role: PWM-controlled current sink; commutates motor winding current with fast fall time (tf = 5–10 ns).

Use Value: Fast switching (td(off) = 35–72 ns) and low Qgd (5.5 nC) minimize shoot-through risk and dead-time losses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7470PBFRDS(on) = 10.5 mΩ @ 10 V; Qg = 42 nC; SO-8 package; no UIS rating specifiedLacks avalanche ruggedness verification; higher conduction loss at same currentAcceptable where transient stress is low and layout allows higher RDS(on) trade-off
STL100N10F7RDS(on) = 7.5 mΩ @ 10 V; Qg = 52 nC; TO-220FP package; 100 V ratingLarger through-hole package; higher thermal resistance (RthJC = 2.5 °C/W) but higher PD (60 W)Preferred for higher-power, lower-frequency designs requiring greater heatsinking headroom

Compared with IRF7470PBF and STL100N10F7, SI4190BDY-T1-GE3 offers superior RDS(on) × Qoss optimization and factory-verified UIS performance in a compact SO-8 footprint-making it ideal for space-constrained, high-reliability 100 V switching applications demanding both efficiency and ruggedness.

Availability

SI4190BDY-T1-GE3 is available at Aetrix Electronics and suitable for synchronous rectification, primary-side switching, and motor drive applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and automotive-grade programs.

Supply support for SI4190BDY-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, efficiency, and miniaturization.

The SI4190BDY-T1-GE3 belongs to Vishay's TrenchFET® Gen IV power MOSFET family, engineered specifically for high-frequency, high-efficiency DC/DC conversion and motor control in space- and thermally-constrained environments.

FAQ

What is the maximum continuous drain current rating for SI4190BDY-T1-GE3 at TC = 70 °C?

The SI4190BDY-T1-GE3 has a maximum continuous drain current ID of 13.6 A at case temperature TC = 70 °C, per its Absolute Maximum Ratings table. This value reflects thermal derating from the 17 A rating at TC = 25 °C and must be validated against actual board layout, copper area, and airflow conditions in the final design using the provided RthJC and RthJA data.

Does SI4190BDY-T1-GE3 support logic-level gate drive, and what is its VGS(th) range?

Yes, SI4190BDY-T1-GE3 supports logic-level gate drive with a gate-source threshold voltage VGS(th) ranging from 1.0 V to 2.5 V at TJ = 25 °C and ID = 250 μA. This allows full enhancement at VGS = 4.5 V, making it compatible with standard 3.3 V and 5 V microcontroller outputs without external level-shifting circuitry.

Is SI4190BDY-T1-GE3 qualified for avalanche energy handling, and what are the rated values?

Yes, SI4190BDY-T1-GE3 is 100 % UIS tested and rated for single-pulse avalanche energy EAS = 45 mJ and single-pulse avalanche current IAS = 30 A (L = 0.1 mH). These values are measured under standardized test conditions and confirm ruggedness against inductive switching stress in real-world motor and converter applications.

What is the thermal resistance from junction to case (RthJC) for SI4190BDY-T1-GE3, and how does it impact heatsinking?

The maximum junction-to-case thermal resistance RthJC for SI4190BDY-T1-GE3 is 21 °C/W, with a typical value of 16 °C/W. This low value enables effective heat transfer from the die to the PCB copper pour or external heatsink via the exposed drain paddle, supporting sustained operation at >10 A when mounted on ≥1" × 1" FR4 with 2 oz copper and thermal vias.

How does the body diode performance of SI4190BDY-T1-GE3 compare to standard Schottky diodes in synchronous rectification?

The SI4190BDY-T1-GE3 body diode has a forward voltage VSD = 0.74–1.1 V at IS = 5 A and reverse recovery time trr = 39–78 ns. While higher VSD than Schottky diodes, its fast trr and low Qrr (68–136 nC) minimize reverse recovery loss-especially when actively commutated-and its integration eliminates discrete component count and layout parasitics in synchronous rectifier designs.

SI4190BDY-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
12A (Ta), 17A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
9.3mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
95 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4150 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
3.8W (Ta), 8.4W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

SI4190BDY-T1-GE3 FAQ

1.How can I place an order for SI4190BDY-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI4190BDY-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI4190BDY-T1-GE3 reliable?

The price and inventory of SI4190BDY-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4190BDY-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SI4190BDY-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4190BDY-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI4190BDY-T1-GE3?

SI4190BDY-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI4190BDY-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI4190BDY-T1-GE3?

For technical support, including SI4190BDY-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4190BDY-T1-GE3 requirements.

6.How does Aetrix verify that SI4190BDY-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SI4190BDY-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4190BDY-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SI4190BDY-T1-GE3?

All SI4190BDY-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4190BDY-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI4190BDY-T1-GE3 part is unused and in its original packaging.

Return procedure for SI4190BDY-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SI4190BDY-T1-GE3 Tags

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