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Vishay Siliconix SIC780ACD-T1-GE3

Part No.:
SIC780ACD-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
PowerPAK® MLP66-40
Datasheet:
AetrixSIC780ACD-T1-GE3.pdf
Description:
IC HALF BRIDGE DRIVER 50A PPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,925

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Product details

Overview

SIC780ACD-T1-GE3 from Vishay Siliconix is a 3.3 V logic-compatible integrated DrMOS power stage for high-current synchronous buck converters, delivering >50 A per phase with 93 % peak efficiency at 12 V input and 1.2 V output, featuring adaptive dead-time control, thermal warning (THDN), and diode emulation mode (SMOD) for light-load optimization in CPU/GPU VRDs.

For engineers reviewing the SIC780ACD-T1-GE3 datasheet, SIC780ACD-T1-GE3 pinout, SIC780ACD-T1-GE3 application, or SIC780ACD-T1-GE3 equivalent, key selection considerations include 3.3 V PWM logic compatibility, Tri-state PWM support, 20 ns max. propagation delay, thermal shutdown flag behavior at 160 °C, and compliance with Intel DrMOS 4.0 specification.

Technical Context

The SIC780ACD-T1-GE3 integrates high- and low-side TrenchFET Gen III MOSFETs with an on-die gate driver supporting 3.3 V logic, adaptive shoot-through protection, and bootstrap Schottky diode - enabling operation up to 1 MHz switching frequency while maintaining <20 ns PWM propagation delay and 1 V adaptive dead-time threshold detection.

Its dual-ground architecture separates PGND (high-current return) from CGND (control reference), with internal 20.2 kΩ GH–PHASE discharge resistor and VCIN/VDRV supply separation via external resistor for noise isolation - all housed in a thermally enhanced PowerPAK MLP6x6-40L package with 2.5 °C/W junction-to-case thermal resistance.

Key Specifications

ParameterValue and Actual Design Meaning
Continuous Current>50 A per phase - supports multi-phase CPU/GPU voltage regulator designs without external current sharing circuitry
Peak Efficiency93 % at VIN = 12 V, VOUT = 1.2 V - reduces thermal load and improves POL module power density
PWM Logic Level3.3 V compatible (Vth_r = 2.4 V typ., Vth_f = 0.9 V typ.) - interfaces directly with modern VR controllers without level-shifting
Max. Switching Frequency1 MHz - enables compact filter design with sub-μH inductors and low-ESR ceramic output capacitors
Thermal Warning Threshold160 °C set / 135 °C clear (25 °C hysteresis) - provides early overtemperature alert for system-level thermal management
Propagation Delay<20 ns (Tri-state to GH/GL) - preserves tight timing margins in high-frequency, multi-phase interleaved control
UVLO Threshold3.7 V (rising), 3.2 V (falling) - ensures robust startup and graceful shutdown under brownout conditions

Pinout & Package

Package: PowerPAK® MLP66-40L (6 mm × 6 mm, 40-terminal, exposed thermal pad P3/VSWH).

Pin/TerminalCircuit RoleDesign Meaning
1 (SMOD#)Diode emulation mode enableActive-low input that disables low-side FET to reduce light-load switching losses; internal pull-up to VCIN
2 (VCIN)Control logic supplyBias rail for driver IC logic; UVLO protected (3.7 V turn-on); 100–300 μA quiescent current
3 (VDRV)Gate driver supplySeparate 4.5–5.5 V rail for high-current gate drive; decoupled from VCIN to suppress noise coupling
4 (BOOT)High-side bootstrap nodeConnects to external capacitor and PHASE pin; integrated Schottky diode eliminates external diode
5, 37, P1 (CGND)Analog ground referenceLow-noise reference for driver logic; must be externally tied to PGND with minimal inductance (<0.5 V transient delta)
6 (GH)High-side gate drive outputDrives HS MOSFET gate; includes internal 20.2 kΩ discharge path to PHASE when VCIN = 0
7 (PHASE)Switch node returnInternally connected to VSWH; dedicated return for BOOT capacitor; not for power routing
8–14, P2 (VIN)High-side drain inputConnects to 4.5–18 V intermediate bus; multiple pins reduce IR drop and thermal resistance
15, 29–35, P3 (VSWH)Phase node outputMain PWM output node; exposed thermal pad (P3) provides 2.5 °C/W junction-to-case path
16–28 (PGND)Power ground returnHigh-current return for both MOSFETs; requires low-inductance PCB copper pour tied to CGND
36 (GL)Low-side gate drive outputDrives LS MOSFET gate; disabled during SMOD# active or DSBL# asserted
38 (THDN)Thermal shutdown flagOpen-drain output pulled to VCIN via ≤20 kΩ; asserts at 160 °C, clears at 135 °C
39 (DSBL#)Global disableActive-low shutdown; internal pull-down ensures safe default state if left floating
40 (PWM)3.3 V logic inputAccepts Tri-state (H/L/Z) or two-state PWM; hysteresis prevents false triggering during transitions

Key Features

FeatureDesign Value
Integrated TrenchFET Gen III MOSFETsOptimized for 12 V input stage with reduced RDS(on) and Qg, enabling >50 A continuous current without external heatsink
Adaptive Dead-Time Control (AST)Monitors GH/GL gate voltages in real time and enforces ≥1 V off-threshold before turn-on, eliminating shoot-through across load/temperature
Tri-State PWM CompatibilitySupports controller high-impedance shutdown mode with 150 ns hold-off timer to prevent inductor ringing and negative VOUT swing
Diode Emulation Mode (SMOD)Disables GL during light load to eliminate reverse conduction loss in synchronous rectification, improving efficiency below 5 A
Intel DrMOS 4.0 ComplianceFully meets specification for timing, logic thresholds, thermal flag behavior, and functional safety requirements for server/desktop CPU VR applications

Applications

Server CPU Voltage RegulationGPU Power Delivery

Use Scenario: Multi-phase buck converter supplying core voltage to high-performance Xeon or EPYC processors under dynamic 50–300 A load transients.

IC Role / Device Role / Timing Role: Per-phase DrMOS power stage executing high-frequency (up to 1 MHz), tightly synchronized PWM switching with adaptive dead-time to maintain regulation during rapid dI/dt events.

Use Value: 93 % peak efficiency and 2.5 °C/W thermal resistance enable dense, air-cooled VRM layouts without compromising transient response or thermal margin.

Use Scenario: Discrete-phase power delivery to NVIDIA A100 or AMD MI300 GPU cores requiring fast load-step response and precise voltage accuracy.

IC Role / Device Role / Timing Role: Integrated gate driver + MOSFET pair providing sub-20 ns propagation delay and Tri-state PWM support for seamless phase shedding during idle states.

Use Value: SMOD logic reduces light-load power loss by disabling low-side FET, extending battery life in mobile workstations and lowering fan noise in datacenter accelerators.

Memory Subsystem POLAI Accelerator DC/DC Module

Use Scenario: Point-of-load regulation for DDR5 memory modules operating at 1.1 V with strict ripple and transient requirements.

IC Role / Device Role / Timing Role: High-density DrMOS stage delivering stable 50 A per phase with minimal layout area, leveraging MLP6x6-40L's thermal pad for direct PCB heat spreading.

Use Value: 3.3 V PWM interface eliminates level shifters, reducing BOM count and signal integrity risk in space-constrained DIMM PCBs.

Use Scenario: Compact, high-efficiency DC/DC module powering ASIC-based AI inference engines with burst-mode workloads.

IC Role / Device Role / Timing Role: DrMOS building block in modular VRM design, using THDN flag for predictive thermal throttling and DSBL# for coordinated phase disable across multi-rail systems.

Use Value: Compliant with Intel DrMOS 4.0 ensures interoperability with industry-standard PMBus-enabled controllers and telemetry firmware stacks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DrMOS power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SiC780CD-T1-GE35 V PWM logic thresholds (Vth_r = 3.7 V), no 3.3 V compatibility; identical package, pinout, and thermal specsRequires 5 V VR controller interface; unsuitable for 3.3 V logic systems without level translationSelect only when legacy 5 V PWM controllers are used; otherwise SIC780ACD-T1-GE3 avoids external level-shifting components
IR35201MTRPBFStandalone DrMOS controller (no integrated MOSFETs); requires external high/low-side FETs and discrete bootstrap circuitGreater design flexibility but larger footprint, higher component count, and increased layout complexityChoose for custom FET selection or ultra-high-efficiency tuning; SIC780ACD-T1-GE3 offers faster time-to-market with validated performance

Compared with SiC780CD-T1-GE3, SIC780ACD-T1-GE3 enables direct interfacing with 3.3 V VR controllers without level shifters, while versus IR35201MTRPBF it delivers lower system-level BOM cost and smaller PCB area by integrating MOSFETs, gate driver, and bootstrap diode in one MLP6x6-40L package.

Availability

SIC780ACD-T1-GE3 is available at Aetrix Electronics and suitable for server CPU voltage regulation, GPU power delivery, and memory subsystem POL applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and datacenter deployments.

Supply support for SIC780ACD-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors and power ICs, specializing in high-efficiency, high-reliability power management solutions for computing, industrial, and automotive markets.

The SiC780 family is part of Vishay's DrMOS product line, engineered specifically for high-current, high-frequency synchronous buck conversion in next-generation CPU, GPU, and AI accelerator voltage regulator modules compliant with Intel DrMOS 4.0.

FAQ

What is the PWM logic voltage compatibility of the SIC780ACD-T1-GE3?

The SIC780ACD-T1-GE3 is specifically designed for 3.3 V logic systems, with PWM rising threshold of 2.4 V (typical) and falling threshold of 0.9 V (typical). This allows direct connection to modern VR controllers without level-shifting circuitry. The SIC780ACD-T1-GE3 differs from the 5 V-compatible SiC780CD-T1-GE3, making correct logic-level matching essential for reliable operation.

How does the SMOD# pin improve light-load efficiency in the SIC780ACD-T1-GE3?

When SMOD# is driven low, the SIC780ACD-T1-GE3 disables the low-side MOSFET (GL), converting the synchronous buck into a non-synchronous configuration. This eliminates reverse conduction losses during discontinuous conduction mode (DCM), significantly improving efficiency below ~5 A output current. The SIC780ACD-T1-GE3 implements this function with internal logic that ensures clean turn-off without shoot-through.

What thermal protection features does the SIC780ACD-T1-GE3 provide?

The SIC780ACD-T1-GE3 includes an open-drain THDN pin that asserts at 160 °C junction temperature and clears at 135 °C, providing 25 °C hysteresis. It does not autonomously shut down - instead, it signals external thermal management circuitry. The SIC780ACD-T1-GE3 also features a low 2.5 °C/W junction-to-case thermal resistance via its exposed P3 (VSWH) thermal pad, enabling efficient PCB-based heat dissipation.

Is the SIC780ACD-T1-GE3 pin-compatible with other DrMOS devices?

The SIC780ACD-T1-GE3 uses the standard PowerPAK MLP66-40L package and shares identical pinout with SiC780CD-T1-GE3, including VIN, VSWH, PGND, and PWM assignments. However, it is not pin-compatible with non-Vishay DrMOS devices such as IR35201MTRPBF, which is a controller-only IC requiring external FETs and different pin functions. Always verify logic thresholds and timing before substitution.

What is the maximum recommended switching frequency for the SIC780ACD-T1-GE3?

The SIC780ACD-T1-GE3 supports operation up to 1 MHz, as confirmed by its electrical specifications and typical application waveforms. At this frequency, the SIC780ACD-T1-GE3 maintains <20 ns propagation delay and stable adaptive dead-time control. Performance above 1 MHz is not characterized and may degrade efficiency or cause timing violations due to gate drive limitations.

SIC780ACD-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
PowerPAK® MLP66-40
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Output Configuration:
Half Bridge
Applications:
Synchronous Buck Converters
Interface:
PWM
Load Type:
Inductive
Technology:
DrMOS
Rds On (Typ):
-
Current - Output / Channel:
50A
Current - Peak Output:
-
Voltage - Supply:
4.5V ~ 5.5V
Voltage - Load:
4.5V ~ 18V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit, Diode Emulation, Status Flag
Fault Protection:
Over Temperature, Shoot-Through, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® MLP66-40

SIC780ACD-T1-GE3 FAQ

1.How can I place an order for SIC780ACD-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIC780ACD-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIC780ACD-T1-GE3 reliable?

The price and inventory of SIC780ACD-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIC780ACD-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIC780ACD-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIC780ACD-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIC780ACD-T1-GE3?

SIC780ACD-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIC780ACD-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIC780ACD-T1-GE3?

For technical support, including SIC780ACD-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIC780ACD-T1-GE3 requirements.

6.How does Aetrix verify that SIC780ACD-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIC780ACD-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIC780ACD-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIC780ACD-T1-GE3?

All SIC780ACD-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIC780ACD-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIC780ACD-T1-GE3 part is unused and in its original packaging.

Return procedure for SIC780ACD-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIC780ACD-T1-GE3 Tags

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