Infineon Technologies IRSM005-301MHTR

Overview

IRSM005-301MHTR from Infineon Technologies (formerly International Rectifier) is a half-bridge intelligent power module integrating two 100V, 30A MOSFETs and a high- and low-side gate driver in a single 7×8 mm PQFN package. It delivers 16 mΩ typical R_DS(ON), supports 10–20 V gate drive supply, and features independent logic-compatible inputs (3.3/5/15 V), undervoltage lockout on both V_CC and V_BS, and matched propagation delay for motor control timing integrity. Used in compact dc-dc converters and BLDC motor drives.

For engineers reviewing the IRSM005-301MHTR datasheet, IRSM005-301MHTR pinout, IRSM005-301MHTR application, or IRSM005-301MHTR equivalent, key selection criteria include its 100 V blocking voltage, 30 A continuous current rating per FET, thermal resistance of 3.8 °C/W (junction-to-pad), bootstrap-capable high-side drive, and industrial-grade qualification per JEDEC JESD47E and MSL3.

Technical Context

This half-bridge IPM implements a self-contained high-side/low-side switching stage with integrated level-shifted gate drivers and protection circuitry. Its dual-MOSFET topology supports complementary PWM control via separate HIN/LIN inputs, with built-in shoot-through prevention logic and dead-time compatibility down to 0.3 µs.

The module uses bootstrap-based high-side gate drive requiring external capacitor between VB and VS pins, enabling operation up to 100 V DC bus. Undervoltage lockout thresholds are 8.9 V (typ.) for both V_CC and V_BS, with 0.8 V hysteresis, ensuring robust start-up and fault recovery under varying supply conditions.

Key Specifications

Pinout & Package

Package: PQFN 7×8 mm with exposed thermal pad (Pin 28, connected to COM). Surface-mount, leadless design optimized for low-inductance layout and high-power density.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge power module applications.

Compared with IRS2005STRPBF and FAN7382MX, IRSM005-301MHTR provides higher integration, lower system-level EMI due to minimized loop area, and guaranteed timing matching-making it optimal for space-constrained, high-reliability motor and converter applications where BOM count reduction is critical.

Availability

IRSM005-301MHTR is available at Aetrix Electronics and suitable for BLDC motor drives, DC-DC converters, and industrial actuator control requiring stable component supply, industrial-grade reliability, and compact 7×8 mm packaging.

Supply support for IRSM005-301MHTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with heritage from International Rectifier's power device expertise.

This part belongs to Infineon's IRSM family of intelligent power modules, designed specifically for high-power-density, medium-voltage motor control and power conversion applications demanding integrated gate drive, protection, and thermal performance.

FAQ

What is the recommended bootstrap capacitor value for IRSM005-301MHTR?

The recommended bootstrap capacitor is 0.1–1 µF ceramic, placed as close as possible to VB and VS pins. For 20 kHz switching at 50% duty cycle, a 0.22 µF X7R capacitor with ≤100 mΩ ESR ensures sufficient charge replenishment and minimizes voltage droop below the 8.9 V V_BS UVLO threshold.

Can IRSM005-301MHTR operate with 3.3 V logic inputs?

Yes. The device accepts 3.3 V logic inputs directly: HIN and LIN thresholds are 2.5 V (positive-going) and 0.8 V (negative-going), ensuring reliable recognition of 3.3 V CMOS levels without level-shifting. No external pull-ups or translators are needed for MCU or FPGA interfaces.

How is thermal performance affected if the exposed pad (Pin 28) is not soldered to PCB ground?

Leaving Pin 28 unsoldered increases R_th(J-A) from 40 °C/W to >65 °C/W, reducing maximum allowable power dissipation by ~45%. Thermal derating begins above 65°C ambient, and junction temperature may exceed 150°C under full 30 A load-risking premature failure. Soldering to ≥50 mm² copper is mandatory for rated performance.

Does IRSM005-301MHTR include internal shoot-through protection?

No. It does not feature hardware-based shoot-through prevention. Instead, it relies on external dead-time insertion (≥0.3 µs recommended) and complementary HIN/LIN logic states. The internal logic interprets simultaneous HI-HI or LO-LO as undefined; proper controller sequencing is required to avoid cross-conduction.