Infineon Technologies IRSM005-301MH

Overview

IRSM005-301MH from Infineon Technologies (formerly International Rectifier) is a half-bridge intelligent power module integrating two 100V, 30A MOSFETs and an on-chip gate driver in a 7×8 mm PQFN package. It delivers 16 mΩ typical R_DS(ON) at 25°C, supports 10–20 V gate drive supply, and features independent logic-compatible inputs (3.3/5/15 V), undervoltage lockout on both V_CC and V_BS, and matched propagation delay (<50 ns mismatch). It is deployed in compact dc-dc converters and low-voltage motor drives requiring high power density.

For engineers reviewing the IRSM005-301MH datasheet, IRSM005-301MH pinout, IRSM005-301MH application, or IRSM005-301MH equivalent, key selection criteria include its dual-MOSFET half-bridge topology, integrated bootstrap-capable high-side driver, thermal resistance of 3.8 °C/W (junction-to-pad), 100 V V_DS rating, and industrial-grade qualification per JEDEC JESD47E.

Technical Context

This module implements a self-contained half-bridge stage with separate high-side (HO/G1) and low-side (LO/G2) gate drivers referenced to floating VS and grounded COM, respectively. Its logic interface accepts active-high HIN/LIN signals with 2.5 V positive-going and 0.8 V negative-going thresholds, enabling direct connection to microcontrollers without level-shifting.

The internal driver provides matched turn-on/turn-off propagation delays (160–220 ns typ.), fast rise/fall times (70/35 ns typ.), and built-in UVLO hysteresis (0.8 V) on both V_BS and V_CC supplies - ensuring robust operation during bus transients and startup sequencing in inverter stages.

Key Specifications

Pinout & Package

The IRSM005-301MH uses a thermally enhanced 7×8 mm PQFN package with exposed thermal pad (Pin 28, connected to COM). All pins are surface-mount; no through-hole variants exist.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge power module applications.

Compared with IRSM836-024MH, the IRSM005-301MH trades current headroom for higher bus voltage tolerance; versus FAN8230MX, it reduces layout complexity and thermal management overhead at the cost of part-level customization.

Availability

IRSM005-301MH is available at Aetrix Electronics and suitable for advanced motor drives, dc-to-ac inverters, and dc-to-dc converters requiring stable component supply, industrial-grade reliability, and compact 7×8 mm power integration.

Supply support for IRSM005-301MH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control ICs, with deep expertise in silicon and wide-bandgap power devices.

The IRSM series targets highly integrated, thermally optimized half-bridge modules for space-constrained inverter and motor control applications - emphasizing reduced bill-of-materials, simplified layout, and robust industrial qualification.

FAQ

What is the maximum recommended switching frequency for IRSM005-301MH?

The device supports up to 200 kHz operation under typical thermal and layout conditions. At this frequency, bootstrap capacitor sizing must follow AN-1044 guidelines to maintain V_BS stability; measured propagation delay match (<50 ns) and fast rise/fall times (70/35 ns) ensure clean PWM fidelity without added dead-time overhead.

Can IRSM005-301MH drive a three-phase motor directly?

No - it is a single half-bridge module. Driving a three-phase motor requires three identical IRSM005-301MH units (one per phase leg), with coordinated HIN/LIN timing and shared V₊/V₋/COM connections. The VS node per module forms each phase output, and bootstrap capacitors must be individually sized per high-side channel.

Is external bootstrap diode required?

No - the internal high-side driver includes integrated bootstrap charging circuitry. Only an external ceramic bootstrap capacitor (typically 0.22–1 µF X7R) connected between VB and VS is required. No external diode is needed, reducing component count and PCB area versus discrete driver solutions.

What is the role of the exposed thermal pad (Pin 28)?

Pin 28 is the exposed copper thermal pad, which must be soldered to a large COM-referenced copper pour on the PCB. It provides the primary thermal path from die to board, contributing to the specified 3.8 °C/W R_th(J-B). Leaving it unconnected degrades thermal performance by >40% and risks thermal runaway under sustained 30 A load.